Supermicro H13DSG-O-CPU Manual
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USER’S MANUAL
Revision 1.0a
H13DSG-O-CPU
The information in this User’s Manual has been carefully reviewed and is believed to be accurate. The vendor assumes
no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update
or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note:
For the most up-to-date version of this manual, please see our website at www.supermicro.com.
Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual
at any time and without notice. This product, including software and documentation, is the property of Supermicro and/
or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except
as expressly permitted by the terms of said license.
IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,
SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT
OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER
MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED
OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,
INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.
Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the
State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution
of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.
FCC Statement: This equipment has been tested and found to comply with the limits for a Class A or Class B digital
device pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against
harmful interference when the equipment is operated in industrial environment for Class A device or in residential
environment for Class B device. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the manufacturer’s instruction manual, may cause harmful interference with
radio communications. Operation of this equipment in a residential area is likely to cause harmful interference, in
which case you will be required to correct the interference at your own expense.
California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only
to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply.
See ”.www.dtsc.ca.gov/hazardouswaste/perchlorate
The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment,
nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical
systems whose failure to perform be reasonably expected to result in signicant injury or loss of life or catastrophic
property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products
for use in such ultra-hazardous applications, it does so entirely at its own risk. Furthermore, buyer agrees to fully
indemnify, defend and hold Supermicro harmless for and against any and all claims, demands, actions, litigation, and
proceedings of any kind arising out of or related to such ultra-hazardous use or sale.
Manual Revision 1.0a
Release Date: March 07, 2023
Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this
document. Information in this document is subject to change without notice. Other products and companies referred
to herein are trademarks or registered trademarks of their respective companies or mark holders.
Copyright © 2023 by Super Micro Computer, Inc.
All rights reserved.
Printed in the United States of America
WARNING: This product can expose you to chemicals including
lead, known to the State of California to cause cancer and birth
defects or other reproductive harm. For more information, go
to www.P65Warnings.ca.gov.
!
3
Preface
Preface
About This Manual
This manual is written for system integrators, IT technicians and knowledgeable end users.
It provides information for the installation and use of the H13DSG-O-CPU motherboard.
About This Motherboard
Built upon the functionality and capability of the Dual AMD EPYC TM 9004 series processors, the
H13DSG-O-CPU motherboard provides superior graphics capability and system performance
while consuming little power. Please note that this motherboard is intended to be installed
and serviced by professional technicians only. For processor/memory updates, please refer
to our website at http://www.supermicro.com/products/.
Conventions Used in the Manual
Special attention should be given to the following symbols for proper installation and to prevent
damage done to the components or injury to yourself:
Warning! Indicates high voltage may be encountered when performing a procedure.
Warning! Indicates important information given to prevent equipment/property damage
or personal injury.
4
H13DSG-O-CPU User's Manual
Contacting Supermicro
Headquarters
Address: Super Micro Computer, Inc.
980 Rock Ave.
San Jose, CA 95131 U.S.A.
Tel: +1 (408) 503-8000
Fax: +1 (408) 503-8008
Email: marketing@supermicro.com (General Information)
Sales-USA@supermicro.com (Sales Inquiries)
Government_Sales-USA@supermicro.com (Gov. Sales Inquiries)
support@supermicro.com (Technical Support)
RMA@supermicro.com (RMA Support)
Webmaster@supermicro.com (Webmaster)
Website: www.supermicro.com
Europe
Address: Super Micro Computer B.V.
Het Sterrenbeeld 28, 5215 ML
's-Hertogenbosch, The Netherlands
Tel: +31 (0) 73-6400390
Fax: +31 (0) 73-6416525
Email: Sales_Europe@supermicro.com (Sales Inquiries)
Support_Europe@supermicro.com (Technical Support)
RMA_Europe@supermicro.com (RMA Support)
Website: www.supermicro.nl
Asia-Pacic
Address: Super Micro Computer, Inc.
3F, No. 150, Jian 1st Rd.
Zhonghe Dist., New Taipei City 235
Taiwan (R.O.C)
Tel: +886-(2) 8226-3990
Fax: +886-(2) 8226-3992
Email: Sales-Asia@supermicro.com.tw (Sales Inquiries)
Support@supermicro.com.tw (Technical Support)
RMA@supermicro.com.tw (RMA Support)
Website: www.supermicro.com.tw
5
Table of Contents
Contacting Supermicro ........................................................................................................4
Chapter 1 Introduction
1.1 Quick Reference ...................................................................................................................9
Quick Reference Table ......................................................................................................10
Motherboard Features .......................................................................................................12
Block Diagram ...................................................................................................................14
1.2 Processor and Chipset Overview .......................................................................................15
1.3 Special Features ................................................................................................................15
Recovery from AC Power Loss .........................................................................................15
1.4 System Health Monitoring ..................................................................................................16
Onboard Voltage Monitors ................................................................................................16
Fan Status Monitor with Firmware Control .......................................................................16
Environmental Temperature Control .................................................................................16
System Resource Alert......................................................................................................16
1.5 ACPI Features ....................................................................................................................17
1.6 Power Supply .....................................................................................................................17
1.7 Super I/O ............................................................................................................................17
Chapter 2 Installation
2.1 Static-Sensitive Devices .....................................................................................................18
Precautions .......................................................................................................................18
Unpacking .........................................................................................................................18
2.2 Motherboard Installation .....................................................................................................19
Location of Mounting Holes ..............................................................................................19
Installing the Motherboard.................................................................................................21
2.3 Processor and Heatsink Installation ...................................................................................22
2.4 Memory Support and Installation .......................................................................................30
Memory Support ................................................................................................................30
DIMM Module Population Sequence ................................................................................32
DIMM Installation ..............................................................................................................33
DIMM Removal .................................................................................................................33
2.5 Front Control Panel ............................................................................................................34
Preface
6
2.6 Connectors .........................................................................................................................38
Power Supply Connections ...............................................................................................38
Headers .............................................................................................................................40
2.7 Jumper Settings .................................................................................................................41
How Jumpers Work ...........................................................................................................41
2.8 LED Indicators ....................................................................................................................42
Chapter 3 Troubleshooting
3.1 Troubleshooting Procedures ..............................................................................................43
Before Power On ..............................................................................................................43
No Power ..........................................................................................................................43
No Video ...........................................................................................................................44
System Boot Failure ..........................................................................................................44
Memory Errors ..................................................................................................................44
What to do if the System is Losing the Setup Conguration............................................44
When the System Becomes Unstable ..............................................................................45
3.2 Technical Support Procedures ...........................................................................................46
3.3 Frequently Asked Questions ..............................................................................................47
3.4 Returning Merchandise for Service ....................................................................................48
3.5 Battery Removal and Installation .......................................................................................48
Battery Removal ................................................................................................................48
Proper Battery Disposal ....................................................................................................49
Battery Installation .............................................................................................................49
Chapter 4 UEFI BIOS
4.1 Introduction .........................................................................................................................50
Starting the Setup Utility ...................................................................................................50
4.2 Main Setup .........................................................................................................................51
4.3 Advanced ............................................................................................................................53
4.4 BMC ....................................................................................................................................75
4.5 Event Logs .........................................................................................................................78
4.6 Security ...............................................................................................................................80
4.7 Boot Settings ......................................................................................................................84
4.8 Save & Exit .........................................................................................................................86
Appendix A Software
Appendix B Standardized Warning Statements
H13DSG-O-CPU User's Manual
7
Chapter 1: Introduction
Chapter 1
Introduction
Congratulations on purchasing your computer motherboard from an industry leader. Supermicro
boards are designed to provide you with the highest standards in quality and performance.
