Microchip LE9653 Manual
Microchip
Ikke kategoriseret
LE9653
Læs gratis den danske manual til Microchip LE9653 (54 sider) i kategorien Ikke kategoriseret. Denne vejledning er vurderet som hjælpsom af 23 personer og har en gennemsnitlig bedømmelse på 5.0 stjerner ud af 12 anmeldelser. Har du et spørgsmål om Microchip LE9653, eller vil du spørge andre brugere om produktet?
Side 1/54
for the Le9643 and Le9653
Part Number: ZLR965324H
Document ID#: 159172
Revision Number: 1.0
Issue Date: September 2017
ZLR965324H
Reference Design User Guide
miSLICTM Devices
ZLR965324H Line Module User Guide
2
Microsemi Confidential and Proprietary
Table of Contents
1.0 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.2 Design Objectives . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.3 Profiles. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.4 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.0 Quick Start Guide. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1 Required Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2 Getting Started . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3 Making Test Calls . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.0 System Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1 Module Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.2 System Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.3 Additional Le9643 and Le9653 Device Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.0 Circuit Design. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.2 Le9643 and Le9653 Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.3 Line Interface Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.3.1 Surge Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.4 Le9643 90V Inverting Boost Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.4.1 Capacitor/Filter Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.4.2 Low Voltage Inverting Boost MOSFET Requirement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.4.3 Inductor Requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.4.4 Current Sense, RLIM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.4.5 Rectifiers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.4.6 -90V Inverting Boost Compatibility with xDSL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.4.7 -90V Inverting Boost Low Input Voltage Option, 4.5V to 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.5 Le9653 135V (HV) Inverting Boost Power Supply. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.5.1 Capacitor/Filter Requirement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.5.2 MOSFET Requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.5.3 MOSFET Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.5.4 Inductor Requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.5.5 Output Rectifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.5.6 Current Sense, RLIM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.5.7 Pump Capacitor, CBHx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.5.8 Compatibility with xDSL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.5.9 Battery Backup Option, 5.5V to 9V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.6 Adaptive Ringing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.7 Voltage Sense, Switcher Optimization and Power Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.8 Soft Start . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.0 Module Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.2 Module ID ROM (MID) Default Profiles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.2.1 Device Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.2.2 AC Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.2.3 DC Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.2.4 Ringing Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.2.5 Tone Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5.2.6 Ringing Cadence Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5.2.7 Tone Cadence Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5.2.8 Caller ID Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5.3 Profiles Generated with Profile Wizard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
ZLR965324H Line Module User Guide
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Microsemi Confidential and Proprietary
Table of Contents
5.3.1 Profile Wizard Menu. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.3.2 Reviewing and Editing Profile Entries . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
5.3.3 Running New Profiles. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
6.0 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
6.1 Coefficients and WinSLAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
6.1.1 Schematic Used for Coefficient Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
6.2 Narrowband Transmission Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
6.2.1 Return Loss . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
6.2.2 Attenuation Distortion and Gain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
6.2.3 Gain Tracking and Noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
6.2.4 Total Distortion and Harmonic Distortion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
6.3 Wideband Transmission Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
6.3.1 Return Loss . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
6.3.2 Attenuation Distortion and Gain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
6.3.3 Gain Tracking and Noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
6.3.4 Total Distortion and Harmonic Distortion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
6.4 Power Consumption with 90V Inverting Boost supply. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
6.5 Power Consumption with 135V Inverting Boost supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
6.6 90V Inverting Boost Switching Regulator Performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
6.7 135V Inverting Boost Switching Regulator Performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
6.8 Thermal Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
7.0 Printed Circuit Board Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
7.1 Revision Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
7.2 Parts Placement Strategy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
7.3 ZLR964324H Line Module Schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
7.4 ZLR965324H Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
7.5 ZLR965324H Layout Plots . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
7.6 QFN36 PCB Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
ZLR965324H Line Module User Guide
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Figure 1 - ZTAP and ZLR965324H Line Module Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 2 - ZLR965324H Line Module. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 3 - ZLR965324H Le9643 Line Interface Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 4 - ZLR965324H 90V Inverting Boost Switching Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 5 - ZLR965324H 135V Inverting Boost Switching Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 6 - VDDSW Regulator Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 7 - Adaptive Ringing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 8 - Profile Wizard Main Menu - ZLR965324HL Project File . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 9 - Ringing Profile Configuration Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 10 - Mini-PBX - Configuration Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 11 - Mini-PBX - Device Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 12 - WinSLAC Software Model for the miSLIC Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Figure 13 - Two-Wire Return Loss (Narrowband) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 14 - Four-Wire Return Loss (Narrowband) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 15 - Receive Path (D to A) Attenuation Distortion (Narrowband) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 16 - Transmit Path (A to D) Attenuation Distortion (Narrowband). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 17 - Receive Path (D to A) Gain Tracking (Narrowband) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 18 - Transmit Path (A to D) Gain Tracking (Narrowband). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 19 - Receive Path (D to A) Total Distortion (Narrowband) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Figure 20 - Transmit Path (A to D) Total Distortion (Narrowband) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Figure 21 - Two-Wire Return Loss (Wideband) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Figure 22 - Four-Wire Return Loss (Wideband). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Figure 23 - Receive Path (D to A) Attenuation Distortion (Wideband). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 24 - Transmit Path (A to D) Attenuation Distortion (Wideband) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 25 - Receive Path (D to A) Gain Tracking (Wideband) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Figure 26 - Transmit Path (A to D) Gain Tracking (Wideband) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Figure 27 - Receive Path (D to A) Total Distortion (Wideband) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Figure 28 - Transmit Path (A to D) Total Distortion (Wideband). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Figure 29 - ZLR964324H Line Module Schematic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Figure 30 - Top Etch and Silk Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Figure 31 - Layer 2 - Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Figure 32 - Layer 3 - Power and Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Figure 33 - Bottom Etch and Silkscreen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Figure 34 - QFN36 PCB Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
ZLR965324H Line Module User Guide
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Microsemi Confidential and Proprietary
1.0 Introduction
1.1 Overview
The ZLR965324H is a two-channel FXS line module designed to interface with the Microsemi Telephony
Applications Platform (ZTAP) for evaluating the Le9643 and Le9653 miSLIC
TM 1 FXS Devices. This user guide
provides sample operating instructions, schematic, bill of materials, and layout references. Refer to the specific
device data sheets for complete technical information.
1.2 Design Objectives
The ZLR965324H Line Module was designed to demonstrate a compact 1 FXS tracking battery solution based on
the new Le9643 or Le9653 miSLIC device. It features one Le9643 and one Le9653 Single Channel miSLIC Device
(36-pin QFN) with an optimized line interface circuit and independent tracking battery supplies.
The objectives of this reference design is to address the following:
• Demonstrate both a lowest cost 1 FXS for cost sensitive applications and also a highly capable 1 FXS for
applications require high voltage ringing.
