Microchip PIC16F737 Manual

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Side 1/18

CONTENTS

1.0 Introduction ......................................................... 1

2.0 MPLAB ICE 2000 System................................... 1

3.0 Emulator-Related Issues .................................... 2

4.0 Processor Modules ............................................. 2

5.0 Device Adapters ................................................. 4

6.0 Device Adapter Target Footprints ....................... 9

1.0 INTRODUCTION

The processor modules for MPLAB® ICE 2000 are

interchangeable personality modules that allow

MPLAB ICE 2000 to be reconfigured for emulation of

different PIC® microcontrollers (MCUs). This modular-

ity allows the emulation of many different devices with

the addition of a processor module and device adapter,

which provides a very cost effective multiprocessor

emulation system.

The device adapters for MPLAB ICE 2000 are inter-

changeable assemblies that allow the emulator system

to interface to a target application system. Device

adapters also have control logic that allows the target

application to provide a clock source and power to the

processor module. The device adapters support PIC

MCUs in DIP, SDIP and PLCC packages.

Transition sockets, used along with a device adapter,

provide a method of accommodating all PIC MCU

packages, including SOIC, SSOP, PQFP and TQFP

packages.

2.0 MPLAB ICE 2000 SYSTEM

A brief overview of the different components of the

system is shown in the figure below. Each component

is discussed in the following subsections.

FIGURE 2-1: MPLAB® ICE 2000

EMULATOR SYSTEM

2.1 Host to Pod Cable

This is a standard parallel interface cable. MPLAB ICE

2000 is tested with a 6-foot cable. A longer cable may

work, but is not ensured. The cable connects to a par-

allel port on the PC. If a PC has a printer connected to

an LPT device, it is recommended that an additional

interface card be installed, rather than using a splitter

or an A/B switch.

2.2 Emulator Pod

The Emulator Pod contains emulator memory and

control logic. MPLAB ICE 2000 contains a main board

and an additional board for expanded trace memory

and complex control logic. There are no field service-

able parts in the pod. For more information on the pod,

see the MPLAB ICE 2000 on-line help file in MPLAB

IDE (Help>Topics) or the “MPLAB® ICE 2000

In-Circuit Emulator User’s Guide” (DS51488).

The MPLAB ICE 2000 processor module is inserted

into the pod for operation.

2.3 Processor Module

The processor module contains the emulator chip, logic

and low-voltage circuitry. There are no field-serviceable

parts mounted on the printed circuit board housed

within the processor module enclosure.

Communications Cable

Power Supply

Cable

Emulator Pod

Processor Module

with Cable

Logic Probe

Connector

Device Adapter

Transition Socket

Processor Module and Device Adapter Specification

MPLAB® ICE 2000

2.4 Flex Circuit Cable

Once the processor module is inserted into the

emulator pod, the flex circuit cable extends the

emulator system to the target application. This is a

custom cable that is attached inside the processor

module enclosure, and can be replaced in the field by

removing the end cap of the processor module

enclosure.

Please, DO NOT PULL on the flex circuit cable to

remove the processor module from the pod. Use the

fins of the processor module end cap to leverage the

module from the pod.

Emulator analog functions may not operate within the

performance specifications published in the device

data sheet due to parasitic capacitance (up to 120 pf)

of the flex cable.

2.5 Device Adapter

The device adapter provides a common interface for

the device being emulated. It is provided in standard

DIP and PLCC styles. The adapter also contains a spe-

cial device that provides an oscillator clock to accu-

rately emulate the oscillator characteristics of the PIC

MCU.

Due to components on the device adapter, which

require target power, the device adapter should be

removed from the flex circuit cable (see Figure 2-1)

when emulator power is being used and the processor

module is not connected to the target. This will

eliminate any loading effects on I/O pins.

2.6 Transition Socket

Transition Sockets are available in various styles to

allow a common device adapter to be connected to one

of the supported surface mount package styles. Transi-

tion sockets are available for various pin counts and

pitches for SOIC, QFP and other styles. For more infor-

mation on transition sockets, see the “MPLAB® ICE

2000/4000 Transition Socket Specification” (DS51194).

An emulator system consists of the following

components which can be ordered separately:

• An emulator pod (including the host-to-pod cable

and power supply)

• A processor module (including the flex circuit

cable)

• A device adapter

• An optional transition socket (for surface mount

emulation)

3.0 EMULATOR-RELATED ISSUES

General limitations that apply to the MPLAB ICE 2000

emulator may be found in the on-line help. Select

Help>Topics and then select “MPLAB ICE 2000” under

“Debuggers”.

Device-specific limitations can be found as above or by

selecting Debugger>Settings, clicking the Limitations

tab, and then clicking the Details button.

4.0 PROCESSOR MODULES

Processor modules are identified on the top of the

assembly (e.g., PCM18XA0). To determine which

processors are supported by a specific module, refer to

the file “Readme for MPLAB ICE 2000.txt” in the

MPLAB IDE installation directory or the latest “Product

Selector Guide” (DS00148), which can be found on the

Microchip web site at www.microchip.com.

A typical processor module contains a special bond-out

version of a PIC MCU, with device buffers to control

data flow and control logic. It provides the means of

configuring the MPLAB ICE 2000 emulator for a

specific PIC MCU family and handles low-voltage emu-

lation when needed.

4.1 Power

The operating voltage for most of the control logic and

buffering on the processor module is +5V and is

supplied by the emulator pod. Power to the emulator

processor and some of its surrounding buffers is user-

selectable, and can be powered by the emulator pod

(at +5V only) or the target application system (from

2.0V to 5.5V). This is software selectable and is

configurable through the MPLAB IDE software. At no

time will the emulator system directly power the target

application system. ALWAYS insert the processor

module into the emulator pod before applying power to

the pod.

When connecting to a target application system, there

may be a voltage level on the target application even

though power has not yet been applied to the target

application circuit. This is normal, and is due to current

leakage through VCC of the device adapter. The current

leakage will typically be less than 20 mA. However, if

the target application is using a voltage regulator, it

should be noted that some regulators require the use of

an external shunt diode between VIN and VOUT for

reverse-bias protection. Refer to the manufacturer’s

data sheets for additional information.

Note: When removing the processor module, DO

NOT PULL on the flex cable. Use the tabs

on the processor module or damage to the

flex cable may occur.

Produkt Specifikationer

Mærke:	Microchip
Kategori:	Ikke kategoriseret
Model:	PIC16F737

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