In addition to the motherboard, several important parts that are included with the system are
listed below. If anything listed is damaged or missing, please contact your retailer.
Important Links
For your system to work properly, please follow the links below to download all necessary
drivers/utilities and the user’s manual for your server.
• Supermicro product manuals: http://www.supermicro.com/support/manuals/
• Product drivers and utilities: https://www.supermicro.com/wdl
• Product safety info: http://www.supermicro.com/about/policies/safety_information.cfm
• A secure data deletion tool designed to fully erase all data from storage devices can be
found at our website: https://www.supermicro.com/about/policies/disclaimer.cfm?url=/ wdl/
utility/Lot9_Secure_Data_Deletion_Utility
• If you have any questions, please contact our support team at: support@supermicro.com
This manual may be periodically updated without notice. Please check the Supermicro website
for possible updates to the manual revision level.
8
H13DSG-O-CPU User's Manual
Note: All graphics shown in this manual were based upon the latest PCB revision available
at the time of publication of the manual. The motherboard you received may or may not look
exactly the same as the graphics shown in this manual.
Figure 1-1. H13DSG-O-CPU Motherboard Image
9
Chapter 1: Introduction
Notes:
• See Chapter 2 for detailed information on jumpers, I/O ports, and JF1 front panel connec-
tions.
• Jumpers/LED indicators not indicated are used for testing only.
• Use only the correct type of onboard CMOS battery as specied by the manufacturer. Do
not install the onboard battery upside down to avoid possible explosion.
1.1 Quick Reference
A C
A
C
A
C
H13DSG-O-CPU
REV:1.01
DESIGNED IN USA
BIOS LICENSE
BAR CODE IPMI CODE
M.2-H2
JNVVPP1
JNVI2C1
JNCSI2
MH16MH15
JPW1 JPW2 JPW4
JMCIO-RA2JMCIO-RA1
MH18
MH17
JBT1
J35
JTPM1
JNCSI1
JSLOT1
JIPMB2
JIPMB1
JPW_STBY1
J B JS12AJS11B JS11A L6A
JS10A
JSL5B
JS2A JS2B JS3A JS3B JS4A JS4B
JS7A
JS9B
B
JS1B
JS1A
JPWR1
JPWR2 JPWR4
JPWR3
JPWR6
JPWR5
JPWR8
JPWR7
JPWR10
JPWR9
JPWR12
JPWR11
JPWR14JPWR13
JPWR16JPWR15
JPWR18
JPWR17
JPWR20
JPWR19
JPW23
JPW22
JPW21
LED4
PWR1PWR3PWR4 PWR2
JF1
BT1
LED1
LED6
MH10MH9 MH11 MH12
MH7
MH2
MH1
MH6
CPU0
CPU1
J23J21J20J19J18 J17 J16 J15 J14 J13 J22 J24 J10J9 J11J2 J7J6 J4 J3 J12
J1
J5 J8
JSYSID2
JSYSID3
JSYSID1
JL1
JPFR3
FAN7 FAN2
FAN1
FAN9
FAN8
FAN5
FAN6 FAN4
FAN3
FAN10
L5A
JS7B JS8A JS8B JS9A JS10B
UCB2/3 (2.0)
S1
A
C
LEDBMC1
BT1
JSLOT1
JMCIO-RA1
JMCIO-RA2
PSU1 PSU2
PSU3 PSU4
CPU1
CPU2
SATA 0~1
JIPMB2
JIPMB1
LED4
M.2-H2
LED1
JF1
FAN10
JL1
FAN8
P2_PCIe5B
P2_PCIe5A_VPP
P2_PCIe6B
P2_PCIe6A
FAN6 USB2/3
FAN5 FAN4 FAN3
FAN2
FAN1
FAN9
P1_PCIe6A
P1_PCIe6B
P1_PCIe5B
P1_PCIe5A_VPP
P2_PCIe1A_VPP
P2_PCIe2A
P2_PCIe2B
P2_PCIe3A
P2_PCIe3B
JPW_STBY1
P2_PCIe4A
P2_PCIe4B
GPU_PWR1~GPU_PWR10 GPU_PWR11~GPU_PWR20
P1_PCIe4B
P1_PCIe4A_VPP
P1_PCIe3B
P1_PCIe3A_VPP
P1_PCIe2B
P1_PCIe2A
P1_PCIe1B
P1_PCIe1A
PCIe 2.0 x1
JNCSI2
JPFR3
FAN7
JTPM1
AIOM PCIe5.0x16
JNVI2C1
JNVVPP1
LED6
S1
JBT1
LEDBMC1
BP_PWR3
~
BP_PWR1
P2-DIMMF1~P2-DIMMA1 P2-DIMMG1~P2-DIMML1 P1-DIMMF1~P1-DIMMA1 P1-DIMMG1~P1-DIMML1
P2_PCIe1B
JNCSI1
10
H13DSG-O-CPU User's Manual
Quick Reference Table
Jumper Description Default Setting
JBT1 CMOS Clear Open (Normal)
JPFR3 PFR Function Open (Normal)
LED Description Status
LED1 UID LED Solid Blue: Unit Identied
LED4 M.2 LED Green: On
LED6 Power LED Solid Green: Power On
LEDBMC1 BMC Heartbeat LED Blinking Green: BMC Normal
Green: Fast blinking (BMC Initializing)
Connector Description
JIPMB1 4-pin External I 2C Header (for an IPMI card)
AIOM Supermicro Advanced I/O Module
JSLOT1 Supermicro I/O Riser Slot (AOM-PIO-i2G)
JMCIO-RA1/JMCIO-RA2 AIOM Input. Connection to any JSA/JSB.
