BM70/71 & IS1870/71 rmware 2.03 Release Notes Fi – July 22, 20 20
IS1870/71 & BM70/71 Firmware 2.03
Release Notes
1 Overview
Firmware version 2.0 is a maintenance release for IS1870, IS1871, BM70, and BM71. Firmware
version 2.0 adds new features/ removes limitations in previous release 1.11. This firmware is made
available on Microchip’s web site for existing IC’s and modules.
1.1 Resolved Issues
• Fixed read ADC command problem for temperature detection.
• Fixed Sweyntooth BLE vulnerabilities in LL, SMP and L2CAP layers.
• Fixed disconnection issue with Xiaomi Mi 10 Pro Phone.
• Fixed MPAF OTA update UI fail issue.
• Fixed HID over GATT issue.
• Fixed an issue where pairing fails in Multilink scenario with reason DHKey failure check.
• Fixed Instant Pass Issue for Multilink scenarios (LL_STATUS_ERROR_INSTANT_PASSED/0x28)
• IOP Pairing fail issue with Samsung S8 Verizon variant.
• Write to Flash is enabled for few manual pattern commands like WRITE DEVICE NAME
command (0x08).
• Fixed issue where AutoPattern Mode BM70 outputs manual mode data from UART.
• Fixed an issue where the application always starts passive scan irrespective of whether scan
type is set to passive or active.
• Fixed an issue where the SCAN_RES is displayed as ADV_IND.
• Fixed an issue where ADC return value was shown incorrectly.
• Fixed an issue where connection was getting terminated due to MIC failure in Multilink scenario.
1.2 New Features
• BLE Data Length Extension to max 251 bytes.
• Maximum BLE ATT MTU size is 247 bytes
• AFH channel map adjust automatically when BLEDK3 is Central role ed
• Supports LE privacy feature v1.1 (disabled by default in UI settings)
• Enhance data transmission throughput in Auto pattern mode
• Supports following in auto pattern mode
o BLEDK3 v2.0 to be GAP Central role
o It allows two nearby BLEDK3 v2.0 devices with auto pattern to establish BLE link