Microchip USB3813 Manual

Microchip Ikke kategoriseret USB3813

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 2012-2019 Microchip Technology Inc. DS00001876C-page 1

1.0 INTRODUCTION

This application note provides information on general printed circuit board layout considerations for Microchip’s many

families of USB Hub Controller devices. This information is broadly applicable to any of Microchip’s USB 2.0 and USB

3.1 Gen 1 and Gen 2 device implementations.

1.1 Audience

This application note is written for readers that are familiar with PCB design, including signal integrity, differential sig-

naling, and thermal management implementation concepts.

1.2 Objective

The goal of this document is to provide implementation information that specifically applies to designing PCBs using

Microchip’s High Speed and faster families of USB Hub Controller devices. Careful implementation of these guidelines

enables successful designs.

1.3 Overview

Successful operation of Microchip’s USB Hub Controllers requires special consideration for printed circuit board (PCB)

layout. All Microchip USB Hub controllers contain a mix of sensitive analog circuitry, digital core logic, and high speed

I/O circuitry. The PCB’s design is part of the system circuit for all of these subsystems that can either enhance or detract

from desired operation.

General issues such as placement and stack up are covered. Additionally, subsystem issues such as USB 2.0 / 3.1

Gen 1 and Gen 2 signaling/impedance, crystal connections, and other critical circuits are discussed. Controlling EMI,

system power distribution, and signal return path management will also be addressed.

The guidelines presented supersede earlier notes for the applicable devices. The following recommendations are based

on Microchip’s experience and knowledge and may be accepted or rejected. Microchip does not guarantee any design.

Each company is ultimately responsible for determining the suitability of its own design.

1.4 References

• Data Sheets: USB54xx, USB55xx, USB56xx,USB57xx, USB58xx, USB59xx, USB7xxx, USB8xxx, USB38xx,

USB25xx and USB46xx USB Hub Controller and Hub-Combo devices

• Application Note: AN 26.21

• Application Note: AN 18.15

• Evaluation designs that are referenced in this document can be found on the Microchip web site.

AN26.2

Implementation Guidelines for Microchip’s USB 2.0 and

USB 3.1 Gen 1 and Gen 2 Hub and Hub-Combo Devices

Author: Carl Johnson



Microchip Technology Inc.

AN26.2

DS00001876C-page 2  2012-2019 Microchip Technology Inc.

2.0 SCHEMATIC GUIDELINES

Specific requirements and suggestions for the schematic implementation of Microchip’s USB hub controllers are indi-

cated in this section. Product data sheets specify basic circuit needs.

2.1 Chassis and Cable Ground

USB hub devices can be implemented in the following ways:

• Embedded with a host controller

• Embedded with a mix of inaccessible ports with embedded devices and user-accessible ports

• Embedded with a mix of a host, inaccessible ports with embedded devices, and user-accessible ports

• A stand-alone hub

Each of these implementation details can affect the best method to use for connecting the chassis and USB cable

shields to digital ground. The best way to make these connections will depend on the design’s system details. Refer to

the many reference documents and white papers on this topic available on the Internet, especially those published by

members of the USB consortium and providers of USB-enabled motherboards and devices.

Microchip has observed positive EMI and ESD behavior on stand-alone designs when connecting the USB cable shield

to digital ground with an RC network (330  resistor and a 0.1 F capacitor in parallel) at each USB connector.

2.2 VDD12 and VDD33 Power Regulator

The USB57x4 & USB553x family of hubs use two external power voltages: VDD12 at 1.25 V, and VDD33 at 3.3 V.

The VDD12 rail is used for core digital functions and for the USB 3.1 Gen 1 PHYs. The VDD12 current consumed by

the hub device will vary greatly. When the device is in “suspend” it will consume very little current. It will consume max-

imum current when all USB 3.1 Gen 1 SuperSpeed interfaces are active. The selected regulator must be stable, low

noise, and accurate across all power consumption ranges.

The VDD33 rail for the USB57x4 & USB553x devices are used by the PLL and other circuitry. Additionally, USB25xx

devices derive core and other rails from VDD33. Therefore, the VDD33 supply must be very clean. Noise on VDD33

must be filtered out before it is received by the hub device. Some systems require < 5 mV of ripple on VDD33 at the hub

device pins to pass SSC certification of suite. Switching regulators are a common source for the USB 3.1 Gen 1 test

VDD33 noise. The example in Figure 2 shows an effective filter to block switching regulator noise from VDD33.

FIGURE 1: EXAMPLE CHASSIS GROUND CONNECTION

Produkt Specifikationer

Mærke:	Microchip
Kategori:	Ikke kategoriseret
Model:	USB3813

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