USB2/3 (2.0) USB2/3 (2.0) Front Side Pin Header
P1-PCIe1A
P1-PCIe1B
P1-PCIe2A
P1-PCIe2B
P1-PCIe3A_VPP
P1-PCIe3B
P1-PCIe4A_VPP
P1-PCIe4B
P1-PCIe5A_VPP
P1-PCIe5B
P1-PCIe6A
P1-PCIe6B
Processor 1 PCIe 5.0 x8
P2-PCIe1A_VPP
P2-PCIe1B
P2-PCIe2A
P2-PCIe2B
P2-PCIe3A
P2-PCIe3B
P2-PCIe4A
P2-PCIe4B
P2-PCIe5A_VPP
P2-PCIe5B
P2-PCIe6A
P2-PCIe6B
Processor 2 PCIe 5.0 x8
FAN1~FAN10 4-pin System/CPU Fan Headers
JF1 Front Control Panel Header
SATA0~SATA1 SATA 3.0 Ports
S1 For System Conguration
11
Chapter 1: Introduction
Connector Description
JNCSI1~2 NCSI
JL1 Chassis Intrusion Header
JPW1~JPW4 Serverboard Main Power Supply Connector
GPU_PWR1~20 12V 8-pin Power Connector for Riser Card GPU
BP PWR1~3 12V 8-pin Power Connector for Backplane
JTPM1 Trusted Platform Module/Port 80 Connector
Note: Jumpers, connectors, switches, and LED indicators that are not described in the
preceding tables are for manufacturing testing purposes only, and are not covered in this
manual.
12
H13DSG-O-CPU User's Manual
Note: Table continues on the next page.
CPU
• Dual AMD EPYC TM 9004 series processors in SP5 sockets
Memory
• Up to 6TB registered ECC DDR5 4800 MT/s speed, LRDIMM memory in 24 slots
DIMM Size
• Up to 256GB
Chipset
• System on Chip (SoC)
Expansion Slots
• 128-Lane PCIe 5.0 p12-x8 MCIO interfaces to GPU baseboard
• 32-Lane PCIe 5.0 p12-x8 MCIO interfaces for GPU baseboard, NVMe or OCP NIC
• Up to 4 xNVMe (x4) ports
• OCP 3.0 NIC slot (AIOM slot) with NCSI interface
Network
• ATEN IPMI from ASPEED BMC for one gigabit RJ45 port via AOM-PTG-I2T
• OCP 3.0 NIC slot with NCSI interface via AIOM slot
Graphics
• Aspeed AST2600 BMC chip with one VGA port via AOM-PTG-I2T
I/O Devices
• Two SATA 3.0 ports (SATA0~SATA1)
• Four NVMe ports
Peripheral Devices
• One USB 2.0 header for front control panel (USB2/3)
BIOS
• 256Mb SPI AMI BIOS ® SM Flash UEFI BIOS
• ACPI 6.4, SMBIOS 3.5 or later, Plug-and-Play (PnP), RTC (Real Time Clock) wakeup, Riser Card Auto-Detection Support
Power Management
• ACPI power management (S5)
• Wake-On-LAN
• Power-on mode for AC power recovery
Motherboard Features
13
Chapter 1: Introduction
System Health Monitoring
• Onboard voltage monitoring for +3.3V, +5V, +12V, +3.3VStb, +5Stb
• Onboard temperature monitoring for CPU, System, Memory, and Peripheral
• CPU Thermal Trip support
Fan Control
• Ten 4-pin fan headers
• Fan speed control
System Management
• IPMIView/SMCIPMITOOL/IPMICFG
• SuperDoctor® 5
• SDO/SPM/SSM/SUM-OOB/InBand
• Trusted Platform Module (TPM) support
LED Indicators
• CPU / System Overheating
• Power / Suspend-state Indicator
• Fan Failure
• UID / Remote UID
Dimensions
• 17" (W) x 14.7" (L), (431.80 mm x 373.38 mm)
Note: The CPU maximum thermal design power (TDP) is subject to chassis and heatsink
cooling restrictions. For proper thermal management, please check the chassis and heatsink
specications for proper CPU TDP sizing.
14
H13DSG-O-CPU User's Manual
Figure 1-2. System Block Diagram
Block Diagram
Note: This is a general block diagram and may not exactly represent the features on your
motherboard. See the previous pages for the actual specications of your motherboard.
