Samsung M393AAG40M3B-CYFCO Manual

Samsung Ikke kategoriseret M393AAG40M3B-CYFCO

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Side 1/9

Module

Handling

Guide

How to handle the module

Recently module failure related with Active/Passive/Component crack has increased.

Main root causes are wrong handling method and mechanical damage.

Current products have more cap. & resistors and the sizes of those passives are reduced and most of them are located around edge

area.

These characteristics require more cautious module handling method.

This guide book tries to nd out tendency and range of module crack pattern based on experiments from several aspects. The main

purpose is to reinforce Samsung’s process control and help customer effectively control module handling process.

Test methods are PCB Bow, Twist, Drop Test, UTM(Universal Testing Machine) Test for DRAM, Resister & Capacitor. We observed

crack phenomena and tendency through the datum and pictures. Tested products are limited to Registered DIMM [RDIMM],

Unbuffered DIMM [UDIMM] and BOC PKG based Module, therefore test results might be different when applied to other products.

Overview

Memory Module Introduction

Unbuffered DIMM

Registered DIMM

Load Reduced DIMM

SODIMM

Produkt Specifikationer

Mærke:	Samsung
Kategori:	Ikke kategoriseret
Model:	M393AAG40M3B-CYFCO
Intern hukommelse:	128 GB
Intern hukommelsestype:	DDR4
Hukommelsesur hastighed:	2933 Mhz
Hukommelse form faktor:	288-pin DIMM
Komponent til:	PC/server
Hukommelsesspænding:	1.2 V
Hukommelseslayout (moduler x størrelse):	1 x 128 GB
Pufret hukommelsestype:	Registered (buffered)
Hukommelse rangering:	4