• Support up to 85 VPK ringing and 3 REN ringer loads, Le9643. And 125Vpk ringing and 5 REN ringer loads,
Le9653
• Over-voltage / over-current protection for intra-building requirements.
• On-board 12 V input low cost 90V Inverting Boost (Ch 1) and 135V Inverting Boost (Ch 2) battery supplies.
• Power Efficient, compliant with the EU Code of Conduct Version 6 (CoC), <900 mW/ch off hook.
• Designed for up to 1200 total loop.
• PCM / SPI interface operation at up to 8.192 MHz (with ZTAP).
• DC sensing is outside the protection to allow support for VeriVoice foreign voltage tests.
• Compact design and layout example measuring 6 cm2 per FXS channel.
• On board Module ID ROM (MID) provides the default device profile, AC profile, DC profile, and ringing
profile. A profile is defined by the Profile Wizard software tool for configuring Microsemi voice products.
•ZTAP and Microsemi Voice Toolkit (MiToolkit) with VP-API-II provides fully functional operation for complete
two-channel FXS operation for extensive tests meeting the data sheet specifications.
1.3 Profiles
A profile is a file that contains all of the configuration information required to set up a VoicePort device. A profile is
created by using the Profile Wizard software tool. The output from Profile Wizard is a .vpw file. Also a .h and a .c
file can be created that can be incorporated into the users system software. The Microsemi VP API-II and
VP-API-II Lite software packages use profiles to configure the device. Note that some profiles are not available with
the VP-API-II Lite software and require that the full VP API-II software be licensed.
Le9643 and Le9653 require VoicePath API-IITM P2.25.0 or later, available for download from the Microsemi
web site for registered customers.
ZLR965324H Line Module User Guide
6
Microsemi Confidential and Proprietary
Within a profile are individual data strings for configuring the different functional blocks within the device. Microsemi
has profiles available for most countries and major telephony standards. 9 types of profiles are supported:
•Device: This profile defines PCM timing and switcher configuration
•AC FXS: This profile sets the AC parameters such as impedance and levels. The input for the AC profile are
the coefficients generated by the WinSLAC software tool.
•DC: This profile defines the DC feed parameters such as open circuit voltage, DC feed current, hook
threshold, ground key or fault thresholds.
•Ringing: This profile sets the ringing voltage, frequency and ring trip parameters.
• .Tone: This profile defines call progress tone frequencies and levels
•Ringing Cadence: This profile sets the cadence that is associated with ringing.
•Tone Cadence: This profile defines call progress tone cadences. This Profile is used in conjunction with the
Tone Profile, which defines the frequencies.
•Caller ID: This profile sets Caller ID parameters
•Metering: This profile defines the frequencies and other parameters associated with subscriber pulse
metering.
1.4 References
The following documents are referred to in this document and may be helpful:
1. Le9643 Subscriber Line Interface Circuit miSLICTM Data Sheet, Document ID#: 157127
2. Le9653 Subscriber Line Interface Circuit miSLICTM Data Sheet, Document ID#: 157152
3. Microsemi Telephony Applications Platform (ZTAP) User’s Guide, Document ID# 136057
4. Profile Wizard User’s Guide, Document ID#: 127063
5. ZL880 VP-API-II Reference Guide, Document ID#: 143271
6. VeriVoice Professional Test Suite Software, Document ID#: 081516
Also referenced in this file downloads. document is the Microsemi web site for
http://www.microsemi.com/voice-line-circuits.
ZLR965324H Line Module User Guide
7
Microsemi Confidential and Proprietary
2.0 Quick Start Guide
2.1 Required Materials
The following materials will be required to set up the ZLR965324H line module system:
•Le71HK0004 Telephony Applications Platform (ZTAP) Kit with file system P1.20 or later (available from
Microsemi’s web site, OPN Le71SDKZTAP);
• Software tools downloaded from the Microsemi web site, including MiToolkit (OPN Le71SDKTK), release
P1.10.0 or later, and Profile Wizard (OPN Le71SDKPRO), release P2.7 or later;
•ZLR965324H line module;
• Two analog telephone sets; and
• Two RJ-11 telephone cords.
Refer to Table 1 for a listing of the essential MiToolkit applications.
Application Operating
Functions Description
VP-Script ZTAP Control ZTAP software image update; Tcl script editing and execution; console and
terminal communication
Mini-PBX Main Window /
Stand-Alone
Visual PBX
Discovers modules and assigns extension numbers and termination types
(FXS or FXO) for each hardware port; Initializes the Call Control application
with the profiles parameters found on the Module ID (MID) for each of the
installed modules; Displays real-time status and VP-API-II line states for all
extensions; Enables calling from any FXS into any other FXS or an FXO port.
Profile
Parameter
Loading
By clicking on any extension displayed on the Mini-PBX main window, Profile
Wizard-generated files may be loaded and applied to the port associated with
that extension. Profiles include AC and DC coefficients, Ringing parameters,
FXO / Dialing parameters, etc.
Half Channel
Setup and
Testing
By clicking on any extension displayed on the Mini-PBX main window, the
following half-channel functions are available: a) Manual line state control, b)
PCM time slot assignment, and c) RX and TX gain adjustment. These
functions enable AC and DC functional testing by placing the channel into one
of the VP-API-II system states and connecting the PCM highway to the E1/T1
interface on the ZTAP platform.
Line Testing Clicking on any FXS extension displayed on the Mini-PBX main window and
selecting the Line Testing tab provides access to VeriVoice tests. Tests such
as line voltage, receiver off-hook, resistive faults, and ringer equivalence
number (REN) may be run on that port.
VP-API-II Line
Debug
By clicking on the Terminal menu item, a terminal application is launched
allowing the user to type commands and view VP-API-II run-time debug
messages. The VP-API-II function VpSetOption() with
VP_OPTION_ID_DEBUG_SELECT is used to enable debug messages.
Table 1 - Essential MiToolkit Applications
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2.2 Getting Started
The Microsemi ZLR965324H line module is designed to mate with the SM2 receptacle found on the ZTAP platform
and is configurable by the MiToolkit software.
Figure 1 - ZTAP and ZLR965324H Line Module Setup
The ZTAP platform can accommodate one to eight telephone interfaces for the SM or DIN receptacle and up to four
interfaces for the SM2 receptacle (depending on line module capability). Note that SM and SM2 receptacles
overlap so only one type may be inserted at a time. An additional line module (SM or SM2) can be supported via an
Le71HR0411G adapter board that connects to the ZTAP DIN receptacle. The ZTAP Kit is supplied with an external
power supply adapter and accepts an optional high voltage power supply and ringer source module (for external
unbalanced ringing applications). The Mini-PBX application is contained within the MiToolkit software package that
configures the attached devices based on the Line Module MID. A USB cable is used to communicate with a PC
running MiToolkit.