PE1
VCCP1
PE4
PE3
XXXX
xGMI1
WLAF
Socket 00ID xGMI0
CPU 1 (P0)
xGMI2
PE0
xGMI3
PE0
WLAF
PE4 1PE
CPU 2 (P1)
Socket 00ID
XXXX
PE3
VCCP1
xGMI1
xGMI2
xGMI0
2 Link xGMI
1DPC*12
DIMM DDR5
DIMM DDR5
1DPC*12
DIMM DDR5
DIMM DDR5
CPU1 PCIe Gen5 Port0
CPU1 PCIe Gen5 Port1
CPU1 PCIe Gen5 Port3
CPU1 PCIe Gen5 Port4
PE5 G3BY1
1 LINK XGMI
USB+
eSPI
9QXL2001
CLK Gen
9QXL2001
CLK Gen
100MHz CLK
100Mhz CLK 100Mhz CLK
CPU1 PCIe Gen5 Port2
CPU2 PCIe Gen5 Port4
CPU2 PCIe Gen5 Port3
CPU2 PCIe Gen5 Port2
CPU2 PCIe Gen5 Port1
CPU2 PCIe Gen5 Port0
JIO1
JMC7A,B
PE2
PE2
JIO1
REAR I/O
VGA
COM
10GLAN
USB3
USB3
UID
For AIOM2
MISC
JAIOM2SB1
USB2
FW
SPI
SPI0
NCSI
BMC
AST2600
PHY VGA UART
eSPI
USB
DRAM
PCIe
6900C
CPLD
eSPI
EMMC
H26M41208HPR
DDR4
256M x16
SPI0
EMMC
PLD config backup
8 M
CPLD FW
ROM
32MB
BIOS ROM
for TPM header
2*5-1
JTPM1
BMC TPM
XXXX
BMC FW
ROM64MB
SPI SPI
eSPI
L-A HCmeML-A HCmeM
USB
USB2
J35,J36
USB2
CPU1 USB2.0 Port (0/1)
Sideband
USB3.Port(11)
USB3.Port(10)
AIOM Sideband
EMMC
EMMC
8G
1x4 *8
1x4 *2
FAN1~10
BoxHDer
JMC8A,B
JMC9A,B
JMC10A,B
PCIE G3 BY4
JMC4A,B
JMC1A,B
JMC3A,B
JMC2A,B
M.2 GEN3 BY4
JMC11A,B
xGMI3
JMC5A,B
ASM1061
Gen3 By 1
PE5 G3by1
VPP
VPP
VPP
VPP
VPP
MPLINK
MPLINK
MPLINK
MPLINK
MPLINK
MPLINK
MPLINK
WLAF (0)
PCIE G3 BY4
15
Chapter 1: Introduction
1.2 Processor and Chipset Overview
Built upon the functionality and capability of the AMD EPYC TM 9004 series processors in
SP5 sockets. The H13DSG-O-CPU motherboard oers maximum I/O expendability, energy
eciency, and data reliability in a 5-nm process architecture, and is optimized for embedded
storage solutions, networking applications, or cloud-computing platforms.
With support of the new microarchitecture 5nm process technology, the H13DSG-O-CPU
drastically increases system performance for a multitude of server applications.
The AMD EPYC TM 9004 series processors support the following features:
• ACPI Power Management Logic Support Rev. 6.4
• Adaptive Thermal Management/Monitoring
• PCIe 5.0 w/transfer rate of up to 32.0 GT/s and SATA 3.0 w/ transfer rate of up to 6.0 GB/s
• System Management Bus (SMBus) Specication Version 3.5 or later
1.3 Special Features
This section describes the health monitoring features of the H13DSG-O-CPU motherboard.
The motherboard has an onboard System Hardware Monitor chip that supports system health
monitoring.
Recovery from AC Power Loss
The Basic I/O System (BIOS) provides a setting that determines how the system will respond
when AC power is lost and then restored to the system. You can choose for the system to
remain powered o (in which case you must press the power switch to turn it back on), or
for it to automatically return to the power-on state. See the Advanced BIOS Setup section
for this setting. The default setting is Last State.
16
H13DSG-O-CPU User's Manual
1.4 System Health Monitoring
This section describes the health monitoring features of the H13DSG-O-CPU motherboard.
The motherboard has an onboard chip that supports system health monitoring. Once a voltage
becomes unstable, a warning is given or an error message is sent to the screen. The user
can adjust the voltage thresholds to dene the sensitivity of the voltage monitor.
Onboard Voltage Monitors
The onboard voltage monitor will continuously scan crucial voltage levels. Once a voltage
becomes unstable, it will give a warning or send an error message to the screen. Users can
adjust the voltage thresholds to dene the sensitivity of the voltage monitor. Real time readings
of these voltage levels are all displayed in BMC.
Fan Status Monitor with Firmware Control
PC health monitoring in the BIOS can check the RPM status of the cooling fans. The onboard
CPU and chassis fans are controlled by Thermal Management.
Environmental Temperature Control
The thermal control sensor monitors the CPU temperature in real time and will turn on the
thermal control fan whenever the CPU temperature exceeds a user-dened threshold. The
overheat circuitry runs independently from the CPU. Once the thermal sensor detects that
the CPU temperature is too high, it will automatically turn on the thermal fans to prevent the
CPU from overheating. The onboard chassis thermal circuitry can monitor the overall system
temperature and alert the user when the chassis temperature is too high.
Note: To avoid possible system overheating, please be sure to provide adequate airow to
your system.
System Resource Alert
This feature is available when used with SuperDoctor 5 ®. SuperDoctor 5 is used to notify the
user of certain system events. For example, you can congure SuperDoctor 5 to provide you
with warnings when the system temperature, CPU temperatures, voltages and fan speeds
go beyond a predened range.
17
Chapter 1: Introduction
1.5 ACPI Features
ACPI stands for Advanced Conguration and Power Interface. The ACPI specication denes
a exible and abstract hardware interface that provides a standard way to integrate power
management features throughout a computer system including its hardware, operating system
and application software. This enables the system to automatically turn on and o peripherals
such as network cards, hard disk drives and printers.
In addition to enabling operating system-directed power management, ACPI also provides a
generic system event mechanism for Plug and Play and an operating system-independent
interface for conguration control. ACPI leverages the Plug and Play BIOS data structures
while providing a processor architecture-independent implementation that is compatible with
Windows Server 2019 operating systems.
1.6 Power Supply
As with all computer products, a stable power source is necessary for proper and reliable
operation. It is even more important for processors that have high CPU clock rates. In areas
where noisy power transmission is present, you may choose to install a line lter to shield
the computer from noise. It is recommended that you also install a power surge protector to
help avoid problems caused by power surges.
1.7 Super I/O
The ASpeed AST2600 Super I/O provides one high-speed, 16550 compatible Universal
Asynchronous Receiver/Transmitter (UART), which support serial infrared communications.
This UART includes a send/receive FIFO, a programmable baud rate generator, complete
modem control capability and a processor interrupt system. This UART provides legacy speed
with baud rate of up to 115.2 Kbps as well as an advanced speed with baud rates of 250 K,
500 K, or 1 Mb/s, which support higher speed modems.
The Super I/O provides functions that comply with ACPI (Advanced Conguration and Power
Interface), which includes support of legacy and ACPI power management through the System
Management Interrupt (SMI) or System Control Interrupt (SCI). It also features auto power
management to reduce power consumption. The IRQs, DMAs and I/O space resources of
the Super I/O can be exibly adjusted to meet ISA PnP requirements, which support ACPI
and APM (Advanced Power Management).
