Microchip LAN8651 Manual

Microchip Ikke kategoriseret LAN8651

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 2023 Microchip Technology Inc. and its subsidiaries DS60001746B - page 1

1.0 INTRODUCTION

This document provides a hardware design checklist for the Microchip LAN8650/1. These checklist items should be fol-

lowed when utilizing the LAN8650/1 in a new design. A summary of these items is provided in Section 11.0, HARD-

WARE CHECKLIST SUMMARY. Detailed information on the following topics can be found in the corresponding section:

Section 1.0, INTRODUCTION

Section 2.0, GENERAL CONSIDERATIONS

Section 2.1, Pin Check

Section 3.0, POWER AND GROUND

Section 3.1, Power

Section 3.2, Ground

Section 4.0, CLOCK CIRCUIT

Section 5.0, ETHERNET PHY EXTERNAL BIN

Section 6.0, SPI (SERIAL PERIPHERAL INTERFACE)

Section 7.0, RESET

Section 8.0, POWER MANAGEMENT PINS

Section 9.0, CONFIGURABALE PINS

Section 10.0, MISCELLANEOUS

Section 10.1, RBIAS

Section 10.2, TEST

Section 10.3, DO NOT CONNECT

Section 11.0, HARDWARE CHECKLIST SUMMARY

LAN8650/1

Hardware Design Checklist

LAN8650/1

DS60001746B - page 2  2023 Microchip Technology Inc. and its subsidiaries

2.0 GENERAL CONSIDERATIONS

2.1 Pin Check

Check the pinout of the part against the data sheet. Ensure each pin matches the data sheet and is configured as input,

output, or bidirectional.

3.0 POWER AND GROUND

3.1 Power

The LAN8651 contains an integrated 1.8V regulator and only requires a single 3.3V supply while the LAN8650 requires

both 3.3V and 1.8V external supplies.

• The digital pin supply, VDDP, is connected to a 3.3V supply.

• The analog supply, VDDA, is connected to a 3.3V supply. This connection may be through an optional ferrite

bead. If a ferrite bead is used, a large bulk capacitor (typically 10 µF) should be placed in between the ferrite bead

and the pin decoupling capacitors. The ferrite bead and bulk capacitor should be placed where the power supply

sources the local 3.3V power plane and as close as possible to the LAN8650/1.

• The continuous analog supply, VDDAU, is connected to a 3.3V continuous supply if low-power sleep mode is

used. If sleep mode is not used, it is connected to the same supply as VDDA.

• The core supply, VDDC, is connected to a 1.8V supply.

• The LAN8651 CCOMP pin requires a 4.7 µF low ESR metal film capacitor connected to the PCB ground plane.

• The LAN8650 1.8V power supply must never exceed the 3.3V supply by more than 0.5V. To satisfy this power

sequencing requirement, a Schottky diode is recommended between the supplies to prevent the lower voltage

supply from exceeding the higher supply by more than a forward diode drop. If used, the diode must be sized

appropriately according to the LAN8650 3.3V supply and the forward voltage drop must be less than 0.5V when

the diode conducts current.

• Each individual VDDP VDDA VDDAU, , and VDDC power pin requires a 0.01 µF and 0.1 µF decoupling capacitor.

• During layout, the smallest value capacitor, 0.01 µF, must have priority and be placed closest to the respective

power pin. The tightest decoupling capacitor placement is underneath the device on the opposite side of the

board. Each capacitor should have a dedicated power and ground vias. Vias should not be shared.

• The VDDA VDDAU pin must never exceed the pin by more than 0.5V, including during power-up and power-

down. Use optional Schottky diode for power sequencing.

• LAN8650 only: The VDDC pin must not exceed the VDDP pin by more than 0.5V, including during power-up and

power-down. Use optional Schottky diode for power sequencing.

TABLE 3-1: POWER PINOUT

LAN8650 LAN8651

VDDP Pin 7, Pin 17 Pin 7, Pin 17

VDDAU Pin 25 Pin 25

VDDA Pin 29 Pin 29

VDDC Pin 6, Pin 15, Pin 21

CCOMP Pin 21

Produkt Specifikationer

Mærke:	Microchip
Kategori:	Ikke kategoriseret
Model:	LAN8651

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