The ZLR965324H module features two FXS ports accessible through its RJ-11 telephone jacks.
ZLR965324H Line Module User Guide
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Microsemi Confidential and Proprietary
Quick start steps:
1. Assemble the components as shown in Figure 1 and connect a USB cable between the ZTAP’s USB port
(J7101) and a PC.
2. Plug the supplied 12V AC/DC adapter into the ZTAP’s +12 V input jack J6101.
3. Apply power to the ZTAP and installed line module by switching SW6101 to the left. The system will boot up
within about 20 seconds, initialize the installed line module, and automatically run the call control application.
This allows pulse- and DTMF-dialed calls to be made between the telephony ports even without a PC attached.
4. Start the MiToolkit application.
5. When MiToolkit starts up, it will display a list of applications. Run the Mini-PBX application.
6. When Mini-PBX starts, it will prompt for which serial port to use. If VP-Script is already running, Mini-PBX will
know what port is being used. Note that the ZTAP Support Package software installation includes a Virtual COM
Port Driver to support USB-to-serial UART interface on the ZTAP board.
7. When Mini-PBX starts, it will identify the module plugged on the ZTAP and initialize it to the appropriate Idle
state. The extension number, li o be displayed.ne type, and line state will als
8. Refer to the Microsemi Telephony Applications Platform User’s Guide for additional installation and operation
details.
2.3 Making Test Calls
This arrangement for the two-channel line modules is as a single PBX network. The setup requires that the
ZLR965324H line module be installed on the SM2 receptacle on the ZTAP platform.
Figure 2 - ZLR965324H Line Module
The ZLR965324H line module is equipped with two FXS ports. assigns extension numbers to each port, Mini-PBX
which are typically 100 and 101 for the FXS ports.
• To make an FXS to FXS call, connect two telephone sets to the two FXS ports on the line module and go off-
hook on one of them.
•Mini-PBX detects the telephone set going off-hook and provides a dial tone. It also shows which extension
has gone off-hook. Let us assume that it is extension 100 in this example. To call the second FXS port, dial
7101 (i.e. 7 followed by the extension number 101).
ZLR965324H Line Module User Guide
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•Mini-PBX will route the call to extension 101 and initiate cadenced ringing. Default ringing is defined within
the MID.
• The Mini-PBX will provide an audible ringback tone to the calling extension 100.
• Please note that ng extension 100 is Mini-PBX will generate Caller ID information to extension 101, indicati
calling.
• When extension 101 is placed off-hook, ring trip will automatically occur and a voice path will be set up
between extensions 100 and 101.
•Mini-PBX will reflect the current line state for all lines.
ZLR965324H Line Module User Guide
11
Microsemi Confidential and Proprietary
3.0 System Description
3.1 Module Features
The ZLR965324H line module features one Le9643 and one Le9653 Single Channel miSLIC
TM Device,
programmable tracking switching regulator circuits and line interface and protection components. The Le9643 and
Le9653 combine SLIC and SLAC functionality into a thermally-enhanced 36QFN 4x6 mm package. The module
communicates with the ZTAP board using the SM2 interface.
Although the ZLR965324H module is a 4 layer PCB, the layout for the Le9643 channel is intended to demonstrate
a 2 layer PCB layout. No signal or power routing is on the inner layers of the PCB. There are also no components
related to the Le9643 design on the bottom side of the PCB. The Le9653 channel layers of the does utilize all four
PCB to more demonstrate a compact high performance design.
The Le9653 channel is intended to show a compact layout assuming a 4 layer PCB. For the Le9653 design
components are placed on both sides of the PCB.
3.2 System Features
The ZLR965324H line module includes an onboard EEPROM programmed with a Module ID ROM (MID) that
provides a default set of VP-API-II profiles for use with the board and which are automatically accessed by ZTAP.
The two FXS lines are configured pes and the individual profiles used in the for FXS_LOW_PWR termination ty
MIDs on the ZLR965324H were created using Profile Wizard 2.7 and are available from Microsemi in the following
files:
• ZLR965324H_SM2_LITE_Rev2_9.VPW
Those files contains the following profiles:
•Device Profile for Microsemi ZTAP demonstration platform and configured for a low votlage inverting boost
(FXS 1) and high voltage inverting boost (FXS 2).
• AC Profile providing narrow band 600 AC transmission with -6 dBr receive and 0 dBr transmit levels.
• DC Profile with feed coefficients set for a calibrated 25 mA active mode loop current limit (ILA), and 48 V
open circuit voltage (VOC).
• Ringing Profiles configured for sinusoidal ringing at 85 V
PK for FXS 1 and 88 VPK+20 VDC for FXS 2.
3.3 Additional Le9643 and Le9653 Device Features
• Complete BORSCHT function for a single FXS telephone channel.
• Option for narrowband, 300 Hz - 3.4 kHz or wideband 50 Hz - 7 kHz operation, selectable on a per-channel
basis.
• Integrated power management using on-chip switching regulator controller.
• Internal balanced ringing up to 85 VPK and 3 VREN loads, Le9643. And 140V PK and 5 REN for Le9653
(device rating).
• Capable of sinusoidal or trapezoidal ringing.
• Selectable PCM/SPI or ZSI digital interfaces (ZLR965324H is PCM/SPI only).
• Supervision ADC for advanced power optimization and testing.
• Worldwide programmability.
• G.711 a-law / µ-law, or 16-bit linear coding.
• Powerful signal generators with support for worldwide call progress tones, howler, and caller ID.
• Subscriber loop test/self-test support with VeriVoice test suite software.
ZLR965324H Line Module User Guide
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Microsemi Confidential and Proprietary
4.0 Circuit Design
4.1 Overview
The ZLR965324H Line Module consists of one Le9643 and one Le9653 Single Channel miSLIC
TM device, line
interface circuit, dedicated tracking VBAT supplies, and a host interface circuit for communication with the
Microsemi ZTAP platform. This chapter highlights some of the design considerations including component selection
and options.
4.2 Le9643 and Le9653 Devices
The Le9643 and Le9653 are members of the new miSLIC family of devices from Microsemi. They build on the
heritage of Legerity and Zarlink of developing programmable SLIC and SLAC devices for the worldwide markets.
Both devices provide complete BORSCHT functions for a single FXS port. It features enhanced functionality, lower
BOM cost, and greater power efficiency while maintaining software compatibility with the VE880 Series. Device-
level enhancements include the following:
• Direct MOSFET Driver
• Low Power Idle Mode (LPIM) with < 50 mW typical power consumption when FXS_LOW_PWR
termination type is used
• SPI Mode 0 and 3 support with no inter byte CS off time. Also supports the legacy MPI
interface
• ZSI Mode support for a smaller number of interface signals and less expensive isolation. This
mode is supported by most residential gateway SoCs.
