Texas Instruments OPA209AID Manual

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

OPA209

OPA2209

OPA4209

SBOS426D – NOVEMBER 2008 – REVISED OCTOBER 2016

OPAx209 2.2-nV/ Hz, Low-Power, 36-V Operational Amplier√

1 Features

• Low Voltage Noise: 2.2 nV/ Hz at 1 kHz√

• 0.1-Hz to 10-Hz Noise: 130 nVPP

• Low Quiescent Current: 2.5 mA/Ch (Maximum)

• Low Oset Voltage: 150 µV (Maximum)

• Gain Bandwidth Product: 18 MHz

• Slew Rate: 6.4 V/µs

• Wide Supply Range:

±2.25 V to ±18 V, 4.5 V to 36 V

• Rail-to-Rail Output

• Short-Circuit Current: ±65 mA

• Available in 5-Pin SOT-23, 8-Pin MSOP,

8-Pin SOIC, and 14-Pin TSSOP Packages

2 Applications

• PLL Loop Filters

• Low-Noise, Low-Power Signal Processing

• Low-Noise Instrumentation Ampliers

• High-Performance ADC Drivers

• High-Performance DAC Output Ampliers

• Active Filters

• Ultrasound Ampliers

• Professional Audio Preampliers

• Low-Noise Frequency Synthesizers

• Infrared Detector Ampliers

• Hydrophone Ampliers

3 Description

The OPA209 series of precision operational

ampliers achieve very low voltage noise density

(2.2 nV/ Hz) with a supply current of only 2.5 mA√

(maximum). This series also oers rail-to-rail output

swing, which helps to maximize dynamic range.

In precision data acquisition applications, the

OPA209 provides fast settling time to 16-bit accuracy,

even for 10-V output swings. This excellent ac

performance, combined with only 150 µV (maximum)

of oset and low drift over temperature, makes the

OPA209 very suitable for fast, high-precision

applications.

The OPA209 is specied over a wide dual power-

supply range of ±2.25 V to ±18 V, or single-supply

operation from 4.5 V to 36 V.

The OPA209 is available in the 5-pin SOT-23, 8-pin

VSSOP, and the standard 8-pin SOIC packages. The

dual OPA2209 comes in both 8-pin VSSOP and 8-pin

SOIC packages. The quad OPA4209 is available in

the 14-pin TSSOP package.

The OPA209 series is specied from –40°C to 125°C.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

OPA209

SOT-23 (5) 2.90 mm × 1.60 mm

VSSOP (8) 3.00 mm × 3.00 mm

SOIC (8) 4.90 mm × 3.91 mm

OPA2209 VSSOP (8) 3.00 mm × 3.00 mm

SOIC (8) 4.90 mm × 3.91 mm

OPA4209 TSSOP (14) 5.00 mm × 4.40 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

0.1-Hz to 10-Hz Noise

OPA209

OPA2209

OPA4209

SBOS426D – NOVEMBER 2008 – REVISED OCTOBER 2016

www.ti.com

Product Folder Links: OPA209 OPA2209 OPA4209

Table of Contents

1 Features .................................................................. 1

2 Applications ........................................................... 1

3 Description ............................................................. 1

4 Revision History..................................................... 2

5 Pin Conguration and Functions ......................... 3

6 Specications......................................................... 5

6.1 Absolute Maximum Ratings ...................................... 5

6.2 ESD Ratings.............................................................. 5

6.3 Recommended Operating Conditions ....................... 5

6.4 Thermal Information: OPA209 .................................. 5

6.5 Thermal Information: OPA2209 ................................ 6

6.6 Thermal Information: OPA4209 ................................ 6

6.7 Electrical Characteristics........................................... 6

6.8 Typical Characteristics.............................................. 8

7 Detailed Description ............................................ 13

7.1 Overview ................................................................. 13

7.2 Functional Block Diagram ....................................... 13

7.3 Feature Description................................................. 13

7.4 Device Functional Modes ....................................... 17

8 Application and Implementation ........................ 18

8.1 Application Information .......................................... 18

8.2 Typical Application ................................................. 18

9 Power Supply Recommendations...................... 19

10 Layout................................................................... 19

10.1 Layout Guidelines ................................................ 19

10.2 Layout Example .................................................... 20

11 Device and Documentation Support ................. 21

11.1 Device Support...................................................... 21

11.2 Documentation Support ........................................ 22

11.3 Related Links ........................................................ 22

11.4 Receiving Notication of Documentation Updates 22

11.5 Community Resources.......................................... 22

11.6 Trademarks ........................................................... 22

11.7 Electrostatic Discharge Caution............................ 22

11.8 Glossary ................................................................ 23

12 Mechanical, Packaging, and Orderable

Information ........................................................... 23

4 Revision History

NOTE: Page numbers for previous revisions may dier from page numbers in the current version.

Changes from Revision C (October 2013) to Revision D Page

• Added table, section, ,ESD Ratings Feature Description Device Functional Modes Application and Implementation

section, section, section, section, andPower Supply Recommendations Layout Device and Documentation Support

Mechanical, Packaging, and Orderable Information section .................................................................................................. 1

• Deleted table; see POA at the end of the data sheet...........................................................................Ordering Information 1

• Moved specied voltage, specied temperature, and operating temperature from toElectrical Characteristics

Recommended Operating Conditions .................................................................................................................................... 5

• Updated values in the tables to align with JEDEC standards...............................................................Thermal Information 5

Changes from Revision B (August 2010) to Revision C Page

• Deleted device graphic ........................................................................................................................................................... 1

• Changed y-axis units label in ...................................................................................................................................Figure 2 8