Supermicro SuperServer SYS-730A-I Manual
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USER’S MANUAL
Revision 1.0
SuperWorkstation®
SYS-730A-I
The information in this User’s Manual has been carefully reviewed and is believed to be accurate. The vendor assumes
no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update
or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note:
For the most up-to-date version of this manual, please see our website at www.supermicro.com.
Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual
at any time and without notice. This product, including software and documentation, is the property of Supermicro and/
or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except
as expressly permitted by the terms of said license.
IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,
SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT
OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER
MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED
OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,
INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.
Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the
State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution
of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.
FCC Statement: This equipment has been tested and found to comply with the limits for a Class A or Class B digital
device pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against
harmful interference when the equipment is operated in industrial environment for Class A device or in residential
environment for Class B device. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the manufacturer’s instruction manual, may cause harmful interference with
radio communications. Operation of this equipment in a residential area is likely to cause harmful interference, in
which case you will be required to correct the interference at your own expense.
California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only
to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply.
See ”.
www.dtsc.ca.gov/hazardouswaste/perchlorate
WARNING: This product can expose you to chemicals including
lead, known to the State of California to cause cancer and birth
defects or other reproductive harm. For more information, go
to www.P65Warnings.ca.gov.
!
The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment,
nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical
systems whose failure to perform be reasonably expected to result in signicant injury or loss of life or catastrophic
property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products
for use in such ultra-hazardous applications, it does so entirely at its own risk. Furthermore, buyer agrees to fully
indemnify, defend and hold Supermicro harmless for and against any and all claims, demands, actions, litigation, and
proceedings of any kind arising out of or related to such ultra-hazardous use or sale.
Manual Revision 1.0
Release Date: November 05, 2021
Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this
document. Information in this document is subject to change without notice. Other products and companies referred
to herein are trademarks or registered trademarks of their respective companies or mark holders.
Copyright © 2021 by Super Micro Computer, Inc.
All rights reserved.
Printed in the United States of America
3
Preface
Preface
About this Manual
This manual is written for professional system integrators and PC technicians. It provides
information for the installation and use of the system. Installation and maintenance should
be performed by experienced technicians only.
Please refer to the SYS-730A-I system specications page on our website for updates on
supported memory, processors and operating systems (http://www.supermicro.com).
Notes
For your system to work properly, please follow the links below to download all necessary
drivers/utilities and the user’s manual for your system.
• Supermicro product manuals: http://www.supermicro.com/support/manuals/
• Product drivers and utilities: https://www.supermicro.com/wdl/driver/
• Product safety info: http://www.supermicro.com/about/policies/safety_information.cfm
If you have any questions, please contact our support team at:
support@supermicro.com
This manual may be periodically updated without notice. Please check the Supermicro website
for possible updates to the manual revision level.
Secure Data Deletion
A secure data deletion tool designed to fully erase all data from storage devices can be found
on our website: https://www.supermicro.com/about/policies/disclaimer.cfm?url=/wdl/utility/
Lot9_Secure_Data_Deletion_Utility/
Warnings
Special attention should be given to the following symbols used in this manual.
Warning! Indicates high voltage may be encountered when performing a procedure.
Warning! Indicates important information given to prevent equipment/property damage
or personal injury.
4
Preface
Contents
Chapter 1 Introduction
1.1 Overview ...............................................................................................................................8
1.2 System Features ..................................................................................................................9
Front View ...........................................................................................................................9
Control Panel .................................................................................................................10
Rear View ..........................................................................................................................11
1.3 Motherboard Layout ...........................................................................................................12
Quick Reference Table ......................................................................................................13
Motherboard Block Diagram .............................................................................................15
Chapter 2 System Installation
2.1 Overview .............................................................................................................................16
2.2 Unpacking the System .......................................................................................................16
2.3 Preparing for Setup ............................................................................................................16
Choosing a Setup Location ...............................................................................................16
Workstation Precautions ...................................................................................................16
Chapter 3 Maintenance and Component Installation
3.1 Removing Power ...............................................................................................................18
3.2 Accessing the System ........................................................................................................19
3.3 Motherboard Components ..................................................................................................20
Processor and Heatsink Installation ..................................................................................20
ESD Precautions ...........................................................................................................20
The 3rd Gen Intel Xeon Scalable Processor ...................................................................21
Overview of the CPU Socket ............................................................................................24
Overview of the Processor Carrier Assembly ...................................................................25
Overview of the Processor Heatsink Module ....................................................................26
Creating the Processor Carrier Assembly .........................................................................27
Creating the Processor Heatsink Module (PHM) ..............................................................29
Preparing the CPU Socket for Installation ........................................................................30
Preparing to Install the Processor Heatsink Module (PHM) into the CPU Socket ...........31
Installing the Processor Heatsink Module (PHM) ............................................................32
Removing the Processor Heatsink Module from the CPU Socket ...................................34
Removing the Carrier Assembly from the Processor Heatsink Module (PHM) ................35
Removing the Processor from the Processor Carrier Assembly ......................................36
5
Preface
3.4 Memory ...............................................................................................................................37
DDR4 Memory Population Guideline ................................................................................38
Intel Optane PMem 200 Series .........................................................................................39
DIMM Installation ..............................................................................................................40
DIMM Removal .................................................................................................................41
3.5 Expansion Card Installation ...............................................................................................42
Installing an M.2 Solid State Drive ....................................................................................42
PCI Expansion Card Installation .......................................................................................43
3.6 Motherboard Battery ...........................................................................................................44
3.7 Storage Drives ....................................................................................................................45
3.8 System Cooling ..................................................................................................................50
Fans ..................................................................................................................................50
3.9 Power Supply .....................................................................................................................52
Chapter 4 Motherboard Connections
4.1 Power Connections ............................................................................................................53
4.2 Headers and Connectors ...................................................................................................54
Control Panel .................................................................................................................58
4.3 Input/Output Ports ..............................................................................................................61
4.4 Jumpers ..............................................................................................................................64
4.5 LED Indicators ....................................................................................................................66
Chapter 5 Software
5.1 Microsoft Windows OS Installation .....................................................................................68
5.2 Driver Installation ................................................................................................................70
5.3 SuperDoctor® 5 ...................................................................................................................71
5.4 BMC ....................................................................................................................................72
BMC ADMIN User Password ............................................................................................72
Chapter 6 Optional Components
6.1 Optional Parts List ..............................................................................................................73
6.2 Additional Storage ..............................................................................................................73
6.3 TPM Security Module .........................................................................................................73
Chapter 7 Troubleshooting and Support
7.1 Information Resources .......................................................................................................74
Website .............................................................................................................................74
Direct Links for the SYS-730A-I System .......................................................................74
Direct Links for General Support and Information .......................................................74
6
Preface
7.2 BMC Interface ....................................................................................................................75
7.3 Troubleshooting Procedures .............................................................................................76
No Power ..........................................................................................................................76
No Video ...........................................................................................................................77
System Boot Failure .........................................................................................................77
Memory Errors ..................................................................................................................78
Losing the System's Setup Conguration .........................................................................78
When the System Becomes Unstable ..............................................................................78
7.4 BIOS Error Beep (POST) Codes .......................................................................................80
Additional BIOS POST Codes ..........................................................................................80
7.5 Crash Dump Using BMC ....................................................................................................81
7.6 UEFI BIOS Recovery .........................................................................................................82
Overview ...........................................................................................................................82
Recovering the UEFI BIOS Image ....................................................................................82
Recovering the Main BIOS Block with a USB Device ......................................................82
7.7 CMOS Clear .......................................................................................................................87
7.8 Where to Get Replacement Components ..........................................................................88
7.9 Reporting an Issue .............................................................................................................88
Technical Support Procedures ..........................................................................................88
Returning Merchandise for Service ...................................................................................88
Vendor Support Filing System ..........................................................................................89
7.10 Feedback ...........................................................................................................................89
Appendix A Standardized Warning Statements for AC Systems
Appendix B System Specications
7
Preface
7
Contacting Supermicro
Headquarters
Address: Super Micro Computer, Inc.
980 Rock Ave.
San Jose, CA 95131 U.S.A.
Tel: +1 (408) 503-8000
Fax: +1 (408) 503-8008
Email: marketing@supermicro.com (General Information)
support@supermicro.com (Technical Support)
Website: www.supermicro.com
Europe
Address: Super Micro Computer B.V.
Het Sterrenbeeld 28, 5215 ML
's-Hertogenbosch, The Netherlands
Tel: +31 (0) 73-6400390
Fax: +31 (0) 73-6416525
Email: sales@supermicro.nl (General Information)
support@supermicro.nl (Technical Support)
rma@supermicro.nl (Customer Support)
Website: www.supermicro.nl
Asia-Pacic
Address: Super Micro Computer, Inc.
3F, No. 150, Jian 1st Rd.
Zhonghe Dist., New Taipei City 235
Taiwan (R.O.C)
Tel: +886-(2) 8226-3990
Fax: +886-(2) 8226-3992
Email: support@supermicro.com.tw
Website: www.supermicro.com.tw
Preface
8
Chapter 1: Introduction
Chapter 1
Introduction
1.1 Overview
This chapter provides a brief outline of the functions and features of the SuperWorkstation
SYS-730A-I. The following provides an overview of the specications and capabilities.