• Supervision ADC for advanced testing, improved calibration and adaptive power management
The VP-API-II takes advantage of these and other enhancements in the Le9643 and Le9653 and offer greater
programmability and more efficient operation.
Please refer to the Le9643 and Le9653 Single Channel miSLIC Device Data Sheets for more details about this
device.
Figure 29, “ZLR964324H Line Module Schematic” on page 43 shows the Le9643 and associated components. The
designer should note the following changes from previous -based designs:VE880
•Le9643 and Le9653 do not have separate ground pins. All ground is routed through the metal
ePAD, which is also used for thermal heat dissipation
• RREF1 must be a precision 0.5% 25ppm resistor (75.0 ) in order to meet the data sheet K
specifications. A 1% resistor maybe be used, but some device parameters may not meet the
data sheet specifications. Some parameters that would be affected would be VBAT, VOC,
ILA,VeriVoice Accuracy, etc.
• Note that a pull-up or pull-down at pin 10 (ZSI) is used to select the mode of communication
with the host processor, PCM/SPI or ZSI. The ZLR965324H module does not support ZSI
mode. This design uses PCM/SPI mode, ZSI pulled up. If ZSI mode is desired, the ZSI pin
should be pulled to ground with a 10Kohm resistor. Only a single device is supported when in
ZSI mode. The ZLR965324H module is not configured to support ZSI mode.
ZLR965324H Line Module User Guide
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Microsemi Confidential and Proprietary
4.3 Line Interface Circuit
Figure 3 below shows the ZLR965324H’s line interface circuit. The complete circuit is shown in Figure 29 on
page 43 .
Figure 3 - ZLR965324H Le9643 Line Interface Circuit
4.3.1 Surge Protection
The ZLR965324H Line Module design has series current limiting and shunt voltage limiting for lightning and surge
protection as shown in “ZLR965324H Le9643 Line Interface Circuit” on page 13. This protection design uses
Positive Temperature Coefficient (PTC) thermistor devices to limit surge current. The purpose of the PTC is to
provide overcurrent protection during a power cross event. During a typical transient surge (i.e. due to a lighting
strike), the PTC simply acts like a low-value resistor limiting the surge current to a manageable level. In the event of
a power cross, the PTC behaves like a fuse. Since a power cross is a long term event, the PTC will heat up and
transition from a low resistance to a high resistance. After the event has been cleared, the PTC will return to a low
resistance value once again, assuming the ratings of the PTC have not been exceeded.
Voltage limiting is provided by Bourns TISP61089BDR SLIC Programmable Overvoltage Protector or equivalent.
This device provides a voltage clamp that is triggered by voltages slightly more negative than V
BATH. This
protection scheme protects both the Tip and Ring leads of the surged channel, limiting the voltage applied to either
the TIPD or RINGD pins of the device.
Overcurrent protection is provided by the Bourns MF-SD013/250 dual PTC devices (or equivalent) which ramp to a
high impedance value once the threshold current has been exceeded. Below this threshold current, the devices act
as nominal 7 resistors. The hold current at 23C is 0.13 A. The MF-SD013/250 is a dual PTC that uses a polymer
technology. Other PTC options are available such as single polymer PTCs and single or dual ceramic PTCs with
nominal resistance of up to 50 ohms. Be aware that the effective resistance of ceramic PTCs is considerably less in
the presence of fast-edged transients. Also, note that higher values PTCs will limit the maximum available ringing
A
A
B
B
C
C
D
D
E
E
4 4
3 3
2 2
1 1
NOTES
- Exposed pad on the Le9643 must be connected
through via holes to both top and bottom layer copper
and connected to a GND plane.
Locate CVDx next to DVDD, and CVAx next t o AVDD pins.
ALL GROUNDS ARE VIA THE EPAD
- See Le9643 data sheet for recommended PCB footprint.
0603
0805
1206
1206
0603
0603
0603
06030603
0603
0603
0603
75K 0.5% 25ppm required to meet data sheet limits.
75K 1% 100ppm acceptable, wit h reduced device accuracy.
VDHPI is typically 3.3V
but can be as low as 1.8V
depending on interface logic levels.
Tie ZSI_N to VDDHPI
to enable MPI mode, tie
low with 10K pulldown
for ZSI mode .
VDDSW s hould be +5V +/- 5%
+5.5V Absolute Maximum
0402
0402
0402
PTIP1
PRING1
VDDSW
VBAT1
AGND
3.3V
SWOUTY1
VBSENSE1
SWISY1
PCLK
DRA
FS
DXA
VSW
DCLK
DIN
CS0_N
DOUT
INT0_N
VDDHPI
VDDSW
AGND
3.3V
AGND
3.3V
AGND
3.3V
AGND
AGND
AGND
VBAT1
3.3VA1
3.3VA1
AGND
VBAT1
AGND
AGND
VSW
VDDHPI
VSW
VDDHPI
VDDHPI
VDDHPI
AGND
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CHL1 4.7uF
6.3V
RV1 2R0
5%
PTC1
MF-SD013/250
1 2
3 4
CRD1
10nF
100V
CCMP1 1.8nF
16V
SK1
TA-250-6
2
4
1
3
5
6
CTD1
10nF
100V
CVD1
0.01uF
16V
CV2
1uF
6.3V
Digital
Interface
Tip/Ring
Interface
POWER
N/C Do
Not Route
GROUND
Analog
Settings
Switcher Control
U1
miSLIC
Le9643
VBAT 1
23
RSN1 24
RTV1 26
IHL1 28
TAC1
29
RAC1
30
TDC1
31
RDC1
32
LFC1 33
IREF 17
VREF 27
SWVSY
34
SWISY
36
SWCMPY
35
SWOUT Y
3
DVDD1
2
FS_ZSYNC 4
DXA_ZMISO 5
PCLK_ZCLK 7
VDDHPI
9
RSVD18
18
RSVD_INT_N 11
RSVD_ZSI_N 10
RSVD_DCLK 12
VDDSW
1
RSVD_DIN 13
RSVD_DOUT 14
RSVD_CS_N 15
RSVD19
19
RSVD_VS/IO 16
RSVD20
20
DVDD1V2
8
RINGD1
21
TIPD1
22
ePAD_GND
37
AVDD1
25
DRA_ZMOSI 6
RCMP1 1Me g 1%
RTAC1 10K
1%
RT1
47.5K
1%
RRAC1 10K
1%
CV1
4.7uF
6.3V
C1V2_1
0.1uF
16V
CREF1
1uF
6.3V
C5V1
0.1uF
16V
RRDC1 1Meg
1%
RREF1 75K
0.5%
RVP1
0R
U3
TISP61089BD
K1a 1
G2
NC 3
K2a 4
K2b
5A2
6A1
7K1b
8
CBAT1
10nF
100V
CTAC1 10nF
100V
CLFC1 4.7uF
6.3V
CVHPI1
0.01uF
16V
RVS1 1Meg
1%
RTDC1 1Meg
1%
CVA1
0.1uF
16V
CVP1
0.1uF
100V
RS1
1Meg
1%
CRAC1 10nF
100V
ZLR965324H Line Module User Guide
14
Microsemi Confidential and Proprietary
voltage. AC coefficients should take the PTC resistances into account or performance may not be as expected.
