Texas Instruments SN74LVC2G157DCUR Manual

Texas Instruments Ikke kategoriseret SN74LVC2G157DCUR

Læs gratis den danske manual til Texas Instruments SN74LVC2G157DCUR (27 sider) i kategorien Ikke kategoriseret. Denne vejledning er vurderet som hjælpsom af 24 personer og har en gennemsnitlig bedømmelse på 4.4 stjerner ud af 12.5 anmeldelser. Har du et spørgsmål om Texas Instruments SN74LVC2G157DCUR, eller vil du spørge andre brugere om produktet?

Download PDF

Side 1/27

A/B

Product

Folder

Order

Now

Technical

Documents

Tools &

Software

Support &

Community

Reference

Design

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

SN74LVC2G157

SCES207N – APRIL 1999 – REVISED MARCH 2019

SN74LVC2G157 Single 2-Line to 1-Line data selector multiplexer

1 Features

• Available in the Texas Instruments

NanoFree™ package

• Supports 5-V VCC operation

• Inputs accept voltages to 5.5 V

• Max tpd of 6 ns at 3.3 V

• Low power consumption, 10-µA Maximum I CC

• ±24-mA Output drive at 3.3 V

• Typical VOLP (Output ground bounce)

<0.8 V at VCC = 3.3 V, TA= 25°C

• Typical VOHV (Output VOH undershoot)

>2 V at VCC = 3.3 V, TA= 25°C

• Io Supports live insertion, partial-power-down

mode, and back-drive protection

• Can be used as a down translator to translate

inputs from a maximum of 5.5 V down

to the VCC Level

• Latch-up performance exceeds 100 mA per

JESD 78, Class II

• ESD Protection exceeds JESD 22

– 2000-V Human body model (A114-A)

– 1000-V Charged-device model (C101)

2 Applications

• Barcode scanner

• Cable solutions

• E-books

• Embedded PC

• Field transmitter: temperature or pressure sensors

• Fingerprint biometrics

• HVAC: Heating, ventilating, and air conditioning

• Network-attached storage (NAS)

• Server motherboard and PSU

• Software dened radio (SDR)

• TV: High denition (HDTV), LCD, and digital

• Video communications systems

• Wireless data access cards, headsets, keyboards,

mice, and LAN cards

3 Description

This single 2-line to 1-line data selector multiplexer is

designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC2G157 device features a common

strobe (G) input. When the strobe is high, Y is low

and Y is high. When the strobe is low, a single bit is

selected from one of two sources and is routed to the

outputs. The device provides true and complementary

data.

NanoFree™ package technology is a major

breakthrough in IC packaging concepts, using the die

as the package.

This device is fully specied for partial-power-down

applications using Io. The Io circuitry disables the

outputs, preventing damaging current backow

through the device when it is powered down.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

SN74LVC2G157DCT SSOP (8) 2.95 mm × 2.80 mm

SN74LVC2G157DCU VSSOP (8) 2.30 mm × 2.00 mm

SN74LVC2G157YZP DSBGA (8) 1.91 mm × 0.91 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

Logic Diagram (Positive Logic)

SN74LVC2G157

SCES207N – APRIL 1999 – REVISED MARCH 2019

www.ti.com

Product Folder Links: SN74LVC2G157

Table of Contents

1 Features .................................................................. 1

2 Applications ........................................................... 1

3 Description ............................................................. 1

4 Revision History..................................................... 2

5 Pin Conguration and Functions ......................... 3

6 Specications......................................................... 4

6.1 Absolute Maximum Ratings ...................................... 4

6.2 ESD Ratings.............................................................. 4

6.3 Recommended Operating Conditions ...................... 4

6.4 Thermal Information.................................................. 5

6.5 Electrical Characteristics .......................................... 5

6.6 Switching Characteristics ......................................... 6

6.7 Operating Characteristics.......................................... 6

6.8 Typical Characteristics .............................................. 6

7 Parameter Measurement Information .................. 7

8 Detailed Description .............................................. 8

8.1 Overview ................................................................... 8

8.2 Functional Block Diagram ......................................... 8

8.3 Feature Description................................................... 8

8.4 Device Functional Modes.......................................... 9

9 Application and Implementation ........................ 10

9.1 Application Information............................................ 10

9.2 Typical Application ................................................. 10

10 Power Supply Recommendations ..................... 12

11 Layout................................................................... 12

11.1 Layout Guidelines ................................................. 12

11.2 Layout Example .................................................... 13

12 Device and Documentation Support ................. 14

12.1 Documentation Support ........................................ 14

12.2 Community Resources.......................................... 14

12.3 Trademarks ........................................................... 14

12.4 Electrostatic Discharge Caution ............................ 14

12.5 Glossary ................................................................ 14

13 Mechanical, Packaging, and Orderable

Information ........................................................... 14

4 Revision History

NOTE: Page numbers for previous revisions may dier from page numbers in the current version.

Changes from Revision M (June 2015) to Revision N Page

• Changed YZP package pinout drawing to match mechanical data drawing; and, pin functions description for clarity ........ 3

• Added additional thermal metrics for all packages................................................................................................................. 5

• Added detailed feature description sections for Standard CMOS Inputs, Balanced High-Drive CMOS Push-Pull

Outputs, and Negative Clamping Diodes. .............................................................................................................................. 8

• Added improved Design Requirements and Detailed Design Procedure............................................................................. 10

• Changed verbiage to better reect recommendations for this specic device rather than logic devices in general............ 12

• Added layout example for the YZP package. ....................................................................................................................... 12

Changes from Revision L (January 2014) to Revision M Page

• Added table.......................................................................................................................................................ESD Ratings 4

• Added ..........................................................................................................................................Thermal Information table. 5

• Added ................................................................................................................................................Typical Characteristics 6

• Added section.....................................................................................Mechanical, Packaging, and Orderable Information 14

Changes from Revision K (January 2007) to Revision L Page

• Updated document to new TI data sheet format. ................................................................................................................... 1

• Removed table .....................................................................................................................................Ordering Information 1

• Updated ...................................................................................................................................................................Features 1

• Added table .............................................................................................................................................Device Information 1

Produkt Specifikationer

Mærke:	Texas Instruments
Kategori:	Ikke kategoriseret
Model:	SN74LVC2G157DCUR
Type:	Logisk kredsløb
Bredde:	2.1 mm
Dybde:	2.4 mm
Højde:	0.8 mm
Antal pr. pakke:	3000 stk
Pakkedybde:	180 mm
Pakkebredde:	180 mm
Pakkehøjde:	18 mm
Opbevaringstemperatur (T-T):	-65 - 150 °C
Driftstemperatur (T-T):	-40 - 85 °C
Pakketype:	VSSOP
Antal stifter:	8
Bredde (med stifter):	2.1 mm
Højde (med stifter):	0.9 mm
Dybde (med stifter):	3.2 mm