Lenovo eServer BladeCenter HS22V Manual

Lenovo Server eServer BladeCenter HS22V

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High-performance blade server optimized for virtualization

Please see the Legal Information section for important notices and information. 1.

Product Guide

October 2010

IBM BladeCenter HS22V

Product Overview

CONTENTS

Product Overview 1

Selling Features 2

Key Features

Key Options 1

HS22V Images 16

HS22V Specifications 16

The Bottom Line 19

Server Comparison 20

For More Information 21

Legal Information 21

High density, high performance 2-socket blade server optimized for

virtualization

Suggested uses: Mainstream virtualization and memory-intensive HPC applications requiring

high memory density, outstanding performance, and enhanced power efficiency.

Today’s data center environment is tougher than ever. You’re looking to reduce IT cost,

complexity, space requirements, energy consumption and heat output, while increasing flexibility,

utilization and manageability through virtualization. Incorporating IBM X-Architecture

™ features,

the IBM® BladeCenter® HS22V blade server, combined with the various BladeCenter chassis,

can help you accomplish all of these goals.

Reducing an entire server into as little as .5U of rack space (i.e., up to 14 servers in 7U) does not

mean trading away features and capabilities for smaller size. Each HS22V blade server offers

features comparable to many 1U rack-optimized full-featured servers: The HS22V supports up to

two of the latest high-performance 6-core/4-core/2-core Intel

® Xeon® 5600 series and 5500

series processors. The Xeon processors are designed with up to 12MB of shared cache and

leading-edge memory performance (up to 1333MHz, depending on processor model) to help

provide the computing power you require to match your business needs and growth. The HS22V

supports up to 288GB1 of registered double data rate III (DDR3) ECC (Error Checking and

Correcting) memory in 18 DIMM slots, with optional Chipkill

™ protection

2, for high performance

and reliability. Selected models are planned for NEBS-3/ETSI-compliance.

The HS22V supports VMware vSphere Hypervisor (formerly ESXi) preloaded on a standard

USB flash drive. It operates in a diskless configuration, offers a smaller memory footprint,

extremely high performance, and stronger security, making getting a system up and running in a

virtualized environment faster and easier than ever before. The HS22V supports approximately

50% more average virtual machines (VMs) than the HS22. With up to 288GB of memory, the

HS22V is an outstanding choice for virtualization, in-memory databases, and memory-intensive

enterprise applications.

An integrated dual-port Gigabit Ethernet

3 controller is standard, providing high-speed data

transfers and offering TOE (TCP Offload Engine) support, load-balancing and failover

capabilities. Via optional expansion cards, each blade can also connect to additional Ethernet,

10Gb Ethernet, Converged Network Adapter (CNA), SAS, Fibre Channel, iSCSI, InfiniBand

™,

and other high-speed communication switches housed in the chassis. This blade is designed with

power management capability to provide the maximum uptime possible for your systems. In

extended thermal conditions or power brownouts, rather than shut down completely, or fail, the

HS22V automatically reduces the processor frequency to maintain acceptable thermal and power

levels.

All HS22V models offer impressive features at an equally impressive price, including up to two

1.8-inch fixed solid-state drives (SSDs) with RAID-0/1 support, and one internal USB flash

drive (for embedded hypervisor]. Additional direct-attach storage is available via the BladeCenter

S chassis. Moreover, the HS22V is optimized for diskless operation, offering each blade server

access to essentially unlimited external storage capacity via Fibre Channel, SAS, or iSCSI.

A single BladeCenter E BladeCenter H or chassis supports up to 14 hot-swappable 30mm-

wide HS22V blades in only 7U (BladeCenter E) or (BladeCenter H) of rack space or up to 9U 12

in the 12U BladeCenter HT high-speed telecommunications chassis. In addition to the blade

servers, these chassis also hold up to 4 switches (BladeCenter E) or up to 10 (BladeCenter H) or

8 switches/bridges (BladeCenter HT) internally. The BladeCenter S, designed for SMB and

mid-market customers, takes integration and affordability to a new level, combining up to 12 hot-

swap SAS/SATA HDDs (with optional SAS card) and up to 6 blade servers and 4 switches. Not

only can this save significant data center space (and therefore the cost of floor space and rack

1 When 16GB DIMMs are available in 4Q/10.

2 Chipkill protection on the HS22V requires x4 DIMMs; Chipkill protection is not available with x8 DIMMs.

3 Actual data transfer speed will vary and is often less than the maximum possible. Gigabit Ethernet transfer speed requires support on both

system and server, and appropriate network infrastructure.