Microsemi has standard coefficients available for various PTC values
Resistor RVPx on the TISP61089x gate is used in conjunction with CVPx to introduce phase delay to assist with
power cross protection. This resistor is 0ohms for most designs. For full tracking designs that will utilize the full
150V supply range of the device, RVPx should be 4.7K 5% 0603. CVPx is always required.
The protection solution provided by the Microsemi reference design is suitable for environments with relatively low
surge activity such as intra-building applications defined in Telcordia GR-1089-CORE. This design is also suitable
for ITU-T K.21 requirements. Contact Microsemi Customer Applications if higher protection levels such as Telcordia
GR-1089-CORE inter-building protection is required.
4.4 Le9643 90V Inverting Boost Power Supply
The Inverting Boost topology is basically a boost converter power stage with a charge pump inverter on the output.
The Inverting Boost battery supply for Le9643 has been optimized for the lowest possible cost while maintaining
good efficiency and power capability. On a 2 layer PCB with all components on the top side, the supply only
requires 0.38 sq2/2.4 cm2.
Inverting Boost uses an N-channel MOSFET switching at up to 300kHz to produce battery voltages up to -90V. The
device has an internal clamp that will not allow battery voltage to exceed the allowed limit. This is intended to
protect the MOSFET from overvoltage. The Nch MOSFET is specified as a logic level 100V rated device in a small
SOT23 or SOT6 package. Larger packages such as SOT223 or SO8 can be used but are not necessary for typical
commercial applications.
The supply operate in three configurable power modes to optimize efficiency and power capability. When in the Low
Power Idle state the supply operates at 48kHz. When in the Active state the supply frequency changes to a duty
cycle limited 300kHz. Ringing state is also 300kHz but with duty cycle maximized to allow maximum power
capability.
Inverting Boost can be used with input voltages as low as 4.5V. An alternate BOM and device profile is required to
optimize the supply for the lower input voltage.
Figure 4 - ZLR965324H 90V Inverting Boost Switching Regulator
SWOUTY1
VBAT1
SWISY1
VBSENSE1
VBAT
VSW
AGND
AGND
AGND AGND
DNP
VSW = 12V (10V - 14V)
MAXIMUM VBAT = -90V
100V
DIODES
SOT6
ALT
0402 0402 0402 0402 0402
Note 2
DNP
1206
CFLA2
0.1uF
0805
100V
RLM2
1R0
RG1
10R
0402
RLM1
1R0
RSNB1
100R 5%
CSW1
4.7uF
0805
25V
CPF1
0.1uF
0805
100V
L1
10uH
1.9A
RCS1
2.74K
CSNB1
220pF
100V
0603
DSW5
ES1D
AK
CFLA1
0.1uF
0805
100VDSW3
BAV23C
1
3
2
RDS1
2R
0603
RLM5
1R0
CPF2
0.1uF
0805
100V
RDS2
2R
0603
CFLA3
0.1uF
0805
100V
RG3
10K
DSW1
BAV23C
1
3
2
CBH1
0.22uF 100V
0805
RPF1
20R
0805
X3
Si1480DH
3
4
1 2 5 6
RLM3
1R0
CCS1
220pF
50V
RTH1
1K
X1
DMN10H220LE SOT23
1
2
3
RLM4
1R0
ZLR965324H Line Module User Guide
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Microsemi Confidential and Proprietary
• NIC NPIS63LS100MTRF, Isat=2.04A
It should be noted that not all inductors are suitable for switching power supplies. This particularly applies to toroid
style choke inductors that are intended for filtering applications. These types of inductors have high core losses that
can result in excessive heating of the core. This results in poor supply efficiency and over time can result in
catastrophic failure of the inductor.
4.4.4 Current Sense, RLIM
Resistors RLIM1,2,3,4,5 implement a low cost 0.20ohm current sense resistor. The resistors are 1ohm 5% 0402 type.
The combination of RLIM1,2,3,4,5, RCS1, and RTH1 set the cycle-by-cycle current limit threshold for the SWIS pin.
In this case, the threshold is set to a value near the current rating of the inductor, 1.9A. If peak inductor current
reaches 1.9A the current switcher cycle is terminated preventing the inductor for becoming saturated and protecting
the power transistor. It is not recommended to change the values of the resistors. Capacitor CCS1 is used to filter
excess noise from reaching the SWIS pin. High noise in the SWIS path can result in poor switcher stability.
Components RCS1, CCS1, and RTH1 should be placed near the device SWIS pin.
4.4.5 Rectifiers
To minimize costs, output rectifier DSW1 has been chosen to be BAV23C type dual diode. BAV23C (common
cathode) is a 200V dual small signal diode in a SOT23 package. 2 ohm 0603 resistors, RS1 and RS2, are placed in
series with each diode to help the diodes evenly share current and also to limit peak currents to acceptable levels.
This configuration does not require any more PCB space than a typical ES1D SMA rectifier that would have
normally been used. A BAV23A common anode version can also be used as long as it is ensured that the diode
direction is kept the same, anode toward the output. The BAV23C was specifically chosen for its high surge current
ratings relative to other small signal diodes. Devices used in this application should have equivalent specifications
to the recommended BAV23C devices. DSW3 can also be an ES1C/ES1D if desired. In this case RS1 and RS2 are
not required.
Rectifier DSW3 is also shown as a BAV23C. In applications where ringing requirements are not more than 60Vrms
and 3REN, a BAV23C is acceptable. If 60Vrms with REN loads > 3REN then DSW5, ES1C/ES1D type ultra-fast
recovery rectifier, should be used instead. But, also note that Le9643 is not rated to drive more than 3REN at
60Vrms. There is a power penalty for using the BAV23C instead of ES1C/ES1D due to their higher losses.
Althought the standard design meets the CoC V6 requirement of 900mW, additional power savings can be
achieved by used standard ultra-fast 1A rectifiers instead of the BAV23C.
Recommended BAV23C sources:
Diodes Inc. BAV23C-7-F
NXP (Nexperia) BAV23C.215
On Semi BAV23CL
Fairchild BAV23C
4.4.6 -90V Inverting Boost Compatibility with xDSL
Switching power supplies are inherently noisy and the Inverting Boost switching regulator is no exception. The drain
node of the MOSFET will have high dv/dt signals with a voltage swing up to 90 V at a frequency of up to 300 kHz.