18
H13DSG-O-CPU User's Manual
Chapter 2
Installation
2.1 Static-Sensitive Devices
Electrostatic Discharge (ESD) can damage electronic com ponents. To prevent damage to your
motherboard, it is important to handle it very carefully. The following measures are generally
sucient to protect your equipment from ESD.
Precautions
• Use a grounded wrist strap designed to prevent static discharge.
• Touch a grounded metal object before removing the board from the antistatic bag.
• Handle the board by its edges only; do not touch its components, peripheral chips, memory
modules or gold contacts.
• When handling chips or modules, avoid touching their pins.
• Put the motherboard and peripherals back into their antistatic bags when not in use.
• For grounding purposes, make sure that your chassis provides excellent conductivity be-
tween the power supply, the case, the mounting fasteners and the motherboard.
• Use only the correct type of CMOS onboard battery as specied by the manufacturer. Do
not install the CMOS battery upside down, which may result in a possible explosion.
Unpacking
The motherboard is shipped in antistatic packaging to avoid static damage. When unpacking
the motherboard, make sure that the person handling it is static protected.
19
Chapter 2: Installation
2.2 Motherboard Installation
All motherboards have standard mounting holes to t dierent types of chassis. Make sure
that the locations of all the mounting holes for both the motherboard and the chassis match.
Although a chassis may have both plastic and metal mounting fasteners, metal ones are
highly recommended because they ground the motherboard to the chassis. Make sure that
the metal standos click in or are screwed in tightly.
Philips Screwdriver (1) Standos (10)
Only if Needed
Philips Screws (10)
Tools Needed
Location of Mounting Holes
Notes:
1. To avoid damaging the motherboard and its components, please do not use a force
greater than 8 lb/inch on each mounting screw during motherboard installation.
2. Some components are very close to the mounting holes. Please take precautionary
measures to avoid damaging these components when installing the motherboard to the
chassis.
20
H13DSG-O-CPU User's Manual
Figure 2-1. Motherboard Mounting Holes
21
Chapter 2: Installation
Installing the Motherboard
Note: Always connect the power cord last, and always remove it before adding, removing,
or changing any hardware components. Install the I/O shield into the chassis.
1. Install the I/O shield into the back of the chassis.
2. Locate the mounting holes on the motherboard. See the previous page for the location.
3. Locate the matching mounting holes on the chassis. Align the mounting holes on the
motherboard against the mounting holes on the chassis.
4. Install standos in the chassis as needed.
5. Install the motherboard into the chassis carefully to avoid damaging other motherboard
components.
6. Using the Phillips screwdriver, insert a Phillips head #6 screw into a mounting hole on
the motherboard and its matching mounting hole on the chassis.
7. Repeat Step 5 to insert #6 screws into all mounting holes.
8. Make sure that the motherboard is securely placed in the chassis.
Note: Images displayed are for illustration only. Your chassis or components might look
dierent from those shown in this manual.
22
H13DSG-O-CPU User's Manual
2.3 Processor and Heatsink Installation
Warning: When handling the processor package, avoid placing direct pressure on the label
area of the fan.
Important:
• For the Processor/Heatsink installation you need to use a T20 screwdriver when opening/
closing the CPU socket.
• Always connect the power cord last, and always remove it before adding, removing or
changing any hardware components. Make sure that you install the processor into the
CPU socket before you install the CPU heatsink.
• If you buy a CPU separately, make sure that you use an AMD-certied multi-directional
heatsink only.
• Make sure to install the motherboard into the chassis before you install the CPU heatsink.
• When receiving a motherboard without a processor pre-installed, make sure that the plastic
CPU socket cap is in place and none of the socket pins are bent; otherwise, contact your
retailer immediately.
• Refer to the Supermicro website for updates on CPU support.
Installing the Processor and Heatsink
1. Unscrew the screw #1 holding down the force frame.
Screw #1
Force Frame
24
H13DSG-O-CPU User's Manual
External Cap
Carrier Frame/
CPU Package
4. Remove the external cap from the rail frame by pulling it upwards through the rail guides
on the rail frame.
5. The CPU package is shipped from the factory with the carrier frame pre-assembled.
Grip the handle of the carrier frame/CPU package assembly from its shipping tray, and
while gripping the handle, align the anges of the carrier frame onto the rails of the rail
frame so its pins will be at the bottom when the rail frame is lowered later.
6. Slide the carrier frame/CPU package downwards to the bottom of the rail frame. Ensure
the anges are secure on the rails as you lower it downwards.
PnP Cover Cap
25
Chapter 2: Installation
Rail Frame
Note: You can only install the CPU inside the socket in one direction with the handle at the
top. Make sure that it is properly inserted into the CPU socket before closing the rail frame
plate. If it doesn't close properly, do not force it as it may damage your CPU. Instead, open
the rail frame plate again, and double-check that the CPU is aligned properly.
7. Lift up the rail frame till it securely rests in upright position. Then remove the PnP cover
cap from the CPU socket below. Grip the two lift tabs marked "Remove" at the middle of
the cap and pull vertically upwards to remove the PnP cover cap.
Warning! The exposed socket contacts are extremely vulnerable and can be damaged easily.
Do not touch or drop objects onto the contacts and be careful removing the PnP cover cap and
when placing the rail frame over the socket.
26
H13DSG-O-CPU User's Manual
8. Gently lower the rail frame down onto the socket until the latches on the rail frame
engage with the socket housing and it rests in place. DO NOT force it into place!
9. The force frame is spring loaded and has to be held in place before it is secured.
Important: Use a torque screwdriver, set it at 12.5~15.0 kgfcm (10.85~13.01 lbf-in)
with a Torx T20 screw head bit, to prevent damage to the CPU.
27
Chapter 2: Installation
10. Place and re-screw the screw in the middle to the way you removed it. When nished,
the force frame will be secure over both the rail frame and CPU package.
11. After the force frame is secured and the CPU package is in place, now you must install
the heatsink to the frame. Lower the heatsink down till it rests securely over the six
screw holes on CPU package on the socket frame.
28
H13DSG-O-CPU User's Manual
Screw #2
Screw #3
Screw #1
12. Using a diagonal pattern, tighten the six screws down on the heatsink in a clockwise
fashion till it is secure. The heatsink will now be secured and you have nished installing
the processor and heatsink onto the motherboard. Repeat this procedure for any
remaining CPU sockets on the motherboard.
