Capacities:  , 180, 2 , 360, 480, 1000 GB 120 40
Form Factors:  
 80mm (single-sided) 2280- -B-  S3 M 
(120, 180, 2 , 360, 480  ) 40 GB
 80mm (double-sided) 2280-D3-B-M (1000 G  B)
Thickness:     up to 2.38  ; D3   up to 3.73mm S3 –mm –
Weight: <7 grams 
SATA 6Gb/s Bandwidth Performance1,2 
(IOMeter* Queue Depth 32) 
 Sequential Read: up to 560MB/s 
 Sequential Write: up to 480MB/s 
Read and Write IOPS1,2  
(IOMeter Queue Depth 32) 
 Random 4KB Reads: up to  ,000 IOPS 78
 Random 4KB Writes: up to 85,000 IOPS 
Additional Compatibility 
 Intel® SSD Toolbox with Intel® SSD Optimizer 
 Intel® Data Migration Software 
 Intel® Rapid Storage Technology 
 SATA Revision 3.2 
 ACS-3 (ATA/ATAPI Command Set 3) 
 SSD Enhanced SMART ATA feature set 
AES 256-bit Encryption 
Power Management 
 3.3 V SATA Supply Rail 
 SATA Link Power Management (LPM) 
 Device Sleep (DevSleep) 
 Advanced Power Management (APM) 
Power 
 Active (BAPCo MobileMark* 20  Workload):  12
80   mW
 Idle3: 40   mW
 DevSleep: 3 mW 
 
Temperature 
 Operating4: 0° C to 70° C 
 Non-Operating: - ° C to 95° C 55
Reliability 
 Uncorrectable Bit Error Rate (UBER): 
<1 sector per 1016 bits read  
 Mean Time Between Failure (MTBF):  
1.6 million hours 
 Shock (non-operating):  
1,000 G/0.5 ms 
Vibration 
 Operating: 2.17 GRMS  (5-700Hz) 
 N -operating: 3.13 GRMS (5-800Hz) on
Certifications and Declarations: 
 UL* 
 CE* 
 RCM* 
 BSMI* 
 KCC* 
 Microsoft* WHCK/WHLK 
 VCCI* 
 SATA-IO* 
Product Ecological Compliance 
 RoHS* 
NOTES:  
1. IOMeter Test and System Configurations:  -4790 (8MB L3 Cache, 3.60GHz), ASUS* Deluxe Z97I-PLUS motherboard, Intel® Core™ i7
Intel® HD Graphics 4600 driver 10.18.10.3920, BIOS: AMI* 2605 5/19/2015, Chipset: Intel® INF 10.0.16.0, Memory: 8GB (2X4GB) 
Kingston DDR3-1555,  
Intel® RST driver 13.5, Microsoft* Windows 7 Enterprise 64-bit with SP1. 
2. Performance values vary by capacity.  
3. Non-DevSleep idle power with SATA Link Power Management (LPM) enabled. 
4. As measured by temperature sensor, SMART Attribute BEh. Active airflow is recommended within the system for maintaining proper 
device operating temperatures on heavier workloads.