Placing the switcher in close proximity of a DSL AFE can and most likely will cause degraded performance of the
DSL interface. It is therefore extremely important that the PNP, inductor, and associated circuitry be placed at least
one inch (2.5 cm) away from any DSL AFE signals. On two layer PCBs it is important to pay attention to ground
continuity and ground return paths for the high peak currents of the power supply. These currents should not flow
though the same ground that is also being used to shield DSL AFE signals.
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4.4.7 -90V Inverting Boost Low Input Voltage Option, 4.5V to 6V
The Inverting Boost supply can support operation from nominal 5V supplies. The supply can support up to 3REN
loads from a 4.75V input.. Referring to Figure 4, circuit changes are required for the Inverting Boost supply to
operate at low input voltage. A modified device profile is also required.
• Inductor L1 changes to 3.3uH 4.5A
• RLIM1-5 also must change to a 0.05 ohm 2% 0603 resistor
• Current sense changes: RCS1 = 1.5K, RTH1 = 2K
If the system normally operates from a 12V input but requires battery backup support, miSLIC device profiles can
also include a battery back up profile to optimize switching parameters. This option is supported by VP-API II, but a
device profile that includes battery back paramters is required.
4.5 Le9653 135V (HV) Inverting Boost Power Supply
The Inverting Boost topology is basically a boost converter power stage with a charge pump inverter on the output.
The Inverting Boost battery supply for Le9653 has been optimized for the lowest possible cost while maintaining
good efficiency and high power capability.
Inverting Boost uses an N-channel MOSFET switching at up to 300kHz to produce battery voltages up to -135V.
The device has an internal clamp that is defined by the device profile to limit the maximum output voltage. This is
intended to protect the MOSFET from overvoltage. The Nch MOSFET is specified as a logic level 150V rated
device in a SOT223. Other packages such as DPAK or S08 can be used but are not necessary for typical
commercial applications. The 135V Inverting Boost design on the ZLR965324H module is double footprint for
SOT223 and DPAK MOSFETs.
The design can support a maximum of 150V VBAT if 200V MOSFETs are used. Performance with 200V MOSFETs
will be degraded due to the high RDS(on) and gate charge (Qg) of available 200V MOSFETs. For this reason
minimum input voltage with 200V MOSFETs is 9V.
The supply operates in three configurable power modes to optimize efficiency and power capability. When in the
Low Power Idle state the supply operates at 24kHz. When in the Active state the supply frequency changes to a
duty cycle limited 300kHz. Ringing state is also 300kHz but with increased duty cycle.
The 135V Inverting Boost can be used with input voltages as low as 4.5V. Reduced power output should be
expected when operating at low input voltage. An alternate device profile is required to optimize the supply for the
lower input voltage. Additional filtering may also be required due to the lower switching frequency required for low
input voltage operation.
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Figure 5 - ZLR965324H 135V Inverting Boost Switching Regulator
4.5.1 Capacitor/Filter Requirement
The Inverting Boost uses a simple PI type output filter comprising of CFL2, CFL3 (DNP), RPF2, and CPF3. The
primary output filter capacitor, CFL2, is a single 0.22uF 200V/250V X5R/X7R 1210 ceramic type. An additional RC
post filter is used where RPF2 is 20ohms and CPF3 is another 0.22uF ceramic. CFL3 is a place holder for an
addtional 0.22uF 200/250V capacitor in case additional filtering is required.
4.5.2 MOSFET Requirements
The MOSFET requirements for the Le9653 135V Inverting Boost switcher design are:
• Type: N-Channel, Logic Level (VGS: 4.5 V) MOSFET
• Drain-Source Voltage Rating, VDSS: 150 V
• Static Drain-Source On-Resistance, RDS(on): <250 mrecommended
• Total Gate Charge QG(total) at VGS = 4.5 V: <8 nC recommended
• Suitable Packages: SOT-223, SO8, DPAK
Please note that RDS(on) (MOSFET on state drain to source resistance) and gate charge impact overall supply
efficiency. Higher RDS(on) will result in higher power dissipation while the MOSFET is conducting. Gate charge is the
measure of how much current vs time that is needed to turn the MOSFET on. A higher gate charge MOSFET will
take longer to turn on/off for the same amount of driver current. Therefore gate charge losses are noticed during the
on and off transition of the MOSFET. These losses become higher with increased switching frequency. Typically
there is a trade off between RDS(on) and QG
. Higher RDS(on) devices will have lower gate charge and vise versa,
although newer devices have been successful at reducing both. Higher R
DS(on) MOSFETs up to 500 m may be
used, but ringing limitations should be expected due additional MOSFET losses
The ZLR965324H layout supports both SOT223 and DPAK MOSFETpackages.
Recommended 150V SOT223 MOSFETs:
• Diodes DMN15H310LE
SWOUTY2
VBSENSE2
VBAT2
SWISY2
VBAT2
VSW
AGND
AGND
AGND
AGND
0402 0402
0402
VSW = 12V (9V - 14V)
DNP
Place Near Device
DNP
DNP CPF3
0.22uF
1210
200V
CSW2
10uF
1206
25V
RG2
10R
0402
CCS2
220pF
50V
CFL2
0.22uF
1210
200V
L2
4.7uH
4A
DSW4
ES1D
AK
G
D2D1
S
X2
DMN15H310SE
SOT223
DSW2
ES1D
AK
RLIM2
0.025R
1/4W
1206
2%
X4
STD5N20L
DPAK
G
S
D
CBH2
0.22uF
200V
1210
RCS2
1K
RTH2
7.5K
RG4
10K
CFL3
0.22uF
1210
200V
RPF2
20R
1206
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• Fairchild FDT86246L
• A&O AOH3254
• Sinopower SM1F15NSV
For designs requiring 140Vpk ringing, MOSFETs must be rated 200V rated. For 12V systems, 200V MOSFETs will
support most ringing requirements, but operation below 9V input will result in reduced power output.
Recommended 200V DPAK MOSFETs:
• ST STD5N20L
• Diodes ZXMN20B28K
• Fairchild FQD7N20L
• Cystek MTD300N20J3
4.5.3 MOSFET Driver
The Le9643 and Le9653 SWOUT pin is capable of directly driving a Logic Level Nch MOSFET. The VDDSW, pin 1,
is the power pin for the driver circuit. For MOSFET based power supplies, VDDSW requires a 5V (5.5V Absolute
Maximum) power source. The 5V current requirement is very low, typically less than 2ma. The current can be
estimated by multiplying the MOSFET total gate charge (at 4.5V Vgs) times the switching frequency. For example,
the MOSFET used on the 135V Inverting Boost circuit has a typical Qg of 5nC. The Inverting Boost maximum
switching frequency is 300Khz. There is also some current due to the 10K gate pull down resistor.
IVDDSW= ((5 x 10-9) x 300000) + (5V/10K x D); where D is duty cycle which is load dependant.
IVDDSW = 1.75mA, assuming a 50% duty cycle.
