Microchip ATECC608B-TCSM Manual
Microchip
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ATECC608B-TCSM
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ATECC608B
CryptoAuthentication™ Device Summary Data Sheet
Features
• Cryptographic Co-Processor with Secure Hardware-Based Key Storage:
– Protected storage for up to 16 keys, certificates or data
• Hardware Support for Asymmetric Sign, Verify, Key Agreement:
– ECDSA: FIPS186-3 Elliptic Curve Digital Signature
– ECDH: FIPS SP800-56A Elliptic Curve Diffie-Hellman
– NIST Standard P256 Elliptic Curve Support
• Hardware Support for Symmetric Algorithms:
– SHA-256 & HMAC Hash including off-chip context save/restore
– AES-128: Encrypt/Decrypt, Galois Field Multiply for GCM
• Networking Key Management Support:
– Turnkey PRF/HKDF calculation for TLS 1.2 & 1.3
– Ephemeral key generation and key agreement in SRAM
– Small message encryption with keys entirely protected
• Secure Boot Support:
– Full ECDSA code signature validation, optional stored digest/signature
– Optional communication key disablement prior to secure boot
– Encryption/Authentication for messages to prevent on-board attacks
• Internal High-Quality NIST SP 800-90A/B/C Random Number Generator (RNG)
• Two High-Endurance Monotonic Counters
• Unique 72-Bit Serial Number
• Two Interface Options Available:
– High-Speed Single Wire Interface with One GPIO Pin
– 1 MHz Standard I2C Interface
• 1.8V to 5.5V IO Levels, 2.0V to 5.5V Supply Voltage
• Two Temperature Ranges Available:
– Standard Industrial Temperature Range: -40 to +85℃ ℃
– Extended Industrial Temperature Range: -40 to +100℃ ℃
• <150 nA Sleep Current
• Packaging Options
– 8-pad UDFN, 8-lead SOIC and 3-Lead Contact Package Options
– Die-on-Tape and Reel and WLCSP for Qualified Customers (Contact Microchip Sales)
Applications
• IoT network endpoint key management & exchange
• Encryption for small messages and PII data
• Secure Boot and Protected Download
• Ecosystem Control, Anti-cloning
This is a summary document. A
complete document is available under
NDA. For more information, please
contact your local Microchip sales
office.
© 2020 Microchip Technology Inc. Summary Datasheet DS40002239A-page 1
Pin Configuration and Pinouts
Table 1. Pin Configuration
Pin Function I2C Interface Function SWI Interface
NC No Connect No Connect
GND Ground Ground
SDA Serial Data Serial Data
SCL Serial Clock Input GPIO
VCC Power Supply Power Supply
Figure 1. Package Types
1
2
3
4
8
7
6
5
NC
NC
NC
GND
VCC
NC
SCL
SDA
8-lead SOIC
(Top View)
VCC
NC
SCL
SDA
NC
NC
NC
GND
1
2
3
4
8
7
6
5
8-pad UDFN
(Top View)
3-lead Contact
(Top View)
GND
VCC
SDA
2
3
1
Note: The UDFN backside paddle is recommended to be connected to GND.
ATECC608B
© 2020 Microchip Technology Inc. Summary Datasheet DS40002239A-page 2
Produkt Specifikationer
| Mærke: | Microchip |
| Kategori: | Ikke kategoriseret |
| Model: | ATECC608B-TCSM |
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