PCE Instruments PCE-UFD 50 Manual

PCE Instruments Måling PCE-UFD 50

Læs gratis den danske manual til PCE Instruments PCE-UFD 50 (44 sider) i kategorien Måling. Denne vejledning er vurderet som hjælpsom af 39 personer og har en gennemsnitlig bedømmelse på 4.9 stjerner ud af 20 anmeldelser. Har du et spørgsmål om PCE Instruments PCE-UFD 50, eller vil du spørge andre brugere om produktet?

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User Manual

Ultrasonic Flaw Detector

PCE-UFD 50

Ultrasonic Flaw Detector

Contents

Chapter 1 Preface ............................................................................................................................................................. 4

1.1 Statement ........................................................................................................................................................... 4

1.2 Security .............................................................................................................................................................. 4

1.3 Features .............................................................................................................................................................. 4

1.4 Indicator ............................................................................................................................................................. 5

1.5 Convention ......................................................................................................................................................... 6

Chapter 2 Use of the Instrument ...................................................................................................................................... 7

2.1 Overview ........................................................................................................................................................... 7

2.1.1 Names of parts ................................................................................................................................................ 7

2.1.2 Operation Keyboard Description .................................................................................................................... 7

2.1.3 Power Usage ................................................................................................................................................... 8

2.1.4 Probe Connection ............................................................................................................................................ 9

2.2 Instrument Operation ......................................................................................................................................... 9

2.2.1 The basic operating procedure ........................................................................................................................ 9

2.2.2 Starting the instrument .................................................................................................................................. 10

2.2.3 Sceeen Display Description .......................................................................................................................... 10

2.2.4 Function Overview ....................................................................................................................................... 11

2.2.5 Basic Operation Method ............................................................................................................................... 12

Chapter 3 Function Description and Operation Method ................................................................................................ 14

3.1 Ajustment of BASE roupＧ ........................................................................................................................... 14

3.1.1 Detection Range(RANGE) ........................................................................................................................... 14

3.1.2 Material Velocity(MTLVEL) ........................................................................................................................ 14

3.1.3 Display Starting Point(D-DELAY) ............................................................................................................... 15

3.1.4 Thickness of Workpiece(T-VALUE) ............................................................................................................. 15

3.2 Adjustment of PROBE Group.......................................................................................................................... 15

3.2.1 PROBE TYPE/PROBE POS ........................................................................................................................ 16

3.2.2 Probe Angle(ANGLE)/Probe K Value(K-VALUE) ...................................................................................... 16

3.2.3 P-DELAY/X-VALUE ................................................................................................................................... 17

3.2.4 X-COORD/PART DIA ................................................................................................................................. 17

3.3 Adjustments of channel settings ...................................................................................................................... 18

3.3.1 Channel Settings ........................................................................................................................................... 18

3.3.2 SET COPY ................................................................................................................................................. 18

3.3.3 Saving Settings(SAVE)/Modify Settings(Modify) ....................................................................................... 18

3.3.4 Delete Settings(DELETE) ............................................................................................................................ 19

3.4 Adjustment of MEM Group ............................................................................................................................. 19

3.4.1 Function group MEM(DATA NO.) ............................................................................................................... 20

3.4.2 Recalling the data (RECALL) ...................................................................................................................... 20

3.4.3 SAVE ............................................................................................................................................................ 20

3.4.4 DELETE ....................................................................................................................................................... 21

3.5 Adjustment of GATE Group ............................................................................................................................ 21

3.5.1 GATE LOGIC/ALARM ............................................................................................................................... 21

3.5.2 Starting point of gates(aSTART/bSTART) ................................................................................................... 22

3.5.3 Width of gates(aWIDTH/bWIDTH) ............................................................................................................. 22

3.5.4 Measurement threshold(aTHRESH/bTHRESH) .......................................................................................... 22