Systems that do not have a 5V supply available can use one of the following low cost circuits to create a 5V supply
from a 12V input. The 5V supply does not have to be accurate, +/-10%. It should be greater than 4.5V, with an
absolute maximum of 5.5V.
Figure 6 - VDDSW Regulator Circuits
Circuit option A uses less power, only requiring 1.36ma to bias the zener diode. Circuit option B does not require an
extra transistor, but does require higher zener diode current, 5ma, since the resistor must also pass the VDDSW pin
current. For good voltage control, zener diodes that are specified at 5ma or less (Diodes BZX84B5V6 or equiv.) are
preferred. If 1N52xx type diodes are used, zener bias current may need to be increased since these are usually
specified at 20ma.
Circuit A can also be used in systems where battery backup is required, but for voltage stability at low input
voltages the zener should change to a MMSZ4690 type. These are rated at 50uA and allows VDDSW to be greater
than 4.5V at input voltages down to 5.5V. Also, for systems that do not need to go below 6V the 4.7K resistor could
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ZLR965324H Line Module User Guide
20
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be increase to 10K to reduce to zener bias current to 0.78mA. The VDDSW regulator circuit on the ZLR965324H
module is configured this way.
Circuit A could potentially power multiple devices. Circuit B can only support a single device with a low gate charge
MOSFET.
The ZLR965324H includes a jumper option, JVDDSW1, that allows either directly using the 5V supply (1-2) or
using the VDDSW regulator circuit (2-3) to provide the VDDSW supply. Do not confuse this jumper with jumper,
JVSW1, which selects either 12V (default) or 5V for the input to the Inverting Boost supplies.
4.5.4 Inductor Requirements
For typical applications, a 4.7 uH inductor with a 4 A saturation rating is recommended. If battery backup is
required, depending on the ringing requirement, a 3.3uH 7A rated inductor may be requried. Note that the
current sense threshold should be appropriate to the inductor.
Example Inductors for 12V applications:
• Bourns SRN6045-4R7M, Isat=4 A
• Taiyo Yuden NR6045T 4R5M, 4.5 uH, Isat=4 A (4.5uH is ok to use)
• NIC NPIS65LS4R7MTRF, Isat = 4.97A
It should be noted the not all inductors are suitable for switching power supplies. This particularly applies to toroid
style choke inductors that are intended for filtering applications. These types of inductors have high core losses that
can result in excessive heating of the core. This results in poor supply efficiency and over time can result in
catastrophic failure of the inductor.
4.5.5 Output Rectifier
Rectifiers, DSW2 and DSW4 are specified be an ES1D type 1 amp ultra-fast recovery rectifier. Other rectifiers may
be used but they should be rated for 1 amp and have a reverse recovery time, trr, of 50ns or less.
4.5.6 Current Sense, RLIM
The 135V Inverting Boost uses a 25milliohm current sense resistor, RLIM2. The voltage across this resistor is
monitored by the device on a cycle-by-cycle basis to determine inductor current. The actual current limit value is
set by RLIM and resistors RCS2 and RTH2.
The current limit threshold is defined by the equation:
ILIM= 0.1 V*(RCS+RTH/RTH*RLIM)
The parallel (thevenin) value of RCS and RTH should be close to Kohm to maintain good high frequency filtering 1
with CCS, which is typically 220 pF.
4.5.7 Pump Capacitor, CBHx
Capacitor CBH2 is part of the charge pump level shift circuit. This capacitor stores the energy from the inductor
before it is transferred to the output. The value of this capacitor is critical to good supply performance. The
recommended CBH2 capacitor for the HV Inverting Boost is 0.22uF 200/250V 1210 X5R/X7R.
4.5.8 Compatibility with xDSL
Switching power supplies are inherently noisy. The drain node of the HV Inverting Boost MOSFET will have high dv/
dt signals with a voltage swing up to 150 V at a frequency of up to 300 kHz. Placing the switcher in close proximity
of a DSL AFE can and most likely will cause degraded performance of the DSL interface. It is therefore extremely
important that the MOSFET, inductor, and associated circuitry be placed at least one inch (2.5 cm) away from any
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DSL AFE signals. On two layer PCBs it is important to pay attention to ground continuity and ground return paths
for the high peak currents of the power supply. These currents should not flow though the same ground that is also
being used to shield DSL AFE signals.
4.5.9 Battery Backup Option, 5.5V to 9V
The 135V Inverting Boost supply can support battery backup operation. The supply can support up to 5REN loads
from a 5.5V input.. Referring to Figure 5, circuit changes are required for the Inverting Boost supply to operate at
low input voltage. A modified device profile is also required.
• Inductor L1 changes to 3.3uH 7A DCR<20 milliohms (Example:Bourns SRN8040TA-3R3Y)
• Current sense changes: RCS1 = 1K, RTH1 = 2K
If the system requires battery backup support, miSLIC device profiles can also include a battery back up profile to
optimize switching parameters. This option is supported by VP-API II, but a device profile that includes battery
back paramters is required.
4.6 Adaptive Ringing
miSLIC designs support an optional Adaptive Ringing feature. This feature is useful for designs that desire to limit
the maximum amount of current drawn from the VSW supply. The feature would generally be used with a power
limited device profile. A power limited profile limits the headroom of the power supply to prevent unwanted high
current surges during normal operation. The VP-API II option command below is an example:
api so 100 -d VP_DEVICE_OPTION_ID_ADAPTIVE_RINGING 40 83 VP_ADAPT_RING_FULL_TRACKER
By applying the adaptive ringing option above, a miSLIC design can support 60Vrms ringing for ringing loads up to
3REN, then fall back to 50Vrms for ringing loads that exceed 3REN.
In the case of the Le9643, the device is rated to support a maximum of 60Vrms at 3REN. With the Adaptive Ringing
option, if a 5REN load is applied, ring voltage can fall back to a 50Vrms level. This would prevent false ringing trips
in the event of an excessive REN load. The first ringing cycle starts out at the lower value for a few cycles then
steps up to the higher value if reshhold. Following cycles ring normally.the load does not excees the th
Figure 7 - Adaptive Ringing
Referring to Figure 7 above: Red trace is Vtip/ring; Yellow trace is tracking VBAT.
4.7 Voltage Sense, Switcher Optimization and Power Measurement
The Le9643 has the ability of measuring the switcher input voltage VSW. A 1.0 M1% resistor is connected to
between VSW and the pin I/O/VS which can be configured as an analog sense input. This allows the system to
ZLR965324H Line Module User Guide
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monitor VSW and make switcher optimizations based on its level. This can be valuable in case a back-up battery is
used. Furthermore, using VSW and the switching frequency and ON Time, real-time power usage may be
calculated.
