Asrock H61M/U3S3 Manual

Asrock Bundkort H61M/U3S3

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ASRock H61M/U3S3 Motherboard

No part of this installation guide may be reproduced, transcribed, transmitted, or trans-

lated in any language, in any form or by any means, except duplication of documentation

by the purchaser for backup purpose, without written consent of ASRock Inc.

Products and corporate names appearing in this guide may or may not be registered

trademarks or copyrights of their respective companies, and are used only for identiﬁ ca-

tion or explanation and to the owners’ beneﬁ t, without intent to infringe.

Speciﬁ cations and information contained in this guide are furnished for informational use

only and subject to change without notice, and should not be constructed as a commit-

ment by ASRock. ASRock assumes no responsibility for any errors or omissions that may

appear in this guide.

With respect to the contents of this guide, ASRock does not provide warranty of any kind,

either expressed or implied, including but not limited to the implied warranties or condi-

tions of merchantability or ﬁ tness for a particular purpose. In no event shall ASRock, its

directors, ofﬁ cers, employees, or agents be liable for any indirect, special, incidental, or

consequential damages (including damages for loss of proﬁ ts, loss of business, loss of

data, interruption of business and the like), even if ASRock has been advised of the pos-

sibility of such damages arising from any defect or error in the guide or product.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following

two conditions:

(1) this device may not cause harmful interference, and

(2) this device must accept any interference received, including interference that

may cause undesired operation.

CALIFORNIA, USA ONLY

The Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance

controlled in Perchlorate Best Management Practices (BMP) regulations passed by the

California Legislature. When you discard the Lithium battery in California, USA, please

follow the related regulations in advance.

“Perchlorate Material-special handling may apply, see

www.dtsc.ca.gov/hazardouswaste/perchlorate”

ASRock Website: http://www.asrock.com

Published February 2011

ASRock H61M/U3S3 Motherboard

1 Power Fan Connector (PWR_FAN1) 15 USB 2.0 Header (USB8_9, Blue)

2 1155-Pin CPU Socket 16 SATA2 Connector (SATA2_2, Blue)

3 CPU Fan Connector (CPU_FAN1) 17 SATA2 Connector (SATA2_3, Blue)

4 ATX 12V Power Connector (ATX12V1) 18 Consumer Infrared Module Header (CIR1)

5 2 x 240-pin DDR3 DIMM Slots 19 USB 2.0 Header (USB6_7, Blue)

(Dual Channel: DDR3_A1, DDR3_B1, Blue) 20 System Panel Header (PANEL1, White)

6 Chassis Speaker Header (SPEAKER 1, White) 21 Infrared Module Header (IR1)

7 ATX Power Connector (ATXPWR1) 22 Clear CMOS Jumper (CLRCMOS1)

8 SATA3 Connector (SATA3_0, White) 23 COM Port Header (COM1)

9 SATA3 Connector (SATA3_1, White) 24 Print Port Header (LPT1, White)

10 Intel H61 Chipset 25 PCI Express 2.0 p2-x1 Slot (PCIE2, White)

11 Chassis Fan Connector (CHA_FAN1) 26 Front Panel Audio Header

12 32Mb SPI Flash (HD_AUDIO1, White)

13 SATA2 Connector (SATA2_0, Blue) 27 PCI Slots (PCI1-2)

14 SATA2 Connector (SATA2_1, Blue) 28 PCI Express 2.0 p2-x16 Slot (PCIE1, Blue)

Intel

H61

H61M/U3S3

ATXPWR1

Designed in Taipei

21.8cm (8.6 in)

24.4cm (9.6 in)

DDR3_A1 (6 4 bit, 240-pin modu le)

DDR3_B1 (6 4 bit, 240-pin modu le)

Dual Channel DDR3

PCIE1

PCI1

PCI2

T op :

RJ - 45

USB 2 .0

T: U SB 4

B: USB5

PS2

Keyb o ard

VGA1

DVI_CON1

HDMI1

USB 2.0

T: U SB 0

B: US B 1

T o p :

LIN E IN

Ce nt e r :

FRO N T

Bo t to m:

MI C IN

Supe r

I/O

CMOS

Bat tery

AT X 12 V1

DX10.1

P WR_ F AN 1

CP U _F AN 1

PCI Express 2.0

ErP/EuP Ready

LAN

PH Y

HD_A UDI O1

AUDIO

CO D EC

CO M 1

RoHS

IR 1

US B6_7

CIR1

CLR CMO S 1

32 Mb

BI O S

SAT A2_ 3

SAT A3_ 1

SAT A3_ 0

HDLE D RE S E T

PL ED PW RBT N

PA N EL1

SPEA KER1

CHA _F AN 1

LP T 1

Gigabit LAN

1 2 3 4 5 6

171824 1920212223

SAT A2_ 2

PS2

Mous e

USB 3.0

T: U SB 2

B: US B 3

SAT A2_ 1

SAT A2_ 0

US B8_9

PCIE2

Produkt Specifikationer

Mærke:	Asrock
Kategori:	Bundkort
Model:	H61M/U3S3
Bredde:	244 mm
Dybde:	218 mm
Antal HDMI-porte:	1
HDCP:	Ja
Ethernet LAN-porte (RJ-45):	1
Antal USB 2.0-porte:	4
Antal USB 3.2 Gen 1 (3.1 Gen 1) type-A-porte:	2
Udgange til hovedtelefoner:	1
Lyd-output kanaler:	5.1 kanaler
Certificering:	FCC, CE, WHQL, ErP/EuP Ready
Strømkilde type:	ATX
Maksimal intern hukommelse:	16 GB
On-board grafikkort:	Ja
Mikrofonindgang:	Ja
Kompatible operativsystemer:	Windows 7 / 7 64-bit / Vista / Vista 64-bit / XP / XP 64-bit
Processorproducent:	Intel
Drivere inkluderet:	Ja
Antal VGA-porte (D-sub):	1
Ethernet-grænsefladetype:	Gigabit Ethernet
Prøvesoftware:	AntiVirus, ASRock Suite
Komponent til:	PC
Netværksfunktioner:	10/100/1000Mbps
Antal PS/2-porte:	2
Processor sokkel:	LGA 1155 (Socket H2)
PCI Express slots version:	2.0
PCI Express x16 slots:	1
Understøttelse af parallel behandlingsteknologi:	Ikke understøttet
Kompatibel processor serie:	Intel Core i3,Intel Core i5,Intel Core i7
Bundkort chipsæt:	Intel® H61
Lydchip:	Realtek ALC662
Antal hukommelsesstik:	2
Ikke-fejlkorrigerende kode:	Ja
Antal SATA III-stik:	2
LAN Kontroller:	Atheros AR8151
Hukommelseskanaler:	Dual-channel
USB 2.0-stik:	2
CPU-ventilatorstik:	Ja
Antal COM-stik:	1
ATX strømstrik (24 stikben):	Ja
Antal kabinetventilatorstik:	1
Lydstik på frontpanel:	Ja
Antal SATA II stik:	4
Antal DVI-D-porte:	1
Motherboard form faktor:	micro ATX
Maksimal grafikadapterhukommelse:	1759 MB
PCI Ekspres x1 slots:	1
BIOS-type:	AMI
BIOS-hukommelsesstørrelse:	32 Mbit
Wake-on-LAN klar:	Ja
Strømstik til ventilator:	Ja
Controller-grænsefladetype:	SATA3
PCI-slots:	2
Grafikadapter familie:	Intel
Parallelt stik:	Ja
EPS strømstik (8-pin):	Ja