System Overview
Motherboard X12DAi-N6
Chassis CSE-735D4-1K26B
Processor
Support
Dual Intel Xeon 3rd Gen Intel Xeon Scalable Processors (Socket P+) with up to 40 cores and a
thermal design power (TDP) of up to 270W
Note: Refer to the motherboard specications pages on our website for updates to supported
processors. Certain CPU SKUs are conditionally supported. Please contact Supermicro Technical
Support for additional information about specialized system optimization.
Chipset Intel PCH C261A
Memory
Up to 4 TB of 3DS LRDIMM/LRDIMM/3DS RDIMM/RDIMM DDR4 (288-pin) ECC memory with
speeds of 3200/2933/2666 MHz in 16 memory slots and up to 4 TB of Intel Optane PMem 200
Series with speeds of up to 3200 MHz
Note: PMem 200 Series are supported on 3rd gen Intel Xeon Scalable Platinum, Gold
and selected Silver processors.
Drive Support
Four xed internal 3.5" SATA drive bays
Two onboard NVMe connectors (optional cables required for NVMe support)
One onboard VROC key header
Expansion Slots
One PCIe 4.0 x8 slot
Five PCIe 4.0 x16 slots
Two PCIe 4.0 x4 M.2 slots in the 2280 and 22110 form factors
Networking Two 1GbE ports
I/O Ports
Front: two USB 3.2 Gen 1 ports, one USB 3.2 Gen 2 Type-C port, one line-out port, one mic-in
port
Rear: four USB 3.2 Gen 1 ports, one USB 3.2 Gen 2 port, 7.1 HD Audio ports, one VGA port
Onboard: one serial COM header, one buzzer header, eight SATA headers
System Cooling
One rear fan
One front fan
Two CPU heatsinks (sold separately)
Power One PS2 1200W Multi-output 80+ Platinum power supply
Form Factor Mid-Tower (WxHxD) 7.6 x 16.7 x 21.2 in. (193 x 424 x 536 mm)
A Quick Reference Guide can be found on the product page of the Supermicro website.
9
Chapter 1: Introduction
1.2 System Features
The SYS-730A-I is a mid-tower system. It is useful for small/medium businesses, professional
video editing, or 3D modeling. The following views of the system display the main features.
Front View
Figure 1-1. Front View
System Features: Front
Feature Description
Lock Front Bezel Lock
5.25" Drive Bays For optional DVD-ROM drives or mobile rack module
Control Panel Front control panel with power button, LEDs, USB and audio ports
Control Panel
Lock
5.25" Drive Bays
11
Chapter 1: Introduction
Rear View
Figure 1-3. System: Rear View
System Features: Rear
Feature Description
Power Supply One PS2 1200W Multi-output 80+ Platinum power supply
Fan Internal cooling fan
Networking Two 1GbE LAN ports
USB Four rear USB 3.2 Gen 1 ports and one rear USB 3.2 Gen 2 port
VGA VGA port
Audio 7.1 HD Audio ports
Expansion Slots Six PCIe expansion slots
Power Supply
Fan
Expansion Slots
VGA Port
Four USB 3.2 Gen 1 Ports
LAN Ports
7.1 HD Audio Ports
USB 3.2 Gen 2 Port
CPU1 CPU2
Expansion Slot Locations
Item DescriptionSlot Name
1,3,5JPCIE1/3/5 PCIe 4.0 x16 slot (CPU1)
2,4JPCIE2/4 PCIe 4.0 x16 slot (CPU2)
6JPCIE6 PCIe 4.0 x8 slot (CPU2)
3
1
5
2
4
6
12
Chapter 1: Introduction
Figure 1-4. Motherboard Layout
1.3 Motherboard Layout
Below is a layout of the X12DAi-N6 motherboard with jumper, connector and LED locations
shown. See the table on the following page for descriptions. For detailed descriptions, pinout
information and jumper settings, refer to or the
Chapter 4 Motherboard Manual.
BAR CODE DESIGNED IN USA
MAC CODE
X12DAi-N
REV:1.01
BIOS LICENSE
JM2_2
MH18MH17
JM2_1
MH16MH15
HE ARTBE AT
BMC
FANA
JBT1
T-SGP O2
T-SGPIO1
BT1
JPWR3
J37
ATA4 SATA6
SATA5
SATA8
SATA7
SATA1 ATA3
SATA2
JPWR2JPWR1 JPWR4
JPRG1
JNVI2C
JPME1
JPL1
JWD1
JPL2
JD1
JVRM1JVRM2
JL1
JSPDIF_IN1
JSPDIF_OUT1
JTPM1
JA1
JRK1
LEDM1
LE4
LE7
JPI2C1
JVGA
FAN1
FAN2
FAN5
FAN6
FAN3FAN4
FAN7
JNCSI
JNVME1
JNVME2
JPCIE5JPCIE4JPCIE3JPCIE2JPCIE1
JF1
JUSBA
JSD1 JSD2
JUSB1
JP7
JUSB31_I1
JLAN1
JPCIE6
JAUDIO1
JIPMB1
RAID K
I-SATA5
I-SATA4
I-SATA3
I-SATA2
I-SATA1
I-SATA0
I-SATA6 I-SATA7
LAN/1/2
HD AUDIO
P2_NVME0/1
USB7(3.1)
LED
PWR
USB4(3.1)
P1_NVME0/1
USB5/6(3.0)
USB0/1/2/3(3.0)
VGA
COM1
CMOS CLEAR
TPM/PORT80JTPM1:
P1-DIMMB1
P1-DIMMA1
P1-DIMMD1
P1-DIMMC1
P1-DIMMG1
P1-DIMMF1
P1-DIMME1
P1-DIMMH1
P2-DIMMG1
P2-DIMMC1
P2-DIMMD1
P2-DIMMB1
P2-DIMMA1
P2-DIMME1
P2-DIMMF1
P2-DIMMH1
CPU2
CPU1
CPU1 SLOT1 PCI-E 4.0 X16
CPU2 SLOT2 PCI-E 4.0 X16
CPU1 SLOT3 PCI-E 4.0 X16
CPU2 SLOT4 PCI-E 4.0 X16
CPU1 SLOT5 PCI-E 4.0 X16
CPU2 SLOT6 PCI-E 4.0 X8
PCH
JA1
JNVI2C
JPRG1
JPCIE1
JPCIE2
JPCIE3
JPCIE4
JPCIE5
JPCIE6
COM1
JIPMB1
JWD1
LE7
JM2_2
JM2_1
JNVME2
LE4
JPME1
JVRM2
JVRM1
JTPM1
JRK1
JL1
I-SATA0
I-SATA2
JBT1
I-SATA4
J37
JSD1 JSD1
FANA
JD1
I-SATA1
I-SATA3
I-SATA5
BT1
JP7
T-SGPIO2
JNVME1
JUSB31_I1
FAN4
FAN3
P1-DIMMF1 P1-DIMMC1
CPU1
P1-DIMME1 P1-DIMMD1
P1-DIMMH1 P1-DIMMA1
P1-DIMMG1 P1-DIMMB1
JPI2C1
FAN2
FAN1
JPWR4
JF1
JPWR3
PWR_LED
JPWR2
JPWR1
I-SATA6
I-SATA7
T-SGPIO1
P2-DIMMF1
P2-DIMMG1
CPU2
P2-DIMME1
P2-DIMMH1
P2-DIMMH1
P2-DIMME1
P2-DIMMG1
P2-DIMMF1
JVGA
JUSB1JUSBA
FAN7
FAN5
FAN6
JPL2
LEDM1
JNCSI
JPL1
JSPDIF_OUT1
JSPDIF_IN1 JAUDIO1
JLAN1
13
Chapter 1: Introduction
Quick Reference Table
Jumper Description Default Setting
JBT1 CMOS Clear Open (Normal)
JPME1 ME Recovery Pins 1-2 (Normal)
JPL1 LAN1 Enable/Disable Pins 1-2 (Enabled)
JPL2 LAN2 Enable/Disable Pins 1-2 (Enabled)
JWD1 Watchdog Timer Pins 1-2 (Reset)
LED Description Status
LE4/LE7 M.2 LED Blinking Green: Device Working
LEDM1 BMC Heartbeat LED Blinking Green: BMC Normal
PWRLED Onboard Power LED Solid Green: Power On
Connector Description
Audio (JA1) HD Audio connector for front access
BT1 Onboard CMOS Battery
COM1 COM/Serial Port header for front access
FANA, FAN1 ~ FAN7, CPU/System cooling fan headers
I-SATA0/1/2/3/4/5 SATA 3.0 connection headers supported by the Intel PCH
I-SATA6, I-SATA7 SATA 3.0 connection headers with SATA DOM Power supported by the Intel PCH
J37 Front-accessible USB 3.2 Gen1 type A connector (USB 5/6)
JAUDIO1 Audio port on the I/O back panel
JD1 Speaker/buzzer header (use in conjunction with an external speaker/buzzer) (optional)
JF1 Front Control Panel Header
JIPMB1 4-pin BMC External I2C Header (for a BMC card)
JLAN1 (LAN1) Gigabit LAN (1G) Ethernet port on the IO back panel supported by PCH and BMC
JLAN1 (LAN2) Gigabit LAN (1G) Ethernet port on the IO back panel supported by PCH
JL1 Chassis Intrusion Header
JM2_1, JM2_2 M.2 PCIe 4.0 x4 Slot (Supports M-Key 2280 and 22110) supported by CPU1
JNCSI NCSI header
JNVI2C NVMe SMBus (I2C) headers used for PCIe hot-plug SMBus clock & data connections
JNVME1, JNVME2 NVMe PCIe 4.0 x8 ports (Note: When installing an NVMe device on a motherboard, please
be sure to connect JNVME1 rst for your system to work properly.)
