Texas Instruments LMC6482IM/NOPB Manual

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C001

A1 0.18 V ±

500mV 50 s 

C002

A2 0.18 V ±

500mV 50 s 

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

LMC6482

SNOS674G – NOVEMBER 1997 – REVISED APRIL 2020

LMC6482 CMOS Dual Rail-to-Rail Input and Output Operational Amplier

1 Features

1• Specications are typical unless otherwise noted

• Rail-to-rail input common-mode voltage range

(specied over temperature)

• Rail-to-rail output swing (within 20-mV of supply

rail, 100-k load)Ω

• Specied 3-V, 5-V, and 15-V performance

• Excellent CMRR and PSRR: 82 dB

• Ultra-low input current: 20 fA

• High voltage gain (RL = 500 k ): 130 dBΩ

• Specied for 2-k and 600- loadsΩ Ω

• Power-good output

• Packages: PDIP, SOIC, and VSSOP

2 Applications

•Data acquisition (DAQ)

•Currency counter

•Oscilloscope (DSO)

•Intra-DC interconnect (METRO)

•Macro remote radio unit (RRU)

•Multiparameter patient monitor

•Merchant telecom rectiers

•Train control and management

•Process analytics (pH, gas, concentration, force,

and humidity)

•Three phase UPS

• Improved replacement for TLC272, TLC277

3 Description

The LMC6482 device provides a common-mode

range that extends to both supply rails. This rail-to-rail

performance combined with excellent accuracy, due

to a high CMRR, makes this device unique among

rail-to-rail input ampliers. The device is an excellent

choice for systems, such as data acquisition, that

require a large input signal range. The LMC6482 is

also an excellent upgrade for circuits using limited

common-mode range ampliers, such as the TLC272

and TLC277.

Maximum dynamic signal range is provided in low

voltage and single supply systems by the rail-to-rail

output swing of the LMC6482. The rail-to-rail output

swing is maintained for loads down to 600 of theΩ

device. Specied low-voltage characteristics and low-

power dissipation make the LMC6482 a great choice

for battery-operated systems.

The LMC6482 is available in 8-pin PDIP and SOIC

packages. The device is also available in a VSSOP

package, almost half the size of a SOIC-8 device.

See the for a quad CMOS operationalLMC6484

amplier with these same features.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

LMC6482

SOIC (8) 4.90 mm × 3.91 mm

VSSOP (8) 3.00 mm × 3.00 mm

PDIP (8) 9.81 mm × 6.35 mm

(1) For all available packages, see the package option addendum

at the end of the data sheet.

Rail-to-Rail Input Rail-to-Rail Output

LMC6482

SNOS674G – NOVEMBER 1997 – REVISED APRIL 2020

www.ti.com

Product Folder Links: LMC6482

Table of Contents

1 Features .................................................................. 1

2 Applications ........................................................... 1

3 Description ............................................................. 1

4 Revision History..................................................... 2

5 Pin Conguration and Functions ......................... 3

6 Specications......................................................... 3

6.1 Absolute Maximum Ratings ...................................... 3

6.2 ESD Ratings.............................................................. 4

6.3 Recommended Operating Conditions....................... 4

6.4 Thermal Information.................................................. 4

6.5 Electrical Characteristics for V+= 5 V....................... 4

6.6 Electrical Characteristics for V+= 3 V....................... 7

6.7 Typical Characteristics.............................................. 9

7 Detailed Description ............................................ 18

7.1 Overview ................................................................. 18

7.2 Functional Block Diagram ....................................... 18

7.3 Feature Description................................................. 18

7.4 Device Functional Modes........................................ 19

8 Application and Implementation ........................ 20

8.1 Application Information............................................ 20

8.2 Typical Applications ............................................... 22

9 Power Supply Recommendations...................... 28

10 Layout................................................................... 28

10.1 Layout Guidelines ................................................. 28

10.2 Layout Example .................................................... 28

11 Device and Documentation Support ................. 30

11.1 Receiving Notication of Documentation Updates 30

11.2 Support Resources ............................................... 30

11.3 Trademarks ........................................................... 30

11.4 Electrostatic Discharge Caution............................ 30

11.5 Glossary ................................................................ 30

12 Mechanical, Packaging, and Orderable

Information ........................................................... 30

4 Revision History

NOTE: Page numbers for previous revisions may dier from page numbers in the current version.

Changes from Revision F (April 2020) to Revision G Page

• Deleted old note 4 from Electrical Characteristics for V+= 5 V table. ................................................................................... 4

Changes from Revision E (April 2015) to Revision F Page

• Changed junction temperature max value from –85°C to 85°C (typo) in table..........Recommended Operating Conditions 4

Changes from Revision D (March 2013) to Revision E Page

• Added section, table, section,Pin Conguration and Functions ESD Ratings Feature Description Device Functional

Modes Application and Implementation Power Supply Recommendations Layout Device, section, section, section,

and Documentation Support Mechanical, Packaging, and Orderable Informationsection, and section .............................. 1

Changes from Revision C (March 2013) to Revision D Page

• Changed layout of National Semiconductor Data Sheet to TI format .................................................................................. 27