High-performance blade server optimized for virtualization

Please see the Legal Information section for important notices and information. 2.

hardware) compared to 1U servers, it also consolidates switches/bridges and cables for reduced

complexity and lower cabling costs, and it allows clients to manage everything in the solution as

one. Using a BladeCenter E chassis, up to 84 HS22V servers (168 processors) can be installed in

one industry-standard 42U rack; but the value of BladeCenter extends far beyond high density

data center environments.

The various BladeCenter chassis are designed to monitor environmental conditions in the chassis

and each blade and send alerts to the administrator. Advanced standard features, such as Active

Memory™, , Predictive Failure Analysis, light path diagnostics hot-swap redundant hard

disk drives, power supplies and blower modules Calibrated Vectored Coolingwith ™; IPMI

2.0 support, including highly secure remote power control; text-console redirect over LAN,

next-generation BIOS (UEFI), an Advanced Management Module (upgradeable with a

redundant AMM), IBM Systems Director management software including IBM Systems

Director Active Energy Manager™. Remote Deployment Manager and IBM ServerGuide

™

help maintain system availability with increased uptime.

If you need highly manageable, high-performance virtualization in a space- or power-constrained

environment, the HS22V is the ideal system.

Selling Features Price/Performance

• There is an HS22V model to fit all budgets. The HS22V offers a choice of high-performance 6-core/4-

core/2-core Xeon processors with integrated memory controllers, clock rates from 1.86GHz to

3.46GHz 12MB, and up to shared cache (processor-specific) of integrated Level 3 cache. Xeon 5600

series processors offer up to 60% better performance

4 than the previous-generation 5500 series

processors and up to 1,500% better performance than the single-core processors of a few years ago

that you may still be using.

• Low-voltage processors draw less energy and produce less waste heat than higher-voltage

processors, thus helping to reduce data center energy costs. On a per-core basis, the standard 80W

processors are extremely economical, consuming as little as 13.33W per core. Some low-voltage

Xeon processors consume only 40W (10W per core).

• Up to 288GB of registered DDR3 ECC memory operates at 800MHz to 1333MHz (depending on the

system configuration), for high performance and wide memory bandwidth.

• Run two DIMMs per memory channel (2DPC) at 1333MHz in 5600 series processor configurations

• Embedded virtualization (optional on all models) offers extremely high performance, enhanced

security, and a zero-gigabyte HDD footprint. (In other words, no mechanical HDD to fail.)

• Solid state drives (SDDs) use only 2W of energy per drive, vs. 9-10W for 2.5-inch HDDs. This is as

much as 80% less energy than a HDD would use (with a corresponding reduction in heat output).

• Low power 1.35 volt memory draws up to 15% less power than current shipping memory DIMMs.

• Selected HS22V blade servers are planned for NEBS3/ETSI-compliance and feature long-life

availability. These blades are ideal for telecom or Next Generation Network (NGN) applications such

as IPTV, IP Multimedia Subsystem (IMS) and security.

• The extremely high degree of integration in the various BladeCenter chassis reduces the need for

server components, replacing numerous fans, KVM and Ethernet cables, power supplies, external

switches and other components with fewer shared hot-swap/redundant components in the

BladeCenter chassis itself. This integration also can greatly reduce the amount of power consumed

and heat produced, relative to an equivalent number of 1U servers. This can significantly reduce a

data center power bill. The reduced data center footprint can also save on infrastructure cost.

• The midplanes used in all chassis provide high-speed blade-to-blade, blade-to-switch-module

and module-to-module communications internally as well as externally. The midplanes used in the

BladeCenter H and BladeCenter HT chassis provide four 10Gb data channels to each blade, and

supports high-speed switch modules, including 4X InfiniBand and 10Gb Ethernet.

• The various BladeCenter chassis use ultrahigh efficiency power supplies. Most industry-standard

servers use power supplies that are between 70-75% efficient at converting power from AC wall

current to the DC power used inside servers. BladeCenter power modules are up to 92% efficient.

This helps save even more money, as more of the power input you are paying for is used for

processing, rather than released into the data center as waste heat that requires even more energy to

cool.

• BladeCenter also reduces the number of parts required to run the system. Sharing fans, systems

management, floppy devices and media means fewer parts to buy and maintain, and fewer items that

can fail and bring the overall solution down.