Screw #5
Screw #6
Screw #4
29
Chapter 2: Installation
Un-installing the Processor and Heatsink
1. Remove the heatsink attached to the top of the CPU package by reversing the
installation procedure.
2. Clean the thermal grease left by the heatsink on the CPU package lid to limit the risk of
it contaminating the CPU package land pads or contacts in the socket housing.
3. Unscrewing the plate and lift the force frame to the vertical position.
4. Lift the rail frame using the lift tabs near the front end of the rail frame. Note that the rail
frame is spring loaded, so be careful lifting it up into a vertical position.
5. Grip the handle of the carrier frame and pull upwards to extract it from the rail frame.
Return the carrier frame/CPU package to its original shipping container.
6. Grip the handle on the external cap and return it to the rail frame sliding it downwards
till it rests in the frame.
7. Gripping the rail frame, rotate it downwards till it rests above and locks over the socket
housing in its horizontal position.
8. Push and rotate down the force frame till it is over the external cap and rail frame into a
horizontal position.
9. While holding down the force frame, secure it back to the socket frame by securing
screw #1 in place.
30
H13DSG-O-CPU User's Manual
2.4 Memory Support and Installation
Note: Check the Supermicro website for recommended memory modules.
Important: Exercise extreme care when installing or removing DIMM modules to prevent
any possible damage.
Memory Support
The H13DSG-O-CPU supports up to 6TB of ECC DDR5 4800 MT/s speed, RDIMM/
LRDIMM/3DS memory in 24 slots. Refer to the table below for additional memory information.
Note: Check the Supermicro website for possible updates to memory support.
DIMM Population Guide
Type
Channel
F1 E1 D1 C1 B1 A1 G1 H1 I1 J1 K1 L1
When 1 CPU is installed
CPU1 & 1 DIMM CPU1 V
CPU1 & 2 DIMM CPU1 V V
CPU1 & 4 DIMM CPU1 V V V V
CPU1 & 6 DIMM CPU1 V V V V V V
CPU1 & 8 DIMM CPU1 V V V V V V V V
CPU1 & 10 DIMM CPU1 V V V V V V V V V V
CPU1 & 12 DIMM CPU1 V V V V V V V V V V V V
When 2 CPUs are installed
2 CPUs & 8 DIMMs
CPU1 V V V V
CPU2 V V V V
2 CPUs & 16 DIMMs
CPU1 V V V V V V V V
CPU2 V V V V V V V V
2 CPUs & 24 DIMMs
CPU1 V V V V V V V V V V V V
CPU2 V V V V V V V V V V V V
31
Chapter 2: Installation
Populating RDIMM/RDIMM 3DS DDR5 Memory Modules with
AMD EPYC TM 9004 series Processor
Type
DIMM Population Maximum DIMM Capacity
Maximum Frequency (MT/s)
DIMM1 1 Channel 12 Channels
RDIMM
1R (1 rank) 32GB 384GB 4800
2R (2 ranks) 64GB 768GB 4800
3DS RDIMM
2S2R (4 ranks) 128GB 1.5TB 4800
2S4R (8 ranks) 256GB 3TB 4800
32
H13DSG-O-CPU User's Manual
DIMM Module Population Sequence
There is no specic order or sequence required when installing memory modules. However
do keep the following in mind:
• It is recommended that DDR5 DIMM modules of the same type, size and speed should
be installed.
• Mixed DIMM speeds can be installed. However, all DIMMs will run at the speed of the
slowest DIMM.
• The motherboard will support odd-numbered modules (1 or 3 modules installed). However,
to achieve the best memory performance, fully populate the motherboard with validated
memory modules.
Figure 2-2. DIMM Numbering
P2-DIMMF1
P2-DIMME1
P2-DIMMD1
P2-DIMMC1
P2-DIMMB1
P2-DIMMA1
P2-DIMMG1
P2-DIMMH1
P2-DIMMI1
P2-DIMMJ1
P2-DIMMK1
P2-DIMML1
P1-DIMMA1
P1-DIMMB1
P1-DIMMC1
P1-DIMMD1
P1-DIMME1
P1-DIMMF1
P1-DIMML1
P1-DIMMK1
P1-DIMMJ1
P1-DIMMI1
P1-DIMMH1
P1-DIMMG1
33
Chapter 2: Installation
Press both ends
straight down into
the memory slot.
DIMM Installation
1. Insert the desired number of DIMMs into
the memory slots, see Memory Support
for details on momory population
guidelines.
2. Push the release tabs outwards on both
ends of the DIMM slot to unlock it.
3. Align the key of the DIMM module with
the receptive point on the memory slot.
4. Align the notches on both ends of the
module against the receptive points on
the ends of the slot.
5. Press both ends of the module straight
down into the slot until the module
snaps into place.
6. Press the release tabs to the lock
positions to secure the DIMM module
into the slot.
DIMM Removal
Press both release tabs on the ends of the
DIMM module to unlock it. Once the DIMM
module is loosened, remove it from the
memory slot.
Release Tabs
Notches
Receptive Point
Key
34
H13DSG-O-CPU User's Manual
2.5 Front Control Panel
JF1 contains header pins for various buttons and indicators located on a control panel at the
front of the chassis. This connector is designed specically for use with Supermicro chassis.
See the gure below for the descriptions of the front control panel buttons and LED indicators.