4.8 Soft Start
miSLIC devices support an option for a soft start feature for bringing up the VBAT supplies without excessive inrush
current. Typically when a power supply starts up, it will try to bring up the output voltage as fast as possible. This
results in a short period of high input current that can sometimes create system issues if the input supply is
somewhat current limited. The soft start feature brings up the supply slowy with a limited power capability resulting
in low startup current. The Le9643 -90V Inverting Boost device profile includes this feature by default. The soft start
feature can be added to most designs that use API 2.25 or later. An updated device provile would be required.
ZLR965324H Line Module User Guide
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5.0 Module Configuration
5.1 Introduction
The ZLR965324H Line Module is programmed through the VoicePath Application Program Interface (VP-API-II).
This API hides the complexity of the device and its internal registers and provides a much simpler interface to the
software engineer. The VP-API-II software requires Profiles to initialize the AC, DC, signaling, supervision, host
interface, and switcher settings. Default Profile values are stored on Module ID ROM (MID) memory devices on the
line modules to enable “out-of-the box” operation. Most profiles can be easily modified using the Profile Wizard
software tool.
5.2 Module ID ROM (MID) Default Profiles
The MID on the ZLR965324HL uses the same AC, Tone, Cadence, and Caller ID Profiles for both devices. They
have different Device, DC, and Ringing Profiles, due to the different switcher topologies for each channel.
5.2.1 Device Profile
The Device Profile sets the PCM clock (PCLK or ZCLK) frequency, PCM transmit edge, transmit and receive clock
slots, and interrupt types and GPIO/sense pins. The device profile also selects the choice of 3.3V or 5V for the
VDDSW supply. Inverting Boost requires 5V for the VDDSW pin supply.
Channel 1, Le9643 with LV Inverting Boost, uses a 90V limited device profile.
Channel 2, Le9653 with HV Inverting Boost, uses a 135V device profile.
See Chapter 4 for design options and limitations.
5.2.2 AC Profile
Used for programming the transmission characteristics of the system, the AC Profile holds the programmable gain
and filter coefficient data.
The default AC Profile provides a 600 input and balance impedance with -6 dBr receive level and 0 dBr transmit.
It also takes into account the nominal 7 PTC series resistance per leg.
5.2.3 DC Profile
The DC Profile contains the parameters for the ZLR965324H Line Module to control supervision thresholds, DC
feed, and other switcher settings. It is not compatible with the DC Profiles that were used for the VE880 and VE890
due to new features in the miSLIC devices.
The MID settings for the DC Profile include an Open Circuit Voltage (VOC) of 48 V, an Active Mode Current Limit
(ILA) of 25 mA . The loop hook detection thresholds are 11 mA for the Active state and 22 V for the Low Power Idle
Mode state. The hook debounce time is 8 ms. The Ground Key detection threshold is 18 mA with 16 ms debounce.
5.2.4 Ringing Profile
The Le9643 Ringing Profile is set in the ZLR965324H MID to generate a 84.9 V
PK (60 VRMS) with no DC offset at
25 Hz. Ring trip is set to integrate over half-wave (AC only) with a ring trip threshold (R
TTH) of 21 mA. The ringing
current limit (ILR) set to 54 mA.
The Le9653 Ringing Profile is set in the ZLR965324H MID to generate a 88 V
PK (62 VRMS ) plus 20 VDC at 20 Hz.
Ring trip is set to integrate over half-wave (AC only) with a ring trip threshold (R
TTH) of 33 mA. The ringing current
limit (ILR) set to 76 mA.
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5.2.5 Tone Profile
The MID does not include any Tone Profiles.
5.2.6 Ringing Cadence Profile
The Ringing Cadence Profile sets the cadence that is associated with ringing. The default Mini-PBX ringing
cadence configuration is 2 second ON and 4 seconds OFF.
5.2.7 Tone Cadence Profile
The Tone Cadence Profile sets the cadence that is associated with call progress tones. These tones normally
include dial tone, ring back, busy, congestion and call waiting tones.The MID does not include any Tone Profiles.
5.2.8 Caller ID Profile
The Caller ID Profile sets the signaling that is used for on-hook and off-hook Caller ID. The MID does not include
any Caller ID Profiles.
5.3 Profiles Generated with Profile Wizard
As an alternative to using the default profiles that are provided on the MID, the user can create new ones or edit the
following profiles that are provided with the standard Profile Wizard distribution:
• ZLR965324HL_SM2_LITE_REV2_9.VPW
These files contain Device, AC, DC, and Ringing Profiles and are available for use with the VP-API-II Lite software.
Customers who execute a Software License Agreement (SLA) for the VP-API-II software will have access to the
following additional files as a part of the full VP-API-II license:
• ZLR965324HL_SM2_FULL_REV2_9.VPW
These files contain Device, AC, DC, Ringing, Tone, Cadence, and Caller ID for over 44 countries.
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5.3.1 Profile Wizard Menu
Figure 8 below shows the Main Menu of the Profile Wizard application with the ZLR965324HL project file loaded.
Please note that the Tone, Cadence and Caller ID require a license to the VP-API-II and are not available with the
VP-API-II Lite version.
Figure 8 - Profile Wizard Main Menu - ZLR965324HL Project File
Please refer to the Le9643 and Le9653 data sheets for more information about the settings of the various profiles.
Note that Microsemi has Profile examples for many countries.
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5.3.2 Reviewing and Editing Profile Entries
The user can edit any of the pr ponding item and can check the ones that he or she ofiles by clicking on the corres
needs for the project. As an example, Figure 9 shows the contents of the Ringing Profile. The user can change any
of the values, such as the ringing frequency, amplitude, DC bias, by simply typing them in the corresponding boxes
and pressing the “OK” button on the bottom.
Figure 9 - Ringing Profile Configuration Example
After saving the Profile data, the user should press the “Save and Generate” button on the left panel of the Main
Menu (Figure 8). This will generate new .c file with the selected profiles in the directory that is selected.
5.3.3 Running New Profiles
After completing the changes to Profile Wizard, the user should follow the following steps:
1. Start the MiToolkit application.
2. When MiToolkit starts up, it will display a list of applications. Run the Mini-PBX application.
3. When Mini-PBX starts, it will prompt for which serial port to use. If VP-Script is already running, Mini-PBX will
know what port is being used. Note that the ZTAP Support Package software installation includes a Virtual COM
Port Driver to support USB-to-serial UART interface on the ZTAP board.
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4. Double click on the location of the line module. It is DIN CS0 or CS1 on the example shown in Figure 10 below.
Figure 10 - Mini-PBX - Configuration Mode
5. After double clicking on the line module location, a new window will open as shown in Figure 11. The user
should click the “Browse” button and select the newly created .c Profile Wizard file.
Figure 11 - Mini-PBX - Device Configuration
After Mini-PBX loads the new profiles, it will use its values. For example, new ringing values created in Section
5.3.2, Reviewing and Editing Profile Entries, on page 26 will now take effect.
Produkt Specifikationer
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| Model: | LE9653 |
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