Microchip TC648 Manual

Microchip Ikke kategoriseret TC648

Læs gratis den danske manual til Microchip TC648 (8 sider) i kategorien Ikke kategoriseret. Denne vejledning er vurderet som hjælpsom af 20 personer og har en gennemsnitlig bedømmelse på 4.9 stjerner ud af 10.5 anmeldelser. Har du et spørgsmål om Microchip TC648, eller vil du spørge andre brugere om produktet?

Download PDF

Side 1/8

 2003 Microchip Technology Inc. DS91063A-page 1

TB063

INTRODUCTION

Less than six years ago, thermal cooling in the

electronics arena was mainly an issue for high-

performance, high-end applications, such as, military,

aerospace and large-scale industrial and medical

applications. Outside these sectors, thermal cooling

was just a premature notion. In the short span of a few

years, technological and other developments have

made thermal cooling necessary for many applications,

thus requiring the development of a new system

management category: thermal management.

This article discusses an integrated fan speed solution

that provides sophisticated speed control of brushless

DC fans, the most popular type of fan used in electronic

equipment, and helps designers get around problems

like acoustic noise, power consumption, mechanical

wear-out and fault detection.

TRENDS AND DRIVERS

On a board level, many more components need cooling

today than even six months ago; with the CPUs having

begun this trend some years ago. Memory chips never

needed cooling, but now SRAM and DRAM packages

require their own cooling solutions. Video card

processors (mostly the 3D type) and other add-in cards

also require cooling, as will the next generation models.

Hard drives, DVD players, CD players and chipsets are

now candidates for cooling as well. In general, board

speeds are becoming faster and boards are becoming

smaller and more heavily populated. Package

densities are increasing and performing more

functions, thus getting hotter.

New developments in digital chip architecture permit

higher system clock rates and additional on-chip

circuitry, causing the chips to run at higher tempera-

tures. A large portion of the power dissipation is the

capacitive charging and discharging during level transi-

tions. Since the power lost is related to the square of

the supply voltage, the trend to lower voltages reduces

power dissipation.

However, higher losses due to higher switching

speeds, significantly offset these savings. An example

is the 486 microprocessor, which was drawing 12 to 15

watts. As PCs moved into the first Pentium®

generation, the microprocessors started dissipating

25W. Today a Pentium® II dissipates about 40W, and

there have been reports that the forthcoming 64-bit

Merced microprocessor dissipates about 65W.

Thermal cooling is also in demand because of the

explosive growth of new embedded applications.

Telecommunications equipment, printers, household

“smart” appliances, and most importantly, networking

equipment (routers, switches and hubs) are only a few

of the products now driven by embedded CPUs. More

are being added each day, and with the complexity of

multiple functions, thermal cooling has become a

necessity.

WHY DO WE NEED COOLING?

The air immediately surrounding a chip initially cools its

surface. That air eventually warms and rises to the top

of the PC or other equipment’s chassis, where it

encounters more warm air. If not ventilated, this volume

of air becomes warmer and warmer, offering no avenue

of escape for the heat generated by the chips.

Typically, a PC chip designed for commercial use can

withstand up to 125°C – 150°C junction temperature,

although a safety margin of a few degrees might be

specified. Exceeding that limit will either cause the chip

to make errors in its calculations or fail completely. A

chip failure or malfunction impacts the entire system’s

operation. Additional cooling also extends component

life by limiting the maximum temperatures the

components are exposed to. In general, a 10°C

temperature reduction will provide a 2:1 increase in

MTBF (Mean Time Between Failure).

Author: George Paparrizos

Microchip Technology Inc.

An Integrated Fan Speed Control Solution Can Lower

System Costs, Reduce Acoustic Noise, Power Consumption

and Enhance System Reliability

Produkt Specifikationer

Mærke:	Microchip
Kategori:	Ikke kategoriseret
Model:	TC648

Har du brug for hjælp?

Hvis du har brug for hjælp til Microchip TC648 stil et spørgsmål nedenfor, og andre brugere vil svare dig

Dit navn*

Din email*

Skriv dit spørgsmål her

Ikke kategoriseret Microchip Manualer

Microchip PIC16F87 Manual

25 Oktober 2025

Microchip PIC18F2620 Manual

25 Oktober 2025

Microchip RN240 Manual

24 Oktober 2025

Microchip PIC24HJ12GP201 Manual

24 Oktober 2025

Microchip TC4420 Manual

24 Oktober 2025

Microchip HV2818 Manual

23 Oktober 2025

Microchip MIC2298 Manual

23 Oktober 2025

Microchip PIC16F630 Manual

23 Oktober 2025

Microchip PIC32MZ2048EFG144 Manual

21 Oktober 2025

Microchip PIC18F46J50 Manual

21 Oktober 2025

Ikke kategoriseret Manualer

Nyeste Ikke kategoriseret Manualer

Adventys MO4NL Manual

1 November 2025

Adventys GL 3000 DIR Manual

1 November 2025

Dahua Technology HAC-HFW2241T-Z-A-VP-0622 Manual

1 November 2025

Moultrie Edge Solar Manual

1 November 2025

Dahua Technology XVR5416L-4KL-I2 Manual

1 November 2025

Dahua Technology PFM802P Manual

1 November 2025

EtherWAN EX94000 Manual

1 November 2025

EtherWAN EX87000 Manual

1 November 2025

Techno Line TR-40315 Manual

1 November 2025

Dahua Technology HAC-HFW1239TLM-A-LED Manual

1 November 2025