Figure 2-3. JF1 Header Pins
1 2
19 20
Power Switch
Reset Switch
Power Fail LED+
UID LED+
NIC2 LED+
NIC1 LED+
HDD LED+/UID Switch+
Power LED+
KEY, no pin
NMI Switch Shift
Ground
Ground
Ground
KEY, no pin
Power LED-
HDD LED-
NIC1 LED-
NIC2 LED-
UID LED-
Power Fail LED-
A C
A
C
A
C
H13DSG-O-CPU
REV:1.01
DESIGNED IN USA
BIOS LICENSE
BAR CODE IPMI CODE
M.2-H2
JNVVPP1
JNVI2C1
JNCSI2
MH16MH15
JPW1 JPW2 JPW4
JMCIO-RA2JMCIO-RA1
MH18
MH17
JBT1
J35
JTPM1
JNCSI1
JSLOT1
JIPMB2
JIPMB1
JPW_STBY1
JS12B JS12AJS11B JS11A JSL6A
JS10A
JSL5B
JS2A JS2B JS3A JS3B JS4A JS4B
JS7A
JS9B
JSL6B
JS1B
JS1A
JPWR1
JPWR2 JPWR4
JPWR3
JPWR6
JPWR5
JPWR8
JPWR7
JPWR10
JPWR9
JPWR12
JPWR11
JPWR14JPWR13
JPWR16JPWR15
JPWR18
JPWR17
JPWR20
JPWR19
JPW23
JPW22
JPW21
LED4
PWR1PWR3PWR4 PWR2
JF1
BT1
LED1
LED6
MH10MH9 MH11 MH12
MH7
MH2
MH1
MH6
CPU0
CPU1
J23J21J20J19J18 J17 J16 J15 J14 J13 J22 J24 J10
J9 J11J2 J7J6 J4 J3 J12J1J5 J8
JSYSID2
JSYSID3
JSYSID1
JL1
JPFR3
FAN7 FAN2
FAN1
FAN9
FAN8
FAN5
FAN6 FAN4
FAN3
FAN10
JSL5A
JS7B JS8A JS8B JS9A JS10B
UCB2/3 (2.0)
S1
A
C
LEDBMC1
35
Chapter 2: Installation
Power Switch
The Power Switch connection is located on pins 1 and 2 of JF1. Attach it to a hardware power
switch on the computer case to power on/o the system. To force the system to be powered
o, press the button for at least 4 seconds. Refer to the table below for pin denitions.
Power Switch
Pin Denitions (JF1)
Pin# Denition
1 Power Switch
2 Ground
Reset Switch
The Reset Switch connection is located on pins 3 and 4 of JF1. Attach it to a hardware reset
switch on the computer case to reset the system. Refer to the table below for pin denitions.
Reset Switch
Pin Denitions (JF1)
Pin# Denition
3 Reset Switch
4 Ground
Power Fail LED
The Power Fail LED connection is located on pins 5 and 6 of JF1.
Power Fail LED
Pin Denitions (JF1)
Pin# Denition
5 Power Fail LED+
6 Power Fail LED-
Power Fail LED
Status
LED State Status
Solid on Overheat
Fast Blinking Fan Fail
Slow Blinking Power Fail
36
H13DSG-O-CPU User's Manual
Unit Identier Switch/UID LED Indicator
A Unit Identier (UID) switch is located on the I/O backplane, and two UID LED indicators are
located on the serverboard. The rear UID LED is located next to the UID switch. The front
UID LED is located on pins 7 & 8 on the front control panel (JF1). When you press the UID
switch, both rear and front UID LED indicators will be turned on. Press the UID switch again
to turn o the LED indicators. The UID Indicators provide easy identication of a system unit
that may be in need of service.
Note: UID can also be triggered via IPMI on the serverboard. For more information on IPMI,
please refer to the IPMI User's Guide posted on our website at http://www.supermicro.com.
UID LED
Pin Denitions (JF1)
Pin# Denition
7 UID LED+
8 UID LED-
NIC1/NIC2 (LAN1/LAN2)
The NIC (Network Interface Controller) LED connection for LAN port 1 is located on pins 11
and 12 of JF1, and the LED connection for LAN Port 2 is on Pins 9 and 10. Attach the NIC
LED cables here to display network activity.
LAN1/LAN2 LED
Pin Denitions (JF1)
Pin# Denition
9 NIC2 LED+
10 NIC2 LED-
11 NIC1 LED+
12 NIC1 LED-
HDD LEED/UID Switch
The HDD LED/UID Switch connection is located on pins 13 and 14 of JF1. Attach a cable to
Pin 14 to show hard drive activity status. Attach a cable to Pin 13 to use UID switch. Refer
to the table below for pin denitions.
HDD LED
Pin Denitions (JF1)
Pin# Denition
13 HDD LED+/UID Switch+
14 HDD LED-
37
Chapter 2: Installation
Power LED
The Power LED connection is located on pins 15 and 16 of JF1. Attach a cable to Pin 15 and
Pin 16 to show system power status. Refer to the table below for pin denitions.
Power LED
Pin Denitions (JF1)
Pin# Denition
15 Power LED+
16 Power LED-
NMI Switch
The non-maskable interrupt switch header is located on pins 19 and 20 of JF1. Attach it to a
hardware NMI switch on the computer case to trigger the NMI. Refer to the table below for
pin denitions.
Power LED
Pin Denitions (JF1)
Pin# Denition
19 NMI Switch
20 Ground
39
Chapter 2: Installation
SATA Ports
The H13DSG-O-CPU has two SATA 3.0 ports (SATA0~1) that are supported by ASMEDIA
ASM1061.
Front Panel Connector (JF1)
JF1 contains various buttons and indicators that are normally located on a control panel at the
front of the chassis. The JF1 connector is designed specically for use with the Supermicro
chassis.
TPM Header/Port 80 Connector
A Trusted Platform Module (TPM)/Port 80 header is located at JTPM1 to provide TPM support
and Port 80 connection. Use this header to enhance system performance and data security.
Refer to the table below for pin denitions. Please go to the following link for more information
on the TPM: http://www.supermicro.com/manuals/other/TPM.pdf.
Trusted Platform Module Header
Pin Denitions
Pin# Pin#Denition Denition
1 2+3.3V SPI_CS#
3 4RESET# SPI_MISO
5 6SPI_CLK GND
7 8SPI_MOSI NC
9 +3.3V Stdby 10 SPI_IRQ#
40
H13DSG-O-CPU User's Manual
Headers
Chassis Intrusion
A Chassis Intrusion header is located at JL1 on the motherboard. Attach the appropriate cable
from the chassis to the header to inform you when the chassis is opened.
Chassis Intrusion
Pin Denitions
Pin# Denition
1 Intrusion Input+
2 Intrusion Input-
Fan Headers
There are ten fan headers on the motherboard. These are 4-pin fan headers; pins 1-3 are
backward compatible with traditional 3-pin fans. The onboard fan speeds are controlled by
Fan Mode in the BMC. When using Fan Mode setting, please use all 4-pin fans.