Flexibility

The HS22V has the ability to grow with your application requirements, thanks to:

4 Based on Intel measurements.

Produkt Specifikationer

Mærke:	Lenovo
Kategori:	Server
Model:	eServer BladeCenter HS22V
Bredde:	245 mm
Dybde:	446 mm
Højde:	29 mm
Vægt:	5440 g
Ethernet LAN-porte (RJ-45):	2
Antal USB 2.0-porte:	1
Ethernet LAN:	Ja
Processorkerner:	4
Intern hukommelse:	12 GB
Intel® Wireless Display (Intel® WiDi):	Ingen
Mac kompabilitet:	Ingen
Bæredygtighedscertifikater:	ENERGY STAR
Processorfrekvens:	3.2 GHz
Processorserie:	Intel® Xeon® 5000 Sequence
Processor boost frekvens:	3.6 GHz
Processortråde:	8
Processor-cache:	12 MB
Processor cache type:	Smart cache
Intern hukommelsestype:	DDR3-SDRAM
Hukommelsesur hastighed:	1066 Mhz
Maksimal intern hukommelse:	288 GB
Samlet lagringskapacitet:	0 GB
Intel® Hyper Threading Teknologi (Intel® HT Technology):	Ja
Intel® Turbo Boost Teknologi:	1.0
Hukommelsesstik:	18x DIMM
Processorproducent:	Intel
Processormodel:	X5672
Optisk drevtype:	Ingen
Enhanced Intel SpeedStep Teknologi:	Ja
Udfør deaktivering af bit:	Ja
Idle status:	Ja
CPU-konfiguration (maks.):	2
Intel® VT-x with Extended Page Tables (EPT):	Ja
Indlejret tilgængelige muligheder:	Ingen
Intel® 64:	Ja
Intel® Virtualization Technology for Directed I/O (VT-d):	Ja
Intel® Virtualization Technology (VT-x):	Ja
Grafikadapter:	G200eV
HDD-grænseflade:	SATA
Overholdelse af branchestandarder:	IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Netværksfunktioner:	Gigabit Ethernet
Antal installerede processorer:	1
Bus type:	QPI
Kabinettype:	Blade
Intel® Flex Memory Access:	Ingen
Intel® Trusted Execution Teknologi:	Ja
Intel® Enhanced Halt State:	Ja
Intel® klar video teknologi:	Ingen
Konfliktfri processor:	Ingen
HDD-størrelse:	1.8 "
Processor sokkel:	Socket B (LGA 1366)
Processor litografi:	32 nm
Stepping:	B1
Thermal Design Power (TDP):	95 W
Fejlkorrigerende kode understøttet af processor:	Ja
Processor front side bus:	1333 Mhz
Systembus-hastighed:	6.4 GT/s
Processor driftstilstande:	64-bit
Processor kodenavn:	Westmere EP
FSB Paritet:	Ingen
Intel® InTru™ 3D Teknologi:	Ingen
Intel® Clear Video HD Teknologi (Intel® CVT HD):	Ingen
Intel® Insider™:	Ingen
Intel® My WiFi Teknologi (Intel® MWT):	Ingen
Intel® Anti-Theft Teknologi (Intel® AT):	Ingen
Intel® Quick Sync Video Teknologi:	Ingen
Intel® AES Nye Instruktioner (Intel® AES-NI):	Ja
Intel® Demand Based Switching:	Ja
Termiske overvågningsteknologier:	Ingen
Fysisk adresseudvidelse (PAE):	Ja
Intel® Dual Display Capable Teknologi:	Ingen
Intel® FDI Teknologi:	Ingen
Intel® Rapid Storage Teknologi:	Ingen
Intel® Fast Memory Access:	Ingen
Intel® Clear Video Teknologi til MID (Intel® CVT for MID):	Ingen
Processor-pakke størrelse:	42.5 X 45 mm
Processor kode:	SLBYK
Processor ARK ID:	52579
Hukommelseslayout (slots x størrelse):	3 x 4 GB
CPU-multiplikator (bus/kerneforhold):	24
Understøttede instruktionssæt:	SSE4.2
Understøtter RAID:	Ja
Maksimal lagerkapacitet:	0.1 TB
Fejlkorrigerende kode:	Ja
PCI Express x16 slots:	2
Redundant strømforsyning:	Ingen
Antal understøttede HHD'er:	2
Kompatibel processor serie:	Intel® Xeon®
Bundkort chipsæt:	Intel® 5520
LAN Kontroller:	Broadcom BCM5709S
Maksimal grafikadapterhukommelse:	16 MB
Wake-on-LAN klar:	Ja
RAID-niveauer:	0, 1
Maksimal intern hukommelse understøttet af processor:	288 GB
Hukommelsestyper understøttet af processor:	DDR3-SDRAM
Hukommelsesurhastigheder understøttet af processor:	800,1066,1333 Mhz
Hukommelsesbåndbredde understøttet af processor (maks.):	32 GB/sek.
Tcase:	82.9 °C
Maksimalt antal SMP-processorer:	2
Grafikadapter familie:	Matrox
Fysisk adresse udvidelse (PAE):	40 Bit
Antal QPI-lins:	2
Antal strømforsyninger:	1
Hukommelseskanaler understøttet af processor:	Tredobbelt
Disk array controller:	LSI Logic 53C1046E