JP7 USB header for card reader
JPCIE1/2/3/4/5 (slot 1-5) CPU PCIe 4.0 x16 slots (slot1/slot3/slot5 supported by CPU1, slot2/slot4 supported by
CPU2)
JPCIE6 (slot 6) CPU PCIe 4.0 x8 slot supported by CPU2
JPI2C1 Power System Management Bus (SMB) I2C Header
JPRG1 Complex-programmable logical device (CPLD) header
14
Chapter 1: Introduction
Connector Description
JPWR1, JPWR2, JPWR4 8-pin Power Connector
JPWR3 24-pin ATX Power Connector
JSPDIF_IN, JSPDIF_OUT SPDIF (Sony/Philips Digital Interconnect Format) Audio In/Out connectors
JTPM1 Trusted Platform Module/Port 80 Connector
JUSB1 (USB0/1/2/3) Back panel USB 3.2 Gen 1 ports
JUSBA (USB4) Back panel USB 3.2 Gen 2 type A port
JUSB31_l1 (USB7) Front accessible USB 3.2 Gen 2 header
JVGA VGA port on the I/O back panel
JVRM1 VRM SMB clock to BMC
JVRM2 VRM SMB data to BMC
JSD1, JSD2 SATA DOM (Disk-on-Module) power connectors 1/2
MH15, MH16, MH17, MH18 M.2 Mounting Holes
T-SGPIO1, T-SGPIO2 General Purpose Serial I/O ports
VROC (JRK1) Intel VROC RAID Key header for NVMe SSD
15
Chapter 1: Introduction
Figure 1-5. Motherboard Block Diagram
Motherboard Block Diagram
PCIe X16
PCIe X16 G4
SLOT 3
USB 2.0 X2
8~15
0~7
PCIe X2 G3
DDR4
P1
DDR4
2666/2933/3200
2666/2933/3200
CPU2-E1
#8
VR13HC
PCIe GEN4 X8
DDR4
#1
PCIe GEN4 X16
PCIe GEN4 X16
#1
CPU2-G1
P1
SlimSAS
CPLD
DDR4
PCIe X16
DDR4
PCIe TWO X4 G4
DDR4
2666/2933/3200
CPU1-A1
DDR4
2666/2933/3200
SPI
#3
PCIe GEN4 X16
PCIe X1 G2
DMI3
2666/2933/3200
2666/2933/3200
#0
#5
#4
PCIe GEN4 X16
CPU1-C1
#3
BIOS
#2
#2
2666/2933/3200
SPI
DDR4
PCIe GEN4 X16
PCIe GEN4 X8
PCIe X16 G4
P0
SLOT 2
ESPI
DDR4
UPI
CPU1-F1
UPI
10.4/11.2G
DDR4
PCIe X16 G4
PCIe TWO X4 G4
PCH
X12DAi-N6
SLOT 6
PECI:31
VR13HC
#1
TMP432 *2 (RT1/RT2)
2666/2933/3200
PVCCIN_CPU1 12V_STBY
2666/2933/3200
PCIe X16
DDR4
CPU2-C1
BMC
PCIe X8 G4
CPU2-F1
SPI
CPU1
CPU2-A1
UPI
SPI
2666/2933/3200
7+1 PHASE
270W
PCIe GEN4 X16
#0
PECI:30
SOCKET ID: SOCKET ID:0 1
PCIe X16 G4
CPU2-D1
2666/2933/3200
CPU2-H1
AST 0260
PVCCIN_CPU1 12V_STBY
DMI3
0~7
CPU1-G1
DDR4
2666/2933/3200
DDR4
7+1 PHASE
270W
2666/2933/3200
PCIe X16 G4
PCIe X8
USB 3.2 Gen 1
CPU2
SLOT 4
2666/2933/3200
CPU1-E1
BMC B t Fl hoo as
DDR4
2666/2933/3200
DMI X4
Temperature Sensor
UPI
CPU1-D1
6.0 Gb/S
#2
CPU1-H1
P2
#6
#3
P2
DDR4
PCIe X16
#7
SLOT 5
SLOT 1
P0
TPM HE ERAD
DDR4
DDR4
Debug Card
DDR4
2666/2933/3200
CPU1-B CPU2-B1 1
DDR4
PCIe X16
M.2_1
M.2_2
JNVME2
SlimSAS
0~7
PCIe TWO X4 G4
ALC888
1G LAN x 2
I210
USB
ASM 2314
USB 3.2 Gen 2
CPLD
FLASH
SATA
SATA
USB
JNVME1
DMI 3
#5
#9/#10 USB 2.0
LBG-R 1G
16
Chapter 2: System Installation
Chapter 2
System Installation
2.1 Overview
This chapter provides advice and instructions for unpacking and preparing your system for
setup. If your system is not already fully integrated with processors, system memory etc.,
refer to Chapter 3 for details on installing those specic components.
Caution: Electrostatic Discharge (ESD) can damage electronic components. To prevent such
damage to PCBs (printed circuit boards), it is important to use a grounded wrist strap, handle
all PCBs by their edges and keep them in anti-static bags when not in use.
2.2 Unpacking the System
Inspect the box in which the SuperWorkstation SYS-730A-I was shipped, and note if it was
damaged in any way. If any equipment appears damaged, le a damage claim with the carrier
who delivered it.
The system should be situated in a clean, dust-free area that is well ventilated. Avoid areas
where heat, electrical noise and electromagnetic elds are generated. It will also require a
grounded AC power outlet nearby. Be sure to read the precautions and considerations noted
in Appendix A.
2.3 Preparing for Setup
Please read this section in its entirety before you begin the installation.
Choosing a Setup Location
• The system should be situated in a clean, dust-free area that is well ventilated. Avoid areas
where heat, electrical noise and electromagnetic elds are generated.
• This product is not suitable for use with visual display workplace devices according to §2
of the German Ordinance for Work with Visual Display Units.
Workstation Precautions
•
Review the electrical and general safety precautions in Appendix A.
17
Chapter 2: System Installation
• Use a regulating uninterruptible power supply (UPS) to protect the workstation from power
surges, voltage spikes and to keep your system operating in case of a power failure.
• Allow the power supply units and components to cool before touching them.
• To maintain proper cooling, always keep all chassis panels closed when not being serviced.
18
Chapter 3: Maintenance and Component Installation
Chapter 3
Maintenance and Component Installation
This chapter provides instructions on installing and replacing main system components. To
prevent compatibility issues, only use components that match the specications and/or part
numbers given.
Installation or replacement of most components require that power rst be removed from the
system. Please follow the procedures given in each section.
3.1 Removing Power
Use the following procedure to ensure that power has been removed from the system.
1. Use the operating system to power down the system.
2. After the system has completely shut down, disconnect the AC power cords from the
power strip or outlet.
3. Disconnect the power cords from the power supply modules.
20
Chapter 3: Maintenance and Component Installation
3.3 Motherboard Components
Processor and Heatsink Installation
Note: The heatsink is sold separately and not included as part of the system.
The processor (CPU) and processor carrier should be assembled together rst to form
the processor carrier assembly. This will be attached to the heatsink to form the processor
heatsink module (PHM) before being installed into the CPU socket. Before installation, be
sure to perform the following steps below:
• Please carefully follow the instructions below given to avoid ESD-related damages.
• Unplug the AC power cords from all power supplies after shutting down the system.
• Check that the plastic protective cover is on the CPU socket and none of the socket pins
are bent. If they are, contact your retailer.
• When handling the processor, avoid touching or placing direct pressure on the LGA lands
(gold contacts). Improper installation or socket misalignment can cause serious damage
to the processor or CPU socket, which may require manufacturer repairs.
• Thermal grease is pre-applied on a new heatsink. No additional thermal grease is needed.
• Refer to the Supermicro website for updates on processor and memory support.
• All graphics in this manual are for illustrations only. Your components may look dierent.
ESD Precautions
• Use a grounded wrist strap designed to prevent static discharge.
• Touch a grounded metal object before removing the board from the antistatic bag.
• Handle the motherboard by its edges only; do not touch its components, peripheral chips,
memory modules or gold contacts.
• When handling chips or modules, avoid touching their pins.
• Put the motherboard and peripherals back into their antistatic bags when not in use.
• For grounding purposes, make sure that your computer chassis provides excellent conduc-
tivity between the power supply, the case, the mounting fasteners and the motherboard.
• Use only the correct type of onboard CMOS battery. Do not install the onboard battery
upside down to avoid possible explosion.
Chapter 3: Maintenance and Component Installation
21
The 3rd Gen Intel Xeon Scalable Processor
Processor Top View
= Cutout = CPU Key= Pin 1
Processor Top View
1. The 3rd Gen Intel Xeon Scalable Processor
22
Chapter 3: Maintenance and Component Installation
2. The Processor Carrier
Carrier Bottom View
Carrier Top View
Chapter 3: Maintenance and Component Installation
23
3. Heatsink
Note: The heatsink is sold separately and not included as part of the system. Exercise
extreme care when handling the heatsink. Pay attention to the edges of heatsink ns which
can be sharp! To avoid damaging the heatsink, please do not apply excessive force on the
ns when handling the heatsink.
24
Chapter 3: Maintenance and Component Installation
Overview of the CPU Socket
The CPU socket is protected by a plastic protective cover.
Plastic Protective Cover
CPU Socket
Chapter 3: Maintenance and Component Installation
25
Overview of the Processor Carrier Assembly
The processor carrier assembly contains a 3rd Gen Intel Xeon Scalable processor and a
processor carrier. Carefully follow the instructions given in the installation section to place a
processor into the carrier to create a processor carrier.
1. The 3rd Gen Intel Xeon Scalable Processor
Intel Processor (Bottom View)
2. Processor Carrier
3. Processor Carrier Assembly
Intel Processor Carrier Top View)
(with Processor Seated inside the Carrier)
26
Chapter 3: Maintenance and Component Installation
Overview of the Processor Heatsink Module
The Processor Heatsink Module (PHM) contains a heatsink, a processor carrier, and the
3rd Gen Intel Xeon Scalable Processor
1. Heatsink
2. Processor Carrier
3. The 3rd Gen Intel Xeon Scalable Processor
Bottom View
4. Processor Heatsink Module (PHM)
Chapter 3: Maintenance and Component Installation
27
Creating the Processor Carrier Assembly
The processor carrier assembly contains a 3rd Gen Intel Xeon Scalable processor and a
processor carrier.
To create the processor carrier assembly, please follow the steps below:
Note: Before installation, be sure to follow the instructions given on page 31.
1. Hold the processor with the LGA lands (with Gold CPU contacts) facing down. Locate
the small, gold triangle at the corner of the processor and the corresponding hollowed
triangle on the processor carrier as shown in the graphics below. Please note that the
triangle indicates Pin 1 location.
Pin 1
Pin 1
Latch
Latch
Processor (Reverse Side Up)
Carrier (Top Side Up)
CPU Key
CPU Key
Latch
Latch
2. First, turn over the processor carrier and locate Pin 1 on the CPU and Pin 1 on the
carrier. Then, turn the processor over with the processor reverse side (gold contacts)
facing up and locate CPU keys on the processor. Finally, locate the CPU keys and four
latches on the carrier as shown below.
28
Chapter 3: Maintenance and Component Installation
Lever
1. Locate the lever on the CPU socket and press the lever down as shown below.Using
2. Using Pin 1 as a guide, carefully align the CPU keys (A & B) on the processor against
the CPU keys on the carrier (a & b) as shown in the drawing below.
3. Once they are properly aligned, carefully place one end of the processor into the latch
marked 1 on the carrier, and place the other end of processor into the latch marked 2
1
2A
B Latch
Latch
a
CPU Key (on the
processor)
CPU Key (on the
carrier)
CPU Key (on the
processor)
CPU Key (on
the carrier) b
Chapter 3: Maintenance and Component Installation
29
Creating the Processor Heatsink Module (PHM)
After creating the processor carrier assembly, please follow the instructions below to mount
the processor carrier into the heatsink to form the processor heatsink module (PHM).
Note: If this is a new heatsink, the thermal grease has been pre-applied on the underside.
Otherwise, apply the proper amount of thermal grease.
1. Turn the heatsink over with the thermal grease, which is on the reverse side of the
heatsink, facing up. Pay attention to the two triangle cutouts (A, B) located at the
diagonal corners of the heatsink as shown in the drawing below.
2. Hold the processor carrier assembly top side (with thermal grease) facing up, and locate
the triangle on the CPU and the triangle on the carrier. (Triangle indicates Pin 1.)
3. Using Pin 1 as a guide, turn the processor carrier assembly over with the gold contacts
facing up. Locate Pin 1 (A) on the processor and Pin 1 (a) on the processor carrier
assembly "a".
4. Align the corner marked "a" on the processor carrier assembly against the triangle cutout
"A" on the heatsink, and align the corners marked "b", "c", "d" on processor assembly
against the corners marked "B", "C", "D" on the heatsinks
5. Once they are properly aligned, place the corner marked "a" on the processor carrier
assembly into the corner of the heatsink marked "A". Repeat the same step to place the
corners marked "b", "c", "d" on the processor carrier assembly into the corners of the
heatsink marked "B", "C", "D" making sure that all plastic clips are properly attached to
the heatsink.
A
B
C
D
a
b
c
d
Pin1
Processor Carrier Assembly
(Reverse Side View)
Heatsink
(Reverse Side View)
30
Chapter 3: Maintenance and Component Installation
Preparing the CPU Socket for Installation
This motherboard comes with a plastic protective cover installed on the CPU socket. Remove
it from the socket to install the Processor Heatsink Module (PHM). Gently pull up one corner
of the plastic protective cover to remove it.
1. Press the tabs inward.
2. Pull up the protective cover from the socket.
Chapter 3: Maintenance and Component Installation
31
Preparing to Install the Processor Heatsink Module (PHM) into
the CPU Socket
After assembling the Processor Heatsink Module (PHM), you are ready to install it into the
CPU socket. To ensure the proper installation, please follow the procedures below:
1. Locate four threaded fasteners (a, b, c, d) on the CPU socket.
Peek Nut
(Unlatched) (latched)
Rotating Wire
A, B, C, D: Peek Nut
1, 2, 3, 4: Rotating Wire
a, b, c, d: Threaded Fastener
Rotating Wire 3
Peek Nut
A
B
C
D
Rotating Wire 1
2
Rotating Wire 4
Threaded Fastener
a
b
c
d
(a, b, c, d: Threaded Fasteners) CPU Socket Pin1
CPU Socket
2. Locate four peek nuts (A, B. C. D) and four rotating wires (1, 2, 3, 4) on the heatsink as
shown in the graphics below.
3. Check the rotating wires (1, 2, 3, 4) to make sure that they are at unlatched positions as
shown in the drawing below before installing the PHM into the CPU socket.
CPU Socket
Heatsink
32
Chapter 3: Maintenance and Component Installation
1. Align peek nut "A", which is next to the triangle (Pin 1) on the heatsink, against threaded
fastener "a" on the CPU socket. Then align peek nuts "B", "C", "D" on the heatsink
against threaded fasteners "b", "c", "d" on the CPU socket, making sure that all peek
nuts on the heatsink are properly aligned with the correspondent threaded fasteners on
the CPU socket.
2. Once they are aligned, gently place the heatsink on top the CPU socket, making sure
that each peek nut is properly attached to its corresponding threaded fastener.
Installing the Processor Heatsink Module (PHM)
a, b, c, d:
Threaded Fastener on the CPU socket
A, B, C, D:
Peek Nut on the Heat-
sink
A
B
C
D
a
b
c
d
Rotating Wire
Rotating Wire
3. Press all four rotating wires outwards and make sure that the heatsink is securely
latched unto the CPU socket.
34
Chapter 3: Maintenance and Component Installation
Removing the Processor Heatsink Module from the CPU Socket
Before removing the processor heatsink module (PHM) from the motherboard, unplug the
AC power cord from all power supplies after shutting down the system. Then follow the steps
below:
1. Use a T30-bit screwdriver to loosen the four peek nuts on the heatsink in the sequence
of #A, #B, #C, and #D.
A
B
C
D
Pee
2. Once the peek nuts are loosened from the CPU socket, press the rotating wires inwards
to unlatch the PHM from the socket as shown in the drawings below.
3. Gently lift the PHM upwards to remove it from the CPU socket.
36
Chapter 3: Maintenance and Component Installation
Removing the Processor from the Processor Carrier Assembly
Once you have removed the processor carrier assembly from the PHM, you are ready to
remove the processor from the processor carrier by following the steps below.
1. Unlock the lever from its locking position and push the lever upwards to disengage the
processor from the processor carrier as shown in the right drawing below.
Lever
2. Once the processor is loosened from the carrier, carefully remove the processor from
the processor carrier.
Note: To avoid damaging the processor and its pins, please handle the processor with care.
Chapter 3: Maintenance and Component Installation
37
3.4 Memory
The X12DAi-N6 motherboard has 16 DIMM slots. It supports up to
• 4TB (DDR4 only): 3DS LRDIMM/LRDIMM/3DS RDIMM/RDIMM DDR4 (288-pin) ECC
memory with speeds of 3200/2933/2666 MHz.
• 4TB (PMem + DDR4): Intel Optane PMem 200 Series with speeds of up to 3200 MHz.
Notes: PMem 200 Series are supported on 3rd Gen Intel Xeon Scalable Platinum, Gold and
selected Silver processors. Memory speed support depends on the processors used in the
system.
DDR4 Memory Support for the 3rd Gen Intel Xeon Scalable Processors
Type Ranks Per DIMM &
Data Width
DIMM Capacity (GB)
Speed (MT/s); Voltage (V);
Slots Per Channel (SPC) and DIMMs Per Channel (DPC)
1DPC
(1-DIMM Per Chan-
nel)
2DPC
(2-DIMM Per Channel)
8Gb 16Gb 1.2 V 1.2 V
RDIMM
SRx8 8GB 16GB
3200 3200
SRx4 16GB 32GB
DRx8 16GB 32GB
DRx4 32GB 64GB
RDIMM 3Ds (4R/8R) X4 2H- 64 GB
4H-128 GB
2H- 128 GB
4H-256 GB
LRDIMM QRx4 64GB 128GB 3200 3200
LRDIMM - 3Ds (4R/8R) X4 4H-128 GB 2H- 128 GB
4H-256 GB 3200 3200
Key Parameters for DIMM Congurations
Parameters Possible Values
Number of Channels 8
Number of DIMMs per Channel 1DPC (1 DIMM Per Channel) or 2DPC (2 DIMMs Per Channel)
DIMM Type RDIMM (w/ECC), 3DS RDIMM, LRDIMM, 3DS LRDIMM
DIMM Construction non-3DS RDIMM Raw Cards: A/B (2Rx4), C (1Rx4), D (1Rx8), E (2Rx8)
3DS RDIMM Raw Cards: A/B (4Rx4)
non-3DS LRDIMM Raw Cards: D/E (4Rx4)
3DS LRDIMM Raw Cards: A/B (8Rx4)
Chapter 3: Maintenance and Component Installation
39
Intel Optane PMem 200 Series
•
Mode denitions: AD = App Direct Mode, MM = Memory Mode, AD+MM = Mixed Mode
• No mixing of PMem and NVDIMMs within the platform.
• For MM, NM/FM ratio is between 1:4 and 1:16. The capacity not used for FM can be used
for AD. (NM = Near Memory; FM = Far Memory).
• Matrix targets congs for optimized PMem to DRAM cache ratio in MM and MM + AD
modes.
• For each individual population, dierent PMem rearrangements among channels are per-
mitted so long as the conguration doesn’t break X12 DP Memory population rules.
• Ensure the same DDR4 DIMM type and capacity are used for each DDR4 + PMem popu-
lation.
• If the system detects an unvalidated cong, then the system issues a BIOS warning. The
CLI functionality is limited in non POR congurations, and select commands will not be
supported.
Note: PMem 200 Series are supported on 3rd Gen Intel Xeon Scalable Platinum, Gold and
selected Silver processors. PMem may only be supported under certain conditions, please
contact Supermicro technical support for additional information.
Validation Matrix (DDR4 DIMMS with PMem 200 Series)
DIMM Type
Ranks Per DIMM
& Data Width
(Stack)
DIMM Capacity (GB)
DRAM Density
8Gb 16Gb
RDIMM
(up to 3200)
1Rx8 N/A N/A
1Rx4 16GB 32GB
2Rx8 16GB 32GB
2Rx4 32GB 64GB
RDIMM 3DS
(up to 3200)
4Rx4 (2H) 128GBN/A
8Rx4 (4H) NA 256GB
LRDIMM (up to 3200) 4Rx4 64GB 128GB
LRDIMM 3DS
(up to 3200)
4Rx4 (2H) N/A N/A
8Rx4 (4H) 256GBN/A
CPU1 PMem Population on 16-DIMM Motherboard
DDR4 and
PMem Mode AD Interleave F1 E1 H1 G1 C1 D1 A1 B1
4 DDR4
4 PMem
AD
MM
One - x4 PMem PMem PMem PMemDDR4 DDR4 DDR4 DDR4
One - x4 DDR4 DDR4 DDR4 DDR4PMem PMem PMem PMem
6 DDR4
1 PMem AD One - x1
DDR4 DDR4 DDR4 DDR4 DDR4 DDR4-PMem
-DDR4 DDR4 DDR4 DDR4 DDR4 DDR4 PMem
DDR4 DDR4 DDR4 DDR4 DDR4 DDR4PMem -
PMem DDR4 DDR4 DDR4 DDR4 DDR4 DDR4 -
DDR4 DDR4 DDR4 DDR4 DDR4 DDR4-PMem
DDR4 DDR4 DDR4 DDR4 DDR4 DDR4-PMem
DDR4 DDR4 DDR4 DDR4 DDR4 DDR4PMem -
DDR4 DDR4 DDR4 DDR4 DDR4 DDR4PMem -
40
Chapter 3: Maintenance and Component Installation
DIMM Installation
1. Insert the desired number of DIMMs into the
memory slots based on the recommended DDR4-
only population table on page 38 or the DDR4 and
PMem table on page 39.
2. Push the release tabs outwards on both ends of
the DIMM slot to unlock it.
Notches
BAR CODE DESI GNE D I N USA
MAC CODE
X12DAi-N
REV:1.01
BIOS LICENSE
JM2_2
MH18MH17
JM2_1
MH16MH15
HEARTBEA T
BMC
FANA
JBT1
T-SGPI O 2
T-SGPI O 1
BT1
JPWR3
J37
S ATA4 S ATA6
S ATA5
SATA8
SATA7
S ATA1 S ATA3
S ATA2
JPWR2JPWR1 JPWR4
JPR G1
JNVI2C
JPME1
JPL1
JWD1
JPL2
JD1
JVRM1JVRM2
JL1
JSPDIF_IN1
JSPDIF_OUT1
JTPM1
JA1
JRK1
LEDM1
LE4
LE7
JPI2C1
JVG A
FAN1
FAN2
FAN5
FAN6
FAN3FAN4
FAN7
JNCSI
JNVME1
JNVME2
JPCIE5JPCIE4JPCIE3JPCIE2JPCIE1
JF1
JUSBA
JSD1 JSD2
JUSB1
JP7
JUSB31_I1
JLAN1
JPCI E6
JAUDIO1
JIPMB1
RAID KEY-1
I-SATA5
I-SATA4
I-SATA3
I-SATA2
I-SATA1
I-SATA0
I-SATA6 I-SATA7
LAN/1/2
HD AUDIO
P2_NVME0/1
USB7(3.1)
LED
PWR
USB4(3.1)
P1_N VME0/1
US B5/6(3.0)
USB0/1/2/3(3.0)
VGA
COM1
CM OS CLEAR
TPM/PORT80JTPM1:
P1-DIMMB1
P1-DIMMA1
P1-DIMMD1
P1-DIMMC1
P1-DIMMG1
P1-DIMMF1
P1-DIMME1
P1-DIMMH1
P2-DIMMG1
P2-DIMM C1
P2-DIMM D1
P2-DIMM B1
P2-DIMM A1
P2-DIMME1
P2-DIMMF1
P2-DIMMH1
CPU2
CPU1
CPU1 SLOT1 PCI-E 4.0 X16
CPU2 SLOT2 PCI-E 4.0 X16
CPU1 SLOT3 PCI-E 4.0 X16
CPU2 SLOT4 PCI-E 4.0 X16
CPU1 SLOT5 PCI-E 4.0 X16
CPU2 SLOT6 PCI-E 4.0 X8
PCH
3. Align the key of the DIMM module with the receptive point on the memory slot.
4. Align the notches on both ends of the module against the receptive points on the ends
of the slot.
Key
5. Push both ends of the module straight down into the slot until the module snaps into
place.
6. Press the release tabs to the lock positions to secure the DIMM module into the slot.
Chapter 3: Maintenance and Component Installation
41
DIMM Removal
Press both release tabs on the ends of the DIMM module to unlock it. Once the DIMM module
is loosened, remove it from the memory slot.
Warning! Please do not use excessive force when pressing the release tabs on the ends of the
DIMM socket to avoid causing any damage to the DIMM module or the DIMM socket. Please
handle DIMM modules with care.
Figure 3-2. DIMM Slots
BAR CODE DESIGNED IN USA
MAC CODE
X12DAi-N
REV:1.01
BIOS LICENSE
JM2_2
MH18MH17
JM2_1
MH16MH15
HEA RTBEAT
BMC
FANA
JBT1
T-SGPIO2
T-SGPIO1
BT1
JPWR3
J37
SATA4 SATA6
SATA5
SATA8
SATA7
SATA1 SATA3
SATA2
JPWR2JPWR1 JPWR4
JPRG1
JNVI 2C
JPME1
JPL1
JWD1
JPL2
JD1
JVRM1JVRM2
JL1
JSPDIF_IN1
JSPDIF_OUT1
JTPM1
JA1
JRK1
LEDM1
LE4
LE7
JPI2C1
JVGA
FAN1FAN2
FAN5
FAN6
FAN3FAN4
FAN7
JNCSI
JNVME1
JNVM 2
JPCIE5JPCIE4JPCIE3JPCIE2JPCIE1
JF1
JUSBA
JSD1 JSD2
JUSB1
JP7
JUSB31_I1
JLAN1
JPCIE6
JAUDIO1
JIPMB1
RAID KEY-1
I-SATA5
I-SATA4
I-SATA3
I-SATA2
I-SATA1
I-SATA0
I-SATA6 I-SATA7
LAN/1/2
HD AUDIO
P2_NVME0/1
USB7(3.1)
LED
PWR
USB4(3.1)
P1_NVM E0/1
U SB5/6(3.0)
USB0/1/2/3(3.0)
VGA
COM1
CMOS CLEAR
TPM /P ORT 80JT PM 1:
P1-DIMMB1
P1-DIMMA1
P1-DIMMD1
P1-DIMMC1
P1-DIMMG1
P1-DIMMF1
P1-DIMME1
P1-DIMMH1
P2-DIMMG1
P2-DIMMC1
P2-DIMMD1
P2-DIMMB1
P2-DIMMA1
P2-DIMME1
P2-DIMMF1
P2-DIMMH1
CPU2
CPU1
CPU1 SLOT1 PCI-E 4.0 X16
CPU2 SLOT2 PCI-E 4.0 X16
CPU1 SLOT3 PCI-E 4.0 X16
CPU2 SLOT4 PCI-E 4.0 X16
CPU1 SLOT5 PCI-E 4.0 X16
CPU2 SLOT6 PCI-E 4.0 X8
PCH
P2-DIMME1
P2-DIMMF1
P2-DIMMH1
P2-DIMMG1
P1-DIMMB1
P1-DIMMC1
P1-DIMMA1
P1-DIMMD1
P2-DIMMC1
P2-DIMMD1
P2-DIMMA1
P2-DIMMB1
P1-DIMMG1
P1-DIMMF1
P1-DIMMH1
P1-DIMME1
Rear Front
42
Chapter 3: Maintenance and Component Installation
Figure 3-3. M.2 Locations
Installing an M.2 Solid State Drive
The X12DAi-N6 can accommodate two M.2 solid state drives (SSDs). Each M.2 socket
supports NVMe PCIe 4.0 x4 (32 Gb/s) SSD cards in the 2280 or 22110 form factors. The
22110 form factor is recommended because the appropriate stando comes pre-installed on
the motherboard.
Caution: Use industry-standard anti-static equipment, such as gloves or wrist strap, and
follow precautions to avoid damage caused by ESD.
BAR CODE DESIGNED IN USA
MAC CODE
X12DAi-N
REV:1.01
BIOS LICENSE
JM2_2
MH18MH17
JM2_1
MH16MH15
HEA RTBEAT
BMC
FANA
JBT1
T-SGPIO2
T-SGPIO1
BT1
JPWR3
J37
SATA4 SATA6
SATA5
SATA8
SATA7
SATA1 SATA3
SATA2
JPWR2JPWR1 JPWR4
JPRG1
JNVI 2C
JPME1
JPL1
JWD1
JPL2
JD1
JVRM1JVRM2
JL1
JSPDIF_IN1
JSPDIF_OUT1
JTPM1
JA1
JRK1
LEDM1
LE4
LE7
JPI2C1
JVGA
FAN1FAN2
FAN5
FAN6
FAN3FAN4
FAN7
JNCSI
JNVME1
JNVM E2
JPCIE5JPCIE4JPCIE3JPCIE2JPCIE1
JF1
JUSBA
JSD1 JSD2
JUSB1
JP7
JUSB31_I1
JLAN1
JPCIE6
JAUDIO1
JIPMB1
RAID KEY-1
I-SATA5
I-SATA4
I-SATA3
I-SATA2
I-SATA1
I-SATA0
I-SATA6 I-SATA7
LAN/1/2
HD AUDIO
P2_NVME0/1
USB7(3.1)
LED
PWR
USB4(3.1)
P1_NVM E0/1
U SB5/6(3.0)
USB0/1/2/3(3.0)
VGA
COM1
CMOS CLEAR
TPM /P ORT 80JT PM 1:
P1-DIMMB1
P1-DIMMA1
P1-DIMMD1
P1-DIMMC1
P1-DIMMG1
P1-DIMMF1
P1-DIMME1
P1-DIMMH1
P2-DIMMG1
P2-DIMMC1
P2-DIMMD1
P2-DIMMB1
P2-DIMMA1
P2-DIMME1
P2-DIMMF1
P2-DIMMH1
CPU2
CPU1
CPU1 SLOT1 PCI-E 4.0 X16
CPU2 SLOT2 PCI-E 4.0 X16
CPU1 SLOT3 PCI-E 4.0 X16
CPU2 SLOT4 PCI-E 4.0 X16
CPU1 SLOT5 PCI-E 4.0 X16
CPU2 SLOT6 PCI-E 4.0 X8
PCH
Rear
JM2_2 JM2_1
Front
Note: JM2_2 cannot be used if a graphics card is installed in any of the PCIe slots 1-5.
3.5 Expansion Card Installation
44
Chapter 3: Maintenance and Component Installation
Warning: There is a danger of explosion if the onboard battery is installed upside down (which
reverses its polarities). This battery must be replaced only with the same or an equivalent type
recommended by the manufacturer (CR2032).
Figure 3-5. Installing the Onboard Battery
3.6 Motherboard Battery
The motherboard uses non-volatile memory to retain system information when system power
is removed. This memory is powered by a lithium battery residing on the motherboard.
Replacing the Battery
Begin by from the system.
removing power
1. Push aside the small clamp that covers the edge of the battery. When the battery is
released, lift it out of the holder.
2. To insert a new battery, slide one edge under the lip of the holder with the positive (+)
side facing up. Then push the other side down until the clamp snaps over it.
Note: Handle used batteries carefully. Do not damage the battery in any way; a damaged
battery may release hazardous materials into the environment. Do not discard a used battery
in the garbage or a public landll. Please comply with the regulations set up by your local
hazardous waste management agency to dispose of your used battery properly.
Chapter 3: Maintenance and Component Installation
45
3.7 Storage Drives
The SYS-730A-I supports four internal 3.5" SATA drives installed in a rotating cage. Additional
drives are supported by an optional mobile rack or an optional internal hard drive cage.
Release Tab (A)
HDD Cage (B)
2
2
1
3
Figure 3-6. Rotating the Internal Hard Drive Cage
Rotating the Hard Drive Cage
1. Begin by removing power from the system as described in Section 3.1 and remove the
side cover as described in Section 3.2.
2. Lift the release tab located at the top of the hard drive cage.
3. Rotate the hard drive cage 90 degrees so the drive carriers are facing outward.
46
Chapter 3: Maintenance and Component Installation
1
5
Release Tabs
1
4
Figure 3-7. Remove a Drive Carrier from the Cage
Removing and Installing 3.5" Hard Drives
1. Begin by removing power from the system as described in Section 3.1 and remove the
side cover as described in Section 3.2.
2. Rotate the hard drive cage outward.
3. Disconnect all of the cables from the hard drive.
4. Press the release tab on the side of the hard drive carrier.
5. Slide the hard drive carrier out of the cage.
Chapter 3: Maintenance and Component Installation
47
1
6
1
6
Figure 3-8. Remove a Drive Carrier from the Cage
6. If a hard drive is already present, pull the sides of the carrier and remove the drive from
the carrier.
7. Insert a new drive into the carrier and push the sides of the carrier together.
8. Insert the carrier into the cage. Slide the carrier towards the back of the cage until it
clicks into place.
9. Rotate the cage 90 degrees inward.
10. Connect the hard drive cables.
11. Plug the power cord back into the power module, replace the chassis cover and power-
up the system.
48
Chapter 3: Maintenance and Component Installation
Thumbscrew
Figure 3-9. Removing/Installing a Hard Drive
Removing and Installing Optional HDD Cage
1. Begin by removing power from the system as described in Section 3.1 and remove the
side cover as described in Section 3.2.
2. Loosen the thumbscrew securing the 2.5" hard drive cage to the chassis.
3. Disconnect all cables from the hard drive.
4. Slide the 2.5" hard drive cage out of the chassis.
5. If a hard drive is already present, remove it by carefully pulling the sides of the hard
drive carrier outward.
6. Remove the hard drive from the hard drive carrier.
Chapter 3: Maintenance and Component Installation
49
7. Insert the new hard drive into the hard drive carrier.
8. Insert the hard drive carrier into the hard drive cage, sliding it towards the back of the
the hard drive cage until it clicks into a locked position.
9. Slide the 2.5" hard drive cage back into the chassis and tighten the thumb screw to
secure the cage.
10. Connect the related cables to the hard drive.
11. Plug the power cord back into the power module, replace the chassis cover and power-
up the system.
50
Chapter 3: Maintenance and Component Installation
1
2
Figure 3-10. Installing the Rear Exhaust Fan
Replacing or Installing the Rear Fan
1. Begin by removing power from the system as described in Section 3.1 and remove the
side cover as described in Section 3.2.
2. Insert the four rubber pins through mounting holes in the rear of the chassis and through
the mounting holes in the rear fan.
3. Pull the rubber pins through the mounting holes of the fan to secure the fan to the
chassis.
4. Connect the fan cable to the motherboard.
3.8 System Cooling
The cooling system for the SYS-730A-I includes a fan at the front and rear of the chassis.
Note: When using consumer grade GPUs, fan speed setting must be set to Heavy IO.
Fans
One 12-cm exhaust fan is mounted in the chassis rear below the power supply. One 12-cm
fan is mounted at the chassis front.
52
Chapter 3: Maintenance and Component Installation
Power Supply
3.9 Power Supply
The CSE-735D4-1K26B chassis includes a single 1200 Watt power supply. In the event that it
becomes necessary to replace the power supply, follow the instructions below. Replacement
units can be ordered directly from Supermicro.
Replacing the Power Supply
1. Remove power as described in Section 3.1 and remove the cover as described in
Section 3.2.
2. Remove the screws securing the power supply to the chassis, which are located on the
rear of the chassis. Set these screws aside for later use.
3. Disconnect the power supply from the motherboard connections.
4. Gently lift the power supply out of the chassis.
5. Replace the failed power supply with an identical power supply model.
6. Secure the new power supply using the screws previously set aside.
7. Plug the AC power cord back into the module and power-up the system.
Note: BMC interface will detect power supply status when the system is powered on, but the
power supply will not support the standby mode for PMBus. This means when the system is
turned on about a minute after plugging in the AC, the BMC will not be able to access the
power supply information.
Figure 3-12. Power Supply Location
53
Chapter 4: Motherboard Connections
Chapter 4
Motherboard Connections
This section describes the connections on the motherboard and provides pinout denitions.
Note that depending on how the system is congured, not all connections are required. The
LEDs on the motherboard are also described here. A motherboard layout indicating component
locations may be found in . More detail can be found in the
Chapter 1 Motherboard Manual.
Please review the Safety Precautions in Appendix A before installing or removing components.
4.1 Power Connections
ATX Power Supply Connector
The 24-pin power supply connector (JPWR3) meets the ATX SSI EPS 12V specication.
You must also connect the 8-pin (JPWR1/JPWR2/JPWR4) processor power connector to
the power supply. Refer to the next page for more information on JPWR1/JPWR2/JPWR4.
ATX Power 24-pin Connector
Pin Denitions
Pin# Pin#Denition Denition
13 +3.3V 1+3.3V
14 -12V 2+3.3V
15 Ground Ground3
16 PS_ON 4+5V
17 Ground Ground5
18 +5VGround 6
19 Ground Ground7
20 Res (NC) PWR_OK8
21 +5V 95VSB
22 10+5V +12V
23 +5V 11 +12V
24 Ground 12 +3.3V
Required Connection
8-pin Power
Pin Denitions
Pin# Denition
1 - 4 Ground
5 - 8 P12V (12V Power)
8-Pin Power Connector
JPWR1, JPWR2 and JPWR4 is an 8-pin 12V DC power input for the CPU that must be
connected to the power supply. Refer to the table below for pin denitions..
54
Chapter 4: Motherboard Connections
4.2 Headers and Connectors
Fan Headers
There are eight 4-pin fan headers (FAN1 ~ FAN7, FANA) on the motherboard. All these 4-pin
fan headers are backwards compatible with the traditional 3-pin fans. However, fan speed
control is available for 4-pin fans only by Thermal Management via the BMC interface. Refer
to the table below for pin denitions.
Fan Header
Pin Denitions
Pin# Denition
1Ground (Black)
22.5A/+12V (Red)
3 Tachometer
4PWM_Control
SGPIO Headers
There are three Serial Link General Purpose Input/Output (I-SGPIO1 and I-SGPIO2) headers
located on the motherboard. I-SGPIO is for SATA use. Refer to the tables below for pin
denitions.
SGPIO Header
Pin Denitions
Pin# Pin#Denition Denition
1 2NC NC
3 4Ground Data
5 6Load Ground
7Clock 8 NC
NC = No Connection
Disk-On-Module Power Connector
Two power connectors for SATA DOM (Disk-On-Module) devices are located at JSD1 and
JSD2. Connect appropriate cables here to provide power support for your SATA DOM devices.
DOM Power
Pin Denitions
Pin# Denition
15V
2 Ground
3 Ground
55
Chapter 4: Motherboard Connections
Trusted Platform Module Header
Pin Denitions
Pin# Pin#Denition Denition
1 2+3.3V SPI_CS#
3 4RESET# SPI_MISO
5 6SPI_CLK GND
7SPI_MOSI 8 NC
9+3.3V Stdby SPI_IRQ#10
TPM/Port 80 Header
A Trusted Platform Module (TPM)/Port 80 header is located at JTPM1 to provide TPM support
and Port 80 connection. Use this header to enhance system performance and data security.
Refer to the table below for pin denitions. Please go to the following link for more information
on the TPM: http://www.supermicro.com/manuals/other/TPM.pdf.
Power SMB (I2C) Header
The Power System Management Bus (I2C) connector (JPI2C1) monitors the power supply,
fan, and system temperatures. Refer to the table below for pin denitions.
Power SMB Header
Pin Denitions
Pin# Denition
1Clock
2 Data
3PMBUS_Alert
4 Ground
5+3.3V
4-pin BMC External I2C Header
A System Management Bus header for BMC is located at JIPMB1. Connect the appropriate
cable here to use the IPMB I2C connection on your system. Refer to the table below for pin
denitions.
External I2C Header
Pin Denitions
Pin# Denition
1 Data
2 Ground
3Clock
4 No Connection
56
Chapter 4: Motherboard Connections
NVMe Connectors
Use the two NVMe connectors (JNVME1 and JNVME2) to attach high-speed PCIe storage
devices.
Note: When installing an NVMe device on a motherboard, please be sure to connect the rst
NVMe port rst (JNVME1) for your system to work properly.
NVMe SMBus Headers
NVMe SMBus (I2C) headers (JNVI2C), used for PCIe SMBus clock and data connections,
provide hot-plug support via a dedicated SMBus interface. This feature is only available for a
Supermicro complete system with an SMCI-proprietary NVMe add-on card and cable installed.
See the table below for pin denitions.
NVMe SMBus Header
Pin Denitions
Pin# Denition
1 Data
2 Ground
3Clock
4VCCIO
Chassis Intrusion
A Chassis Intrusion header is located at JL1 on the motherboard. Attach the appropriate cable
from the chassis to inform you of a chassis intrusion when the chassis is opened. Refer to
the table below for pin denitions.
Note: Chassis intrusion is not supported on SYS-730A-I.
Chassis Intrusion
Pin Denitions
Pin# Denition
1Intrusion Input
2 Ground
Speaker Header (Optional for an External Speaker/Buzzer)
A speaker header, located at JD1, can be used in conjunction with an external speaker
(optional). Use an appropriate cable to connect this header to an external speaker or buzzer
for support of BIOS beep codes and system alarms. See the layout below for JD1 location.
57
Chapter 4: Motherboard Connections
SATA Ports
Six SATA 3.0 ports (I-SATA0/1/2/3/4/5) are located on the X12DAi-N6 motherboard supported
by the C621A chipset. These SATA ports support RAID 0, 1, 5, and 10. In addition, there are
also two SATA ports (I-SATA6, I-SATA7) that include SATA DOM power. SATA ports provide
serial-link signal connections, which are faster than the connections of Parallel ATA.
Note: For more information on the SATA HostRAID conguration, please refer to the Intel
SATA HostRAID user's guide posted on our website at http://www.supermicro.com.
M.2 Slot
The X12DAi-N6 motherboard has two M.2 slots (JM2_1 and JM2_2). M.2 allows for a variety of
card sizes, increased functionality, and spatial eciency. The M.2 socket on the motherboard
supports PCIe 4.0 x4 (32 Gb/s) SSD cards in the 2280 and 22110 form factors.
Note: JM2_2 cannot be used if a graphics card is installed in any of the PCIe slots 1-5.
VROC Intel RAID Key Header
The JRK1 header allows the user to enable RAID functions for NVMe connections. Refer to
the table below for pin denitions.
Intel RAID Key Header
Pin Denitions
Pin# Dention
1 GND
2PU 3.3V Stdby
3GND
4PCH RAID KEY
VROC Intel RAID Key Header
The JRK1 header allows the user to enable RAID functions for NVMe connections. Refer to
the table below for pin denitions.
Intel RAID Key Header
Pin Denitions
Pin# Dention
1 GND
2PU 3.3V Stdby
3GND
4PCH RAID KEY
NC = No Connection
58
Chapter 4: Motherboard Connections
Figure 4-1. JF1 Control Panel Pins
Control Panel
JF1 contains header pins for various buttons and indicators that are normally located on a
control panel at the front of the chassis. These connectors are designed specically for use
with Supermicro chassis. See the gure below for the descriptions of the front control panel
buttons and LED indicators.
Power Button
(Blue LED_Cathode_UID)
NIC1 (Activity) LED
Reset Button
HDD LED
FP PWR LED
ID_UID/3.3V Stby
Ground
19
Ground
20
1 2
Ground
Power Fail (for LED6)
NIC2 (Link) LED
NMI
3.3V
(Red OH/Fan Fail/PWR Fail for LED5/Blue UID LED)
3.3V
JF1
Red+ Blue+
NIC2 (Activity) LED
NIC1 (Link) LED
Key Key
59
Chapter 4: Motherboard Connections
Front Control Panel LEDs
Front Control Panel (JF1)
LED Indicators
Event Power (LED1) HDD (LED2) LAN
(LED3/4) UID (LED5) Information
(LED5)
Power Fail
(LED6)
SYS-730A-I
Support
Power On Solid On Supported
HDD Activity Blinking Supported
NIC Activity Blinking Not supported
Overheat Solid On Not supported
Fan Fail Blinking @1Hz Not supported
Power Fail Blinking @1/4Hz Solid On Not supported
Local UID On Solid On Not supported
Remote UID On Blinking 1Hz Not supported
Checking BMC/BIOS
Blinking @4HZ Not supported
Recovering/Updating BMC Blinking
@4HZ
BMC 2 Blinks
@4Hz,
1 Pause @2Hz
(on-on-o-o(
BIOS/BMC
Blinking
@10Hz
Not supported
Flash Not Detected
or Golden Image
Check Failed
BMC/BIOS
Blinking @1HZ Not supported
CPLD Recovery
Mode
Blinking
@10Hz
(MB UID
LED)
Blinking @10Hz
(FP Red LED) Not supported
Power Button
(Blue LED_Cathode_UID)
NIC1 (Activity) LED
Reset Button
HDD LED
FP PWR LED
ID_UID/3.3V Stby
Ground
19
Ground
20
1 2
Ground
Power Fail (for LED6)
NIC2 (Link) LED
NMI
3.3V
(Red OH/Fan Fail/PWR Fail for LED5/Blue UID LED)
3.3V
JF1
Red+ Blue+
NIC2 (Activity) LED
NIC1 (Link) LED
Key Key
Note: JF1 pins 3-13 and 15-20 are not supported by the SYS-730A-I front control panel.
61
Chapter 4: Motherboard Connections
4.3 Input/Output Ports
Figure 4-2. I/O Port Locations and Denitions
Rear I/O Ports
# #Description Description
1VGA Port 7.1 HD Audio6
2 7USB0 (USB 3.2 Gen 1) LAN1
3USB1 (USB 3.2 Gen 1) 8 LAN2
4 9USB2 (USB 3.2 Gen 1) USB4 (USB 3.2 Gen 2) type A
5USB3 (USB 3.2 Gen 1)
1
9
8
7
6
5
4
3
2
BAR CODE DESIGNED IN USA
MAC CODE
X12DAi-N
REV:1.01
BIOS LICENSE
JM2_2
MH18MH17
JM2_1
MH16MH15
HEA RTBEAT
BMC
FANA
JBT1
T-SGPIO2
T-SGPIO1
BT1
JPWR3
J37
SATA4 SATA6
SATA5
SATA8
SATA7
SATA1 SATA3
SATA2
JPWR2JPWR1 JPWR4
JPRG1
JNVI 2C
JPME1
JPL1
JWD1
JPL2
JD1
JVRM1JVRM2
JL1
JSPDIF_IN1
JSPDIF_OUT1
JTPM1
JA1
JRK1
LEDM1
LE4
LE7
JPI2C1
JVGA
FAN1
FAN2
FAN5
FAN6
FAN3FAN4
FAN7
JNCSI
JNVME1
JNVM E2
JPCIE5
JPCIE4
JPCIE3JPCIE2JPCIE1
JF1
JUSBA
JSD1 JSD2
JUSB1
JP7
JUSB31_I1
JLAN1
JPCIE6
JAUDIO1
JIPMB1
RAID KEY-1
I-SATA5
I-SATA4
I-SATA3
I-SATA2
I-SATA1
I-SATA0
I-SATA6 I-SATA7
LAN/1/2
HD AUDIO
P2_NVME0/1
USB7(3.1)
LED
PWR
USB4(3.1)
P1_NVM E0/1
U SB5/6(3.0)
USB0/1/2/3(3.0)
VGA
COM1
CMOS CLEAR
TPM /P ORT 80JT PM 1:
P1-DIMMB1
P1-DIMMA1
P1-DIMMD1
P1-DIMMC1
P1-DIMMG1
P1-DIMMF1
P1-DIMME1
P1-DIMMH1
P2-DIMMG1
P2-DIMMC1
P2-DIMMD1
P2-DIMMB1
P2-DIMMA1
P2-DIMME1
P2-DIMMF1
P2-DIMMH1
CPU2
CPU1
CPU1 SLOT1 PCI-E 4.0 X16
CPU2 SLOT2 PCI-E 4.0 X16
CPU1 SLOT3 PCI-E 4.0 X16
CPU2 SLOT4 PCI-E 4.0 X16
CPU1 SLOT5 PCI-E 4.0 X16
CPU2 SLOT6 PCI-E 4.0 X8
PCH
62
Chapter 4: Motherboard Connections
VGA Port
A video (VGA) port is located next to LAN2 on the I/O back panel. Refer to the board layout
below for the location.
7.1 HD (High-Denition) Audio
This motherboard features a 7.1 Channel High-Denition Audio (HDA) codec that provides 8
DAC channels. The HD audio supports multiple-streaming 7.1 sound playback through the
front_panel stereo output via the subwoofer speakers. Download the appropriate software
from our website to enable this function.
Front Accessible Audio Header
A 10-pin audio header, located at JA1, allows you to use the onboard sound for audio
playback. Connect an audio cable to the audio header to use this feature. See the layout
below for onboard audio header.
3
7.1 HD Audio
Conn# Signal
1SPDIF_Out
2Surround_Out
3CEN/LFE_Out
4Mic_In
5Line_Out
6Line_In
HD Audio
1
2
6
5
4
COM Ports
COM connections (COM1) are located on the motherboard. COM1 is located next to PCIe
Slot 1 (JPCIE1).
COM Port
Pin Denitions
Pin# Pin#Denition Denition
1 6DCD DSR
2 7RXD RTS
3TXD 8 CTS
4 9DTR RI
5 Ground 10 N/A
63
Chapter 4: Motherboard Connections
Ethernet Ports
Two Gigabit Ethernet ports (LAN1, LAN2) are located on the I/O back panel. These Ethernet
ports support 1GbE LAN connections on the X12DAi-N6. All of these ports accept RJ45
cables. Please refer to the LED Indicator section for LAN LED information.
LAN Port
Pin Denition
Pin# Pin#Denition Denition
1 TD0- 11 P3V3_Dual
2 TD0+ 12 Act LED (Yellow)
3 TD1- 13 Link 1000
(Amber)
4 TD1+ 14 Link 100 LED
(Green)
5 TD2- 15 GND
6 TD2+ 16 GND
7 TD3- 17 GND
8TD3+ GND18
9COMMCT
10 GND
64
Chapter 4: Motherboard Connections
4.4 Jumpers
Explanation of Jumpers
To modify the operation of the motherboard, jumpers are used to choose between optional
settings. Jumpers create shorts between two pins to change the function associated with it.
Pin 1 is identied with a square solder pad on the printed circuit board. See the motherboard
layout page for jumper locations.
Note: On a two-pin jumper, "Closed" means the jumper is on both pins and "Open" indicates
the jumper is either on only one pin or has been completely removed.
Connector
Pins
Jumper
Setting
3 2 1
3 2 1
CMOS Clear
JBT1 is used to clear CMOS, which will also clear any passwords. Instead of pins, this jumper
consists of contact pads to prevent accidentally clearing the contents of CMOS.
To Clear CMOS
1. First power down the system and unplug the power cord(s).
2. Remove the cover of the chassis to access the motherboard.
3. Remove the onboard battery from the motherboard.
4. Short the CMOS pads with a metal object such as a small screwdriver for at least four
seconds.
5. Remove the screwdriver (or shorting device).
6. Re-install the motherboard battery.
7. Replace the cover, reconnect the power cord(s), and power on the system.
Note: Clearing CMOS will also clear all passwords.
Do not use the PW_ON connector to clear CMOS.
65
Chapter 4: Motherboard Connections
Watchdog
Watchdog (JWD1) is a system monitor that can reboot the system when a software application
hangs. Close pins 1-2 to reset the system if an application hangs. Close pins 2-3 to generate
a non-maskable interrupt (NMI) signal for the application that hangs. Refer to the table below
for jumper settings. The Watchdog must also be enabled in the BIOS.
Watchdog
Jumper Settings
Jumper Setting Denition
Pins 1-2 Reset
Pins 2-3 NMI
Open Disabled
Management Engine (ME) Recovery
Use jumper JPME1 to select ME Firmware Recovery mode, which will limit resource
allocation for essential system operation only in order to maintain normal power operation
and management. In the single operation mode, online upgrade will be available via Recovery
mode. See the table below for jumper settings.
Manufacturer Mode
Jumper Settings
Jumper Setting Denition
Pins 1-2 Normal
Pins 2-3 ME Recovery
66
Chapter 4: Motherboard Connections
4.5 LED Indicators
LAN LEDs
Two LAN ports (LAN 1 and LAN 2) are located on the I/O back panel of the motherboard.
Each Ethernet LAN port has two LEDs. The solid green LED indicates activity, while the other
LED may be amber or o to indicate the speed of the connection. Refer to the tables below
for more information.
LAN Activity LED
Color Status Denition
Green Flashing Active
LAN Link LED
LED Color Denition
Yellow/Amber 1Gbps
M.2 LED
Two M.2 LEDs are located at LE4 and LE7 on the motherboard. When the LED is blinking,
M.2 functions normally. Refer to the table below for more information.
M.2 LED State
LED Color Denition
Green: Blinking Device Working
Onboard Power LED
The Onboard Power LED is located at PWRLED on the motherboard. When this LED is on,
the system is on. Be sure to turn o the system and unplug the power cord before removing
or installing components. Refer to the table below for more information.
Onboard Power LED Indicator
LED Color Denition
O
System O
(power cable not
connected)
Green System On
Produkt Specifikationer
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