Fan Header
Pin Denitions
Pin# Denition
1 Ground (Black)
2 +12V (Red)
3 Tachometer (Yellow)
4 PWM control (Blue)
IPMB System Management Bus Header
A System Management Bus header for IPMI 2.0 is located at JIPMB1. Connect the appropriate
cable here to use the IPMB I2C connection on your system.
IPMB Header
Pin Denitions
Pin# Denition
1 Data
2 Ground
3 Clock
4 No Connection
41
Chapter 2: Installation
2.7 Jumper Settings
How Jumpers Work
To modify the operation of the motherboard, jumpers can be used to choose between optional
settings. Jumpers create shorts between two pins to change the function of the connector.
Pin #1 is identied with a square solder pad on the printed circuit board. See the diagram
below for an example of jumping pins 1 and 2. Refer to the motherboard layout page for
jumper locations.
Note: On two-pin jumpers, "Closed" means the jumper is on and "Open" means the jumper
is o the pins.
Connector
Pins
Jumper
Setting
3 2 1
3 2 1
CMOS Clear (JBT1)
JBT1 is used to clear CMOS, which will also clear any passwords. Instead of pins, this jumper
consists of contact pads to prevent accidentally clearing the contents of CMOS.
To Clear CMOS
1. First power down the system and unplug the power cord(s).
2. Remove the cover of the chassis to access the motherboard.
3. Remove the CMOS battery from the motherboard.
4. Short the CMOS pads with a metal object such as a small screwdriver for at least four
seconds.
5. Remove the screwdriver (or shorting device).
6. Re-install the CMOS battery on the motherboard.
7. Replace the cover, reconnect the power cord(s), and power on the system.
Note: Clearing CMOS will also clear all passwords.
Do not use the PW_ON connector to clear CMOS.
JBT1 contact pads
42
H13DSG-O-CPU User's Manual
UID LED Indicator (LED1)
A UID LED is located at LED1. The front UID LED is located on the front panel. When you
press the UID switch, both rear LED1 and front UID LED indicators will turn on. Press the
UID switch again to turn o the LED indicators. Use this UID Indicator to 'mark' the system,
so the system can be easily identied whether on the front or back (e.g., a system rack with
multiple units installed).
UID LEDLED Indicator
Color State Denition
Blue Solid On Unit Identied
None O UID O
2.8 LED Indicators
Onboard Power LED (LED6)
LED6 is an onboard power LED. When this LED is lit, it means system is in power-on state,
and the onboard power status is ok. Turn o the system and unplug the power cord before
removing or installing components.
Onboard Power LED Indicator
LED Color Denition
O System O (power cable not connected)
Green System On, Power OK
BMC Heartbeat LED (LEDBMC1)
A BMC Heartbeat LED is located at LEDBMC1 on the motherboard. When this LED is blinking,
the BMC is functioning normally. See the table below for more information.
BMC Heartbeat LED State
Color State Denition
Green Solid On BMC is not ready.
Green Blinking BMC Normal
Green Fast Blinking BMC: Initializing
M.2 Active LEDs (LED4)
The M.2 Interface Detection LED indicate that an M.2 interface is detected, active, and
working correctly.
Note: M.2 SATA devices are not supported, but these LEDs turns on (green light) when they
are installed.
UID LED Status
LED Color Denition
O O (Normal)
Green On (Device active or a M.2 SATA device detected)
Chapter 3: Troubleshooting
43
Chapter 3
Troubleshooting
3.1 Troubleshooting Procedures
Use the following procedures to troubleshoot your system. If you have followed all of the
procedures below and still need assistance, refer to the ‘Technical Support Procedures’ and/
or ‘Returning Merchandise for Service’ section(s) in this chapter. Always disconnect the AC
power cord before adding, changing or installing any non hot-swap hardware components.
Before Power On
1. Check that the BMC_HB LED is blinking before the motherboard is turned on.
2. Check that the PWROK LED on the motherboard is on.
3. Make sure that the power connector is connected to your power supply.
4. Make sure that no short circuits exist between the motherboard and chassis.
5. Disconnect all cables from the motherboard, including those for the keyboard and
mouse.
6. Remove all add-on cards.
7. Install a CPU, a heatsink*, and at least one DIMM on the motherboard. Check all jumper
settings properly. *Make sure that the heatsink is fully seated.
8. Use the correct type of onboard CMOS battery (CR2032) as recommended by the
manufacturer. To avoid possible explosion, do not install the CMOS battery upside down.
No Power
1. Make sure that no short circuits exist between the motherboard and the chassis.
2. Verify that all jumpers are set to their default positions.
3. Check that the 115V/230V switch on the power supply is properly set.
4. Turn the power switch on and o to test the system
5. The CMOS battery on your motherboard may be old. Check to verify that it still supplies
approximately 3VDC. If it does not, replace it with a new one.
H13DSG-O-CPU User's Manual
44
No Video
1. Check that the VGA cable is connected properly, and the monitor is on.
2. Check if you follow the guidelines to install the memory module (see DIMM Module
Population in chapter 2).
3. Reseat the memory DIMM module.
Note: If you are a system integrator, VAR or OEM, a POST diagnostics card is recommended.
System Boot Failure
If the system does not display POST (Power-On-Self-Test) or does not respond after the
power is turned on, check the following:
1. Clear the CMOS settings by unplugging the power cord and contacting both pads on the
CMOS Clear Jumper (JBT1). Refer to chapter 2.
2. Remove all components from the motherboard, especially the DIMM modules.
3. Turn on the system with only one DIMM module installed. If the system boots, check for
bad DIMM modules or slots by following the Memory Errors Troubleshooting procedure
in this Chapter.
Memory Errors
1. Make sure that the DIMM modules are properly and fully installed.
2. Conrm that you are using the correct memory. Also, it is recommended that you use
the same memory type and speed for all DIMMs in the system. See for Section 2.4
memory details.
3. Check for bad DIMM modules or slots by swapping modules between slots and noting
the results.
4. Check the power supply voltage 115V/230V switch.
What to do if the System is Losing the Setup Conguration
1. Make sure that you are using a high quality power supply. A poor quality power supply
may cause the system to lose the CMOS setup information. Refer to Section 1 for
details on power supplies.
2. The battery on your motherboard may be old. Check to verify that it still supplies
approximately 3VDC. If it does not, replace it with a new one.
3. If the above steps do not x the setup conguration problem, contact your